WO2003107392A1 - 低圧放電ランプ及びその製造方法 - Google Patents
低圧放電ランプ及びその製造方法 Download PDFInfo
- Publication number
- WO2003107392A1 WO2003107392A1 PCT/JP2003/007679 JP0307679W WO03107392A1 WO 2003107392 A1 WO2003107392 A1 WO 2003107392A1 JP 0307679 W JP0307679 W JP 0307679W WO 03107392 A1 WO03107392 A1 WO 03107392A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- low
- pressure discharge
- discharge lamp
- solder
- diving
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J65/00—Lamps without any electrode inside the vessel; Lamps with at least one main electrode outside the vessel
- H01J65/04—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels
- H01J65/042—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field
- H01J65/046—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field the field being produced by using capacitive means around the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/04—Electrodes; Screens; Shields
- H01J61/06—Main electrodes
- H01J61/067—Main electrodes for low-pressure discharge lamps
- H01J61/0672—Main electrodes for low-pressure discharge lamps characterised by the construction of the electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/04—Electrodes; Screens; Shields
- H01J61/06—Main electrodes
- H01J61/067—Main electrodes for low-pressure discharge lamps
- H01J61/0675—Main electrodes for low-pressure discharge lamps characterised by the material of the electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0001—Electrodes and electrode systems suitable for discharge tubes or lamps
- H01J2893/0002—Construction arrangements of electrode systems
Definitions
- the present invention relates to a low-pressure discharge lamp and a method for manufacturing the same.
- a so-called dielectric barrier discharge type low-pressure discharge lamp (EEFL) having electrodes on the outer surface of a tubular glass lamp vessel for example, the one described in Japanese Utility Model Publication No. 61-126559 is known.
- an ionizable filler such as a rare gas or a mixed gas of mercury and a rare gas is sealed in a tubular glass lamp vessel having both ends sealed.
- a phosphor layer or the like is formed on the inner wall surface of the tubular glass lamp container as necessary. External electrodes are provided on the outer surfaces of both ends of the tubular glass lamp vessel.
- the external electrode is composed of a metal tape as a current conductor layer made of, for example, aluminum foil and a conductive adhesive, and a coiled lead wire connected to the metal tape as a power supply for a low-pressure discharge lamp. Note that the coiled lead wire is in contact with the metal tape due to its own spring property.
- the low-pressure discharge lamp having such a configuration is characterized in that the electrodes are not disposed in the tubular glass lamp vessel, so that the electrodes are not consumed and the life is long.
- the diameter of the tubular glass lamp vessel is about 3 mni, which is very small, and when attaching metal tape to it, a complicated machine is required to attach it with precise dimensional accuracy, which makes mass production difficult. Was.
- the present invention solves the technical problems of such a conventional low-pressure discharge lamp having an electrode using a metal tape, reduces power consumption, prevents perforation, and reduces the cost of manufacturing the lamp. It is an object of the present invention to provide a low-pressure discharge lamp that can adopt a manufacturing method capable of mass production.
- the low-pressure discharge lamp of the present invention forms a current conductor layer of an external electrode by diving the tube end of a tubular glass lamp vessel into a solder bath in which a solder material familiar to the glass surface is melted. It is characterized by the following.
- solder material that is familiar with the glass surface, tin, an alloy of tin and indium, or an alloy of tin and bismuth is used as a main component, so that the current conductor layer is sticky and strong, and discharge The characteristics are stable and the service life is long.
- at least one of antimony, zinc, and aluminum is included as an additive, so that the surface of the tubular glass lamp container and the current conductor layer are well-adapted, and the current conductor layer is hardly peeled off. Stable discharge characteristics and long life.
- solder diving for forming the current conductor layer mass production is possible and cost reduction can be achieved.
- the low-pressure discharge lamp of the present invention is characterized in that a current conductor layer of an external electrode is formed by diving a tube end of a tubular glass lamp vessel into an ultrasonic solder bath in which a solder material is melted. Things.
- the current conductor layer is tenacious and strong, and the discharge characteristics are stable by using tin, an alloy of tin and zinc, or an alloy of tin and bismuth as a main component as a solder material. And longer life.
- the current conductor layer of the external electrode is formed by ultrasonic solder diving, so that the layer has a uniform thickness without unevenness, and a high-performance low-pressure discharge lamp can be realized. .
