WO2004018584A1 - 接着性フィルム - Google Patents
接着性フィルム Download PDFInfo
- Publication number
- WO2004018584A1 WO2004018584A1 PCT/JP2003/010479 JP0310479W WO2004018584A1 WO 2004018584 A1 WO2004018584 A1 WO 2004018584A1 JP 0310479 W JP0310479 W JP 0310479W WO 2004018584 A1 WO2004018584 A1 WO 2004018584A1
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- WO
- WIPO (PCT)
- Prior art keywords
- adhesive film
- component
- adhesive
- ethylene
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0869—Acids or derivatives thereof
- C09J123/0884—Epoxide containing esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
- C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
Definitions
- the present invention relates to an adhesive film obtainable by molding a resin composition containing an epoxy group-containing copolymer and an ethylene / O!,] 3-unsaturated carboxylic anhydride copolymer.
- the adhesive before curing be in the form of a dry film, and an adhesive mainly composed of epoxy resin and curing agent Adhesive films in which the composition is formed into a film and the film is partially hardened (B-staged) by heating or the like are also commercially available.
- the present inventors studied the case where a B-staged epoxy resin adhesive film was used as an interlayer insulating layer on a printed wiring board (adherend) having copper wiring on a substrate. Specifically, when the adherend and the adhesive film are laminated and then heated and pressed to adhere, the resin component of the adhesive film flows out and protrudes from the adherend. Was revealed. If the adhesive film is further hardened and used to prevent the resin component from flowing out, the adhesive film cannot be adhered well in a state of being embedded in the unevenness between the copper wirings. However, it became clear that air bubbles were generated between the cured film and the adherend, resulting in poor adhesion.
- An object of the present invention is to provide an epoxy resin-containing adhesive film that has properties of being strong even when formed into a thin film, excellent in film processability, and excellent in storage stability before bonding, and a resin component in a bonding process.
- An object of the present invention is to provide an adhesive film which can adhere to an adherend without flowing out and can coat the adherend. It is still another object of the present invention to provide a method for storing the adhesive film and a laminate comprising the adhesive film and an adherend.
- the present invention relates to the following inventions.
- R represents an aliphatic hydrocarbon group having 2 to 18 carbon atoms having a carbon-carbon double bond, and at least one hydrogen atom of the aliphatic hydrocarbon group is a halogen atom, a hydroxyl group, Or X may represent a single bond or a carboxy group.
- Adhesive film A copolymer obtained by polymerizing component (b) with (b 1 ), (b 2 ), and at least one member selected from the group consisting of butyl ester and ⁇ -unsaturated carboxylic acid ester The adhesive film according to any one of ⁇ 1> to ⁇ 3>.
- ⁇ 8> The adhesive film according to any one of ⁇ 1> to ⁇ 7>, wherein the acceleration voltage of the electron beam is 50 to 300 kV.
- a method for storing an adhesive film comprising storing the adhesive film according to any one of ⁇ 1> to ⁇ 9> at a temperature of ⁇ 10 ° C. or lower.
- ⁇ 11> A laminate obtained by laminating the adhesive film according to any one of ⁇ 1> to ⁇ 9> and an adherend, and thermosetting the adhesive film.
- the resin composition of the present invention (hereinafter, referred to as the present composition) is characterized by containing the above-mentioned component (A) and component (B).
- the component (A) used in the present invention comprises (a,) ethylene and / or propylene (hereinafter referred to as propylene).
- R represents an aliphatic hydrocarbon group having 2 to 18 carbon atoms having a carbon-carbon double bond, and at least one hydrogen atom of the aliphatic hydrocarbon group is a halogen atom, a hydroxyl group, Or a carboxyl group.
- X represents a single bond or a carbonyl group.
- ethylene is particularly preferred.
- Examples of the substituent R in the general formula (1) include substituents represented by the following formulas (2) and (8).
- X in the formula (1) represents a single bond in which an oxygen atom and a substituent R in the formula (1) are directly bonded, or a carboxy group.
- (a 2) component Ryo Li glycidyl ether, 2-Mechiruariru glycidyl ether and styrene, - p - glycidyl ethers of unsaturated glycidyl ether and glycidyl ⁇ Tari rate, glycidyl methacrylate, and I itaconic acid glycidyl And unsaturated glycidyl esters such as esters.
- the content of the structural unit derived from the component (a 2 ) is as follows based on 100 parts by weight of the component (A). Usually, it is about 1 to 30 parts by weight. When the structural unit derived from the component (a 2 ) is at least 1 part by weight, the adhesiveness of the resulting adhesive film tends to be improved. It is preferable because the mechanical strength of the film tends to be improved.
- the component (A), (ai) component and (a 2) from component a different monomer may be polymerized with E styrene and copolymerizable monomer.
- the “monomer copolymerizable with ethylene” does not contain a functional group or an epoxy group that can react with an epoxy group such as a carboxy group or an acid anhydride group.
- the “monomer copolymerizable with ethylene” include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, t-butyl acrylate, and attaryl Alkyl groups having about 3 to 8 carbon atoms, such as isoptyl acid, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, t-butyl methacrylate, and isobutyl methacrylate Alkyl esters of ⁇ -unsaturated carboxylate; carboxylic acids having about 2 to 8 carbon atoms, such as vinyl acetate, vinyl butyrate, vinyl propionate, vinyl piperate, vinyl laurate, vinyl isononanoate, and vinyl versatate Butyl ester having carbon; 1-butene, isoto
- ⁇ -olefins of about 4 to 20; diene compounds such as butadiene, isoprene and cyclopentadiene; and bur compounds such as vinyl chloride, styrene, acrylonitrile, methacrylonitrile, acrylamide and methacrylamide.
- diene compounds such as butadiene, isoprene and cyclopentadiene
- bur compounds such as vinyl chloride, styrene, acrylonitrile, methacrylonitrile, acrylamide and methacrylamide.
- the “monomer copolymerizable with ethylene” among them, butyl acetate, methyl acrylate, ethyl acrylate, ⁇ -butyl acrylate and methyl methacrylate are preferred.
- the content of the structural unit derived from the “monomer copolymerizable with ethylene” in the component ( ⁇ ) is usually about 0 to 70 parts by weight based on 100 parts by weight of the component ( ⁇ ). In particular, about 5 to 60 parts by weight is preferable. When the content is 70 parts by weight or less, component (II) tends to be easily produced by a high-pressure radical method or the like, which is preferable.
- the component ( ⁇ ) is a block copolymer, a graft copolymer, or a random copolymer. Any of a copolymer and an alternating copolymer may be used. For example, a copolymer obtained by grafting (a 2 ) to a propylene / ethylene block copolymer described in Japanese Patent No. 2632980 And copolymers obtained by grafting an ⁇ , ⁇ monounsaturated carboxylic acid ester to an ethylene / epoxy group-containing monomer copolymer described in Japanese Patent No. 26020048.
- a monomer as a raw material is prepared by adding ethylene and a radical generator to a pressure of about 500 to 400 atm, 100 to 300 atm.
- a method of performing melt graft copolymerization in a machine is exemplified.
- the polyethylene resin is a homopolymer of ( ai ) or a copolymer of a monomer copolymerizable with ethylene and ( ai ).
- an MFR Melt-off rate
- the MFR is 30 or more, the flowability of the obtained adhesive film is improved, and even if there are four convex portions on the surface of the adherend, they tend to be easily embedded.
- a value of 100 or less is preferable because the solder heat resistance of a cured product of the obtained adhesive film tends to be improved.
- the component (B) used in the present invention includes (b x ) ethylene and / or propylene (hereinafter, referred to as (b a )), and (b 2 ) mono-unsaturated carboxylic anhydride (hereinafter, (b) 2 ) This is a copolymer obtained by polymerizing).
- ethylene is particularly preferable.
- Examples of (b 2 ) include maleic anhydride, itaconic anhydride, citraconic anhydride and the like.
- maleic anhydride is particularly preferable.
- a monomer used in the component (B) and in addition to (b 2) may create additional polymerized "ethylene monomer copolymerizable", as described in Ingredient (A).
- ethylene monomer copolymerizable as described in Ingredient (A).
- the "monomers copolymerizable with ethylene” butyl acetate, methyl acrylate, ethyl acrylate, n-butyl acrylate, and methyl methacrylate are preferred.
- the content of the structural unit derived from (b 2 ) and the content of the structural unit derived from the “monomer copolymerizable with ethylene” are usually:
- the structural unit derived from (b 2 ) is about 0.1 to 20 parts by weight, and the structural unit derived from “a monomer copolymerizable with ethylene” is about 0 to 50 parts by weight.
- the ring opening ratio of the acid anhydride group (-0-C0-0-) in the component (B) is usually about 1 to 50%, preferably about 10 to 40%. If the ring opening ratio is 50% or less, the storage stability of the resin composition comprising the component (B), the components (A) and (B), and the adhesive film of the present invention tends to be improved. It is more preferable because the film processability when processing the adhesive film from the resin composition tends to be improved. When the ring opening ratio is 1% or more, the curing speed of the adhesive film when the resin composition is irradiated with an electron beam and the curing speed when the adhesive film is heated and pressed tend to be improved. Is preferred. '
- the ring opening ratio in the present invention will be described.
- a steel plate (2 mm thickness) Z aluminum plate (200 ⁇ thickness) / fluororesin sheet (200 ⁇ thickness) / ( ⁇ ) component + polyethylene terephthalate sheet Formwork (500 ⁇ ) Prepare a laminate system consisting of fluororesin sheet (200 m thickness) / aluminum plate (200 ⁇ m thickness) / steel plate (2 mm thickness). After heating this laminated system at 150 ° C. and normal pressure for 2 minutes, it is heated at the same temperature under a pressure of 50 kg / cm 2 for 2 minutes.