- mass production is possible and cost reduction can be achieved.
- the surface of the tube end portion of the tubular glass lamp vessel is subjected to a plastic treatment, and the portion is dipped into an ultrasonic solder bath in which the above-mentioned solder material is melted, whereby the external electrode is formed.
- the present invention is characterized in that a current conductor layer is formed.
- the current conductor layer of the external electrode is formed by ultrasonic solder diving, a layer having a uniform thickness without unevenness can be obtained.
- the current conductor layer is formed on the surface subjected to the blast treatment by ultrasonic solder diving, the current conductor layer does not easily peel off from the tubular glass lamp container, providing a high-performance low-pressure discharge lamp. be able to.
- the ultrasonic solder diving method can be used to form the current conductor layer, which enables mass production and lower cost.
- FIG. 1 is an axial sectional view of a dielectric barrier discharge type low-pressure discharge lamp according to a first embodiment of the present invention.
- FIG. 2 is an axial sectional view of a dielectric barrier discharge type low-pressure discharge lamp according to a second embodiment of the present invention.
- FIG. 3 is an axial sectional view of a dielectric barrier discharge type low-pressure discharge lamp according to a third embodiment of the present invention.
- FIG. 4 is an axial sectional view of a dielectric barrier discharge type low-pressure discharge lamp as an application example of the present invention.
- FIG. 5 is an axial sectional view of a dielectric barrier discharge type low-pressure discharge lamp as another application example of the present invention. DETAILED DESCRIPTION OF THE INVENTION
- FIG. 1 shows a structure of a dielectric barrier discharge type low-pressure discharge lamp 11 according to a first embodiment of the present invention.
- the tubular glass lamp vessel 10 is formed of borosilicate glass, and its dimensions are 2.6 mm in outer diameter, 2.0 mm in inner diameter, and 350 mm in total length.
- solder diving layers 30, 35 are formed as current conductor layers for the external electrodes 21, 26, respectively.
- a phosphor layer 70 made of a three-wavelength phosphor is formed on a portion other than a portion where the external electrodes 21 and 26 are provided.
- the thickness of the phosphor layer 70 is 20 / m.
- the solder diving layers 30, 36 were formed by diving the end of the tubular glass lamp vessel 10 into a solder bath of about 350 ° C. in which tin + zinc + aluminum + antimony was melted for about 30 seconds.
- the thickness of the formed solder diving layers 30 and 35 is 5 mm, and the length of the disposition portion is 20 mm.
- coiled lead wires 51 and 56 which come into contact with the solder diving layers 30 and 35 by their elastic force. .
- solder material of tin, an alloy of tin and indium, or an alloy of tin and bismuth
- a tubular glass lamp container It was confirmed that a uniform and well-adhesive plating layer was formed on the surface of Sample No. 10. Also these By adding at least one of antimony, zinc, and aluminum to the solder material of JP03 / 07679 as an additive, the surface of the tubular glass lamp vessel and the current conductor layer are well-adapted, and the current conductor layer is less likely to peel off and is stable Solder diving layers 30, 35 that provide excellent discharge characteristics can be obtained.
- solder material containing at least one of antimony, zinc, and aluminum as an additive to tin also exhibited good adhesion.
- a solder material containing at least one of antimony, zinc, and aluminum as an additive exhibits good adhesion to an alloy of tin and indium or an alloy of tin and bismuth, respectively. Since the melting point temperature of the solder material can be reduced, soldering becomes easier.
- aluminum is added to tin + zinc + antimony, it is possible to form a solder electrode where surface oxidation hardly progresses, so that a stable conductive electrode can be formed.
- the dielectric barrier discharge type low-pressure discharge lamp according to this embodiment has almost no voltage drop in the electrode portion as compared with the conventional dielectric barrier discharge type low-pressure discharge lamp having electrodes using a metal tape. Can be lowered.
- the lamp voltage at a lamp current of 4 mA and a lighting frequency of 45 kHz was 1940 Vrms in the conventional lamp, but was reduced to 1790 Vrms in the present embodiment.
- FIG. 2 shows the structure of a dielectric barrier discharge type low voltage discharge lamp 11 according to a second embodiment of the present invention.
- the dielectric barrier discharge type low-pressure discharge lamp 11 shown in the figure has basically the same configuration as the discharge lamp 11 shown in FIG. Therefore, the same portions are denoted by the same reference