- the absorbance [1] at 185 cm- 1 of the sample (1) derived from the component ( ⁇ ) having a thickness of 50 ⁇ recovered from the laminated system is measured.
- the component (B) + polyethylene terephthalate sheet mold (50 ⁇ m) means a state where the component (B) is placed in the hollow portion of the polyethylene terephthalate mold.
- the thickness of the sample (1) derived from the component (B) obtained after heating and pressurization is 50 ⁇ , which is the same as the thickness of the mold.
- the component ( ⁇ ) was heated at 230 ° C and normal pressure for 2 minutes in a laminated system having the same composition, and then 50 kg / cm 2 at the same temperature.
- the absorbance [2] is measured at 1850 cm- 1 for the sample (2) with a thickness of 50 ⁇ obtained by heating under pressure for 2 minutes.
- the ring opening ratio in the present invention is a value represented by [1] / [2] ⁇ 100 (%).
- the acid anhydride group was defined as described above because it absorbs light at a wavelength of 1850 cm- 1 .
- Examples of the method for producing the component (B) include a method in which (b 2 ) is subjected to daft polymerization on a polyethylene resin.
- the polyethylene resin used for the component (B) generally contains at least 50 mol% of a structural unit derived from (). Specific examples thereof include ethylene alone and ethylene / propylene copolymer. Copolymer, ethylene / 1-butene copolymer, ethylene • isobutylene copolymer, ethylene • butadiene copolymer, ethylene • 4-methyl-1-pentene copolymer, ethylene • isoprene copolymer, ethylene • butyl acetate Polymers, ethylene acrylate copolymers and the like.
- the MFR (melt flow rate) force S measured in accordance with JIS K7210 is usually 30 ° C. at 190 ° C. and 2.16 kg load, and is about L 000 g / 10 min. Those having a content of about 50 to 50 OgZlO are preferable.
- the MFR is 30 or more, the kneading temperature at the time of processing the adhesive film tends to decrease, and the fluidity of the obtained adhesive film is improved; Even if there is, it is preferable because it can be easily embedded. A value of 1000 or less is preferable because the solder heat resistance of the obtained adhesive film tends to be improved.
- component (B) It is generally recommended to use component (B) immediately after production or stored for up to about two weeks after the container storing component (B) has been opened to absorb moisture. If the component (B) is stored for 2 weeks or less after it has absorbed moisture, the ring-opening ratio of the component (B) is usually 1 to 50%, and the thermosetting resin composition is used as a filler. It is preferable because the fluidity (film processability) and storage stability during the lumber processing tend to be improved.
- the film processability can be improved.
- the storage stability of the adhesive film is improved.
- production The subsequent component (B) may be heat-treated.
- the component (B) is usually heated to 200 ° C. to 250 ° C. using a single-screw or twin-screw screw extruder, a bread pallet mixer, a roll, various kneaders, or the like. A method of melting and kneading at about ° C is fisted.
- the component (B) is commercially available and includes, for example, “Bondane (registered trademark)” series (manufactured by Sumika Atofina), “Letasupanore ET” series (manufactured by Nippon Polio Refin Co., Ltd.) and the like. Commercially available ones can be used.
- the present composition contains the component (A) and the component (B) thus obtained. Among them, those obtained by melt-kneading the component (A) and those containing the component (B) are preferable. Particularly, those obtained by melt-kneading the component (A) and the component (B) are mixed. Those obtained by kneading are preferred.
- the component (B) is usually used in an amount of about 20 to 50 parts by weight based on 100 parts by weight of the component (A). If the component (B) is more than 20 parts by weight, the solder heat resistance tends to be improved, and if it is less than 50 parts by weight, the strength of the film can be improved or the thickness of the film can be reduced. Workability tends to be improved. Further, it is preferable that the component (B) is 50 parts by weight or less, since the storage stability of the film tends to be improved.
- the composition contains (C) an antioxidant (hereinafter, referred to as a (C) component) in addition to the (A) and (B) components, thereby suppressing the occurrence of "fish eyes".
- a (C) component an antioxidant
- the component (C) examples include a phenolic antioxidant, a phosphorus-based antioxidant, a zeolite antioxidant, and an amine-based antioxidant. Two or more antioxidants may be used in combination as the antioxidant. Particularly, from the viewpoints of the gel prevention effect and the coloring, a phenol antioxidant, a phosphorus antioxidant, and an iodine antioxidant. It is preferred to use any of the agents.
- phenol-based antioxidants examples include 2,6-dibutyne 4-butyrene Noref eno nore, 2, 6—Gee t—Puchinore 1
- Tris (4-t-butyl-2,6-dimethyl-13-hydroxybenzyl) isocyanurate, 2,4-bis (n-octylthio) -6- (4-hydroxy-1,3,5-di-t —Putinoleanilino) _ 1,3,5-Triazine, tetrakis [methylene-13- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] methane ⁇ 2,2, -methylenebis (4-methyl-1-6-t 1,3-, 5-trimethylino 1,2,4,6-tris (3, '5-di-tert-butyl' 4-hydroxybenzyl) benzene, 3,9-bis [1, 1-Dimethyl-2- ⁇ - (3-t-butynole-1-hydroxy-5-methynolephenyl) propionyloxy ⁇ ethyl] -2,4,8,10-Tetraoxaspiro [5,5] pentade
- phenolic antioxidant a commercially available phenolic antioxidant may be used.
- examples of such a commercially available phenolic antioxidant include Irganox 1010 (manufactured by Chipa Specialty Chemical Chemicals). ), Irganox 1076 (Irganox 1076, manufactured by Ciba Specialty Chemicals), Ilga Knox 1330 (Irganox 1330, manufactured by Chipa Specialty Chemicals), Irganox 3114 (Irganox 3114, manufactured by Chipa Specialty Chemicals) , Irganox 3125 (Irganox 3125, manufactured by Chipa Specialty Chemicals), Sumilizer BHT (Sumilizer BHT, manufactured by Sumitomo Chemical), Xianox 1790 (Cyanox 1790, manufactured by Scitech), Sumilizer-1 GA—80 (Sumilizer GA-80, Tomo Chemical Co., Ltd.) and Vitamin E (Eisai Co., Ltd.).
- Irganox 1010 manufactured by
- phenolic acid inhibitor two or more phenolic antioxidants may be used.
- phosphorus antioxidants include trioctyl phosphite, trilauryl phosphite, tridecyl phosphite, (octyl) diphenyl phosphite, and tris (2,4-di-t-butylphenyl) phosphite Tris (nonylphenyl) phosphite, tris (nonylphenyl) phosphite, distearylpentaerythritol diphosphite, tetra (tridecinole) —1,1,3—tris (2-methylenolate) 5-t-butyl-14-hydroxypheninole) butanediphosphite, tetra- 2 -C5 mixed alkyl) 1.4,4,1-isopropylidenediphenyldiphosphite, tetra (tridecyl) 14, 4, monobutylidenebis (3-methyl-6_t-butyl
- bis (dianolequinolephenyl) pentaerythritol diphosphite ester is represented by the following general formula (9)
- RR 2 and R 3 each independently represent a hydrogen atom or an alkynole group having about 1 to 9 carbon atoms.
- R 4 , R 5 , and R 6 each independently represent a hydrogen atom or an alkyl group having about 1 to 9 carbon atoms.
- 1 to! ⁇ Is an alkyl group a branched alkyl group is preferable, and a t-butyl group is particularly preferable.
- the substitution position of 1 to! ⁇ 6 in the feninole group is preferably at the 2, 4, and 6 positions.
- phosphite esters include bis (2,4-di-t-butylphenyl) pentaerythritol / resin phosphite, and bis (2,6-di-t-butyltin) 4-bis (2,6-di-t-butylphenyl) (Methinolepheninole) pentaerythritol noresiphosphite, bis (noyulphenyl) pentaerythritol diphosphite, and the like.
- Examples of phosphonites having a structure in which carbon and phosphorus are directly bonded include tetrakis (2, 4-g-t-butylphenyl) -4,4, -biphenylenediphosphonate and other compounds.
- Irgafos 168 Irgafos 168, Chipa 'Specialty Chemicals
- Irgafos 12 Irgafos 12, Chipa Specialty Chemicals
- Irgafos 38 Irgafos 38, Ciba Specialty Chemicals
- ADK STAB 329K ADK STAB 329K, Asahi Denka
- ADK STAB PEP 36 ADK STAB PEP36, Asahi Denka
- ADK STAB PEP-8 ADK STAB PEP-8, Asahi Denka
- S andstab P-EPQ Clariant
- Weston 618 Weston 618, GE
- Weston 619G Weston 619G
- GE Ultranox 626
- Sumilizer GP Sumitomo Chemical
- phosphorus-based antioxidant two or more kinds of phosphorus-based antioxidants may be used.
- the phosphorus antioxidants tris (2,4-di-t-butylphenylphosphite), tetrakis (2,4-di-tert-butylphenyl) -4,4, -biphenylene diphosphonite, distearyl pentaerythr Ritonoresiphosphite, bis (2,4-di-t-butylphenyl) pentaerythritol diphosphite, 2-[ ⁇ 2,4,8,10-tetra-t-butyldibenz [d, f] [1 3.2.]-Dioxaphosphepin-1-6-yl ⁇ oxy] 1-N, N-bis [2-[ ⁇ 2,4,8,10-tetra-t-butyldibenz [d, f] [1 3.2.2] -Dioxaphosphophine-1-yl ⁇ eth
- zirconium-based antioxidants examples include dialkyl thiodipropionates such as dilaurinolate, dimyristyl, and distearyl, and butyl, octyl, and lactyl.
- Esters of polyhydric alcohols of alkylthiopropionic acids such as peryl- and stearyl (eg, glycerin, trimethicone-monoluethane, trimethicone-one-propane, pentaerythritol, 1, lishydroxicetyl isocyanurate) (eg, pentaerythryltetrakis) 1-3-laurylthiopropionate).
- dilaurylthiodipropionate dimyristylthiodipropionate, distearylthiodipropionate, laurylstearylthiodipropionate, distearylthiodibutyrate, and the like can be mentioned.
- pentaerythryltetrakis-3-laurylthiopropionate is preferred.
- zeo-based antioxidants for example, Sumilizer TPS (manufactured by Sumitomo Chemical), Sumilizer TPL-R (Surailizer TPL-R, manufactured by Sumitomo Chemical) And Sumilizer-TPM (Suniilizer TPM, manufactured by Sumitomo Chemical) and Sumilizer-TP-D (Surailizer TP-D, manufactured by Sumitomo Chemical).
- Two or more zeotype antioxidants may be used as zeotype antioxidants.
- amine type antioxidants include, for example, a polymer of 2,2,4-trimethyl-1,1,2-dihydroquinoline. , 6-ethoxy-2,2,4-trimethyl-1-1,2-dihydroquinoline, N— (1,3-dimethinolevbutinole) -1N, 1-Fe2,1,4-Fenylenediamine, N— Isopropyl-1-N, -phenyl-1,4-phenylenediamine and the like.
- the amount of the component (C) in the composition is usually about 0.05 to 2 parts by weight, preferably about 0.01 to 1 part by weight, based on 100 parts by weight of the component (A). More preferably, it is about 0.05 to 0.5 parts by weight.
- the component (A) is usually used at a temperature of 120 ° C. to 200 ° C. using a single-screw or twin-screw extruder, a bread pallet mixer, a roll, various kneaders, or the like. Melting and kneading at about C and mixing the component (B).
- the melt-kneading temperature is in the range of 120 to 200 ° C., since the “fisheye” of the adhesive film tends to be reduced.
- the component (C) is melt-kneaded together with the component (A).
- thermosetting resin of the present invention additives such as coloring agents, inorganic fillers, processing stabilizers, weathering agents, heat stabilizers, light stabilizers, nucleating agents, lubricants, mold release agents, flame retardants, and antistatic agents are added to the thermosetting resin of the present invention. It may be included in the composition.
- the adhesive film of the present invention is a film obtained by extruding the thus obtained present composition and then irradiating the composition with an electron beam.
- the method will be described. For example, a method of melt-kneading a film of a resin composition using an extruder equipped with a T-die or the like may be used.
- the distance (air gap) between the T-die and the chill roll is usually about 10 cm or less, preferably about 8 cm or less, and particularly preferably about 6 cm or less.
- An air gap of 10 cm or less is preferable because the state of film breakage and a state in which the thickness of the film generally called “single-walled” varies tends to be suppressed.
- the melt-kneading temperature in the extrusion molding method is preferably equal to or higher than the melting temperature of the resin to be used and is equal to or lower than about 120 ° C, and more preferably, about 90 ° C to 110 ° C. It is suitable. It is preferable that the melt-kneading temperature be 120 ° C. or lower, since the “fish eye” of the obtained adhesive film tends to be reduced.
- the thickness of the adhesive film is generally about 5 ⁇ to 2 ⁇ , preferably 8 ⁇ ! ⁇ 1 mm.
- the resin composition may be laminated on the support base material or co-extruded with the support base material and the resin composition.
- the supporting substrate is preferably one that allows the adhesive film to be easily peeled off even after curing.
- a film composed of a 4-methyl-11-pentene copolymer, a film composed of cellulose acetate, and a layer composed of a luster composition Polyethylene terephthalate film coated with a silicone release agent on the surface in contact with.
- the electron beam used in the present invention is a bundle of electrons accelerated by a voltage
- the present invention is classified into a low energy type that accelerates with a voltage of about 00 kV, a medium energy type that accelerates with a voltage of about 300 to 5000 kV, and a high energy type that accelerates with a voltage of about 5000 to 10,000 kV.
- a low energy type electron beam is used.
- Examples of the electron accelerator include a linear force sword type, a module force sword type, a thin plate force sword type, and a low energy scanning type.
- the method for producing the present adhesive film includes, for example, irradiating only one side of the film obtained by extrusion molding with an electron beam under an atmosphere of an inert gas such as nitrogen, which is not covered with a supporting substrate.
- an inert gas such as nitrogen
- the surface covered with the supporting substrate may be irradiated with an electron beam.
- a method of irradiating one or both surfaces with an electron beam by peeling the supporting substrate, and a method of peeling the supporting substrate and preliminarily laminating on an adherend to be described later and then irradiating with an electron beam, etc. Examples are shown.
- the irradiation dose of the electron beam is usually about 10 to 300 kGy, preferably about 50 to 100 kGy.
- the irradiation dose is at least 10 kGy, the effect of concealing the adherend surface when the film is rolled at the time of heat bonding and thermosetting tends to be improved.
- the case of y or less is preferable because the adhesive film is embedded in the four convexes of the adherend and the adhesiveness tends to be improved.
- the adhesive film thus obtained has very little wrinkling even when it is stored at about room temperature and then adhered to the adherend with the film. In other words, the storage stability is excellent, even after storage at room temperature. Further, when the storage temperature is lower than ⁇ 10 ° C., the storage stability is further improved.
- the laminate of the present invention (hereinafter referred to as the present laminate) is obtained by laminating an adherend on a layer composed of the present adhesive film and curing the present adhesive film.
- the production methods include: 1) a method of laminating an adherend on the present adhesive film and thermosetting; 2) laminating the adherend on the present adhesive film, And a method of laminating adherends different from those described above and thermally curing the adherends.
- the production method is as follows: 3) a method of laminating an adherend on the present adhesive film, thermosetting, and then removing the supporting substrate; 4) the present adhesive film To the adherend Laminating, peeling off the supporting substrate, and thermosetting; 5) Laminating the adherend on the adhesive film, peeling off the supporting substrate, and bonding an adherend different from the adherend And a method of thermosetting.
- thermosetting conditions for producing the laminate are usually about 140 ° C. to 300 ° C., preferably about 160 ° C. to 200 ° C. for about 10 minutes to 3 minutes. Heat cures for about an hour. It is preferable that the temperature of the thermosetting resin be 140 ° C. or higher, since the thermosetting time until the solder heat resistance is obtained tends to be shortened, and the adhesive film is 300 ° C. or lower. This is preferable since the decomposition of the compound tends to be suppressed.
- thermosetting it may be heated and pressurized at 0 to 3 MPa using a press machine.
- the material of the adherend used in the present laminate is, for example, a material that can adhere to the adhesive film of the present invention.
- metals such as gold, silver, copper, iron, tin, lead, aluminum, and silicon; inorganic materials such as glass and ceramics; cellulose-based polymer materials such as paper and cloth; melamine-based resins; Acrylic 'urethane resin, urethane resin, (meth) acrylic resin, styrene' Atallonitrile copolymer, polycarbonate resin, phenol resin, alkyd resin, epoxy resin, silicone resin, etc. Materials and the like.
- the materials forming the two adherends may be different types of materials of the same type. Any of the materials may be used.
- the properties of the adherend are not particularly limited, and examples thereof include a film, a sheet, a plate, and a fiber.
- the adherend may be, if necessary, coated with a release agent, paint, etc., coated with a paint made of a resin composition other than this composition, surface modified with plasma or laser, surface oxidation, Surface treatment such as etching may be performed.
- the MFR (melt flow rate) is a value measured under the conditions of 190 ° C and a load of 2160 g according to JIS-K7210.
- the following copolymer was mixed and used as the component (A).
- A-1 Ethylene 'methacrylic acid', lithi, alcopolymer (E 'manufactured by Sumitomo Chemical Co., Ltd.
- A-2 In addition to the same weight of ethylene-methacrylic acid “Rishishi,” copolymer of C-1 to C-13, carbon black (MA 600 (manufactured by Mitsubishi Chemical Corporation) 5. 3 parts dry-blended and melt-kneaded in the same manner as A-1
- the following copolymer was mixed and used as the component (B).
- the temperature of the extruder cylinder, the temperature of the die were set to 100 ° C, and the air gap was set to 2 cm using a Raho, manufactured by Toyo Seiki Co., Ltd., 'Last Mill', 20 extruder, and a single die. Subsequently, the resin composition obtained by dry blending at the weight ratio shown in Table 1 was released from the extruder using a PET film (“Emblet SC-38” manufactured by Unitika Ltd.) A two-layer film consisting of an adhesive film (thickness: 50 zm) and a release PET film (thickness: 38 ⁇ ) was prepared by melt extrusion on a release surface of 38 ⁇ ).
- the adhesive film having a thickness of about 50 ⁇ obtained in Production Example 1 above at 100 ° C, 3 MPa, After thermocompression bonding under the conditions of 10 minutes, thermosetting was performed under the conditions of 180 ° C, 3 MPa, and 60 minutes. During thermocompression bonding and thermosetting, the resin component of the adhesive film did not flow out of the adherend. Next, the laminate was obtained by peeling off the release PET film. The laminate was subjected to a copper wiring pattern embedding test shown below. The results are summarized in Table 1. ⁇ Wiring pattern embedding test>
- Production example 2 of adhesive film thickness 15 ⁇
- An adhesive film having a thickness of about 15 ⁇ was prepared according to Production Example 1, except that the resin composition obtained by dry blending at the weight ratios shown in Table 2 was used.
- a laminate was obtained in the same manner as in Production Example 1 except that an adhesive film having a thickness of about 15 ⁇ was used. During thermocompression bonding and thermosetting, the resin component of the adhesive film did not flow out of the adherend. The laminate was subjected to the following copper wiring concealment test.
- the adhesive film having a thickness of about 50 ⁇ obtained in Production Examples 1 and 2 described above was stored in an atmosphere at a temperature of 23 ° C and a humidity of 50%, and the production example of the laminate was obtained every week. Similarly, a laminated body was manufactured, and the state of the film on the surface of the obtained laminated body was visually checked.
- the film has less than 10% wrinkles after heat curing
- the resin component of the adhesive film does not flow out when the adhesive film is bonded to the adherend to produce a laminate. It also has excellent storage stability and excellent film processing properties such as no fish eyes. Furthermore, the obtained laminate is excellent in solder heat resistance and adhesiveness. Even if the adherend has irregularities, the adherend adheres to the adherend and the adherent film is adhered to the adherend. A completely coated laminate can be obtained.
- Laminates having such excellent properties include, for example, semiconductor sealing materials, solar cells,
- the adhesive film can be used as a solder resist for protecting the substrate from solder, a protective sheet or the like in a process of manufacturing an electronic component.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Epoxy Resins (AREA)
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/525,067 US20050247402A1 (en) | 2002-08-23 | 2003-08-20 | Adhesive film |
| AU2003257584A AU2003257584A1 (en) | 2002-08-23 | 2003-08-20 | Adhesive film |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-243127 | 2002-08-23 | ||
| JP2002243127A JP4211321B2 (ja) | 2002-08-23 | 2002-08-23 | 接着性フィルム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2004018584A1 true WO2004018584A1 (ja) | 2004-03-04 |
Family
ID=31944086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2003/010479 Ceased WO2004018584A1 (ja) | 2002-08-23 | 2003-08-20 | 接着性フィルム |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20050247402A1 (ja) |
| JP (1) | JP4211321B2 (ja) |
| KR (1) | KR20050038022A (ja) |
| CN (1) | CN1675328A (ja) |
| AU (1) | AU2003257584A1 (ja) |
| TW (1) | TW200413490A (ja) |
| WO (1) | WO2004018584A1 (ja) |
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| US11945998B2 (en) | 2019-10-31 | 2024-04-02 | Eastman Chemical Company | Processes and systems for making recycle content hydrocarbons |
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| JP2005036077A (ja) * | 2003-07-18 | 2005-02-10 | Sumitomo Chemical Co Ltd | 接着性フィルム |
| JP2009120787A (ja) * | 2007-11-19 | 2009-06-04 | Kaneka Corp | 変性ポリオレフィン系樹脂組成物およびその製造方法 |
| US8080727B2 (en) | 2008-11-24 | 2011-12-20 | E. I. Du Pont De Nemours And Company | Solar cell modules comprising an encapsulant sheet of a blend of ethylene copolymers |
| US8084129B2 (en) * | 2008-11-24 | 2011-12-27 | E. I. Du Pont De Nemours And Company | Laminated articles comprising a sheet of a blend of ethylene copolymers |
| FR2941888B1 (fr) * | 2009-02-06 | 2011-03-25 | Arkema France | Utilisation d'un film compose de polyolefine dans un module photovoltaique |
| FR2941887B1 (fr) * | 2009-02-06 | 2011-03-25 | Arkema France | Utilisation d'un film a base de polyolefine dans un module photovoltaique |
| CN102422437B (zh) * | 2009-05-13 | 2016-05-04 | 三井-杜邦聚合化学株式会社 | 太阳能电池密封材料用片材及太阳能电池组件 |
| WO2010135460A1 (en) * | 2009-05-19 | 2010-11-25 | Specialized Technology Resources, Inc | Encapsulant compositions, methods of manufacture and uses thereof |
| BR112012002097A2 (pt) * | 2009-07-31 | 2019-09-24 | Du Pont | composição de mescla, produto de reticulação da composição de mescla processo para produzir uma folha, folha formada pelo processo modulo de culula solar processo para a reparação de um modulo de celula solar, modulo de controle solar processo para produzir a composição de mescla, folha extrudada e folha extrudada de multiplas camadas |
| JP5295922B2 (ja) * | 2009-09-30 | 2013-09-18 | 旭化成イーマテリアルズ株式会社 | 樹脂封止シート |
| US8609980B2 (en) | 2010-07-30 | 2013-12-17 | E I Du Pont De Nemours And Company | Cross-linkable ionomeric encapsulants for photovoltaic cells |
| JP2012057040A (ja) * | 2010-09-08 | 2012-03-22 | Nitto Denko Corp | 粘着シートおよびその製造方法 |
| JP2012057041A (ja) * | 2010-09-08 | 2012-03-22 | Nitto Denko Corp | 粘着シートおよびその製造方法 |
| JP5773198B2 (ja) * | 2011-07-22 | 2015-09-02 | Dic株式会社 | 電池用電解液封止感熱接着シート |
| EP3357987B1 (en) * | 2015-09-30 | 2021-02-17 | Dow-Mitsui Polychemicals Co., Ltd. | Insulating multilayer sheet and solar cell module |
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| US5932339A (en) * | 1995-08-22 | 1999-08-03 | Bridgestone Corporation | Anisotropically electricity conductive film comprising thermosetting adhesive agent and electrically conductive particles |
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| JP2836161B2 (ja) * | 1990-01-30 | 1998-12-14 | 住友化学工業株式会社 | 熱可塑性樹脂組成物 |
| US6051652A (en) * | 1995-10-31 | 2000-04-18 | 3M Innovative Properties Company | Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive |
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2002
- 2002-08-23 JP JP2002243127A patent/JP4211321B2/ja not_active Expired - Fee Related
-
2003
- 2003-08-20 WO PCT/JP2003/010479 patent/WO2004018584A1/ja not_active Ceased
- 2003-08-20 KR KR1020057002938A patent/KR20050038022A/ko not_active Withdrawn
- 2003-08-20 CN CNA038195755A patent/CN1675328A/zh active Pending
- 2003-08-20 AU AU2003257584A patent/AU2003257584A1/en not_active Abandoned
- 2003-08-20 US US10/525,067 patent/US20050247402A1/en not_active Abandoned
- 2003-08-20 TW TW092122877A patent/TW200413490A/zh unknown
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| JPH08225778A (ja) * | 1995-02-20 | 1996-09-03 | Nippon Oil & Fats Co Ltd | 加熱溶融型接着剤組成物 |
| US5932339A (en) * | 1995-08-22 | 1999-08-03 | Bridgestone Corporation | Anisotropically electricity conductive film comprising thermosetting adhesive agent and electrically conductive particles |
| JPH10273540A (ja) * | 1997-03-27 | 1998-10-13 | Bridgestone Corp | 異方性導電フィルム |
| JPH1180682A (ja) * | 1997-09-11 | 1999-03-26 | Bridgestone Corp | 架橋型導電性粘着テープ |
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| US12600911B2 (en) | 2019-05-24 | 2026-04-14 | ExxonMobil Product Solutions Company | Cracking a C4-C7 fraction of pyoil |
| US11946000B2 (en) | 2019-05-24 | 2024-04-02 | Eastman Chemical Company | Blend small amounts of pyoil into a liquid stream processed into a gas cracker |
| US12031091B2 (en) | 2019-05-24 | 2024-07-09 | Eastman Chemical Company | Recycle content cracked effluent |
| US12497467B2 (en) | 2019-05-24 | 2025-12-16 | Exxon Mobil Product Solutions Company | Recycle content cellulose ester |
| US12338211B2 (en) | 2019-07-29 | 2025-06-24 | Eastman Chemical Company | Recycle content (C4)alkanal |
| US12534590B2 (en) | 2019-07-29 | 2026-01-27 | Eastman Chemical Company | Recycle content cyclobutane diol polyester |
| US12312540B2 (en) | 2019-10-31 | 2025-05-27 | Eastman Chemical Company | Pyrolysis method and system for recycled waste |
| US11787754B2 (en) | 2019-10-31 | 2023-10-17 | Eastman Chemical Company | Processes and systems for making recycle content hydrocarbons |
| US11945998B2 (en) | 2019-10-31 | 2024-04-02 | Eastman Chemical Company | Processes and systems for making recycle content hydrocarbons |
| US12516006B2 (en) | 2019-11-07 | 2026-01-06 | ExxonMobil Product Solutions Company | Recycle content propanol |
| US12522548B2 (en) | 2019-11-07 | 2026-01-13 | ExxonMobil Product Solutions Company | Recycle content oxo alcohols and oxo plasticizers |
| US12577472B2 (en) | 2019-11-07 | 2026-03-17 | ExxonMobil Product Solutions Company | Recycle content alpha olefins and fatty alcohols |
| US11939534B2 (en) | 2019-11-07 | 2024-03-26 | Eastman Chemical Company | Recycle content alpha olefins and fatty alcohols |
| US12195674B2 (en) | 2021-09-21 | 2025-01-14 | Eastman Chemical Company | Using spent caustic solution from pygas treatment to neutralize halogens from liquified waste plastic |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4211321B2 (ja) | 2009-01-21 |
| KR20050038022A (ko) | 2005-04-25 |
| CN1675328A (zh) | 2005-09-28 |
| JP2004083636A (ja) | 2004-03-18 |
| AU2003257584A1 (en) | 2004-03-11 |
| US20050247402A1 (en) | 2005-11-10 |
| TW200413490A (en) | 2004-08-01 |
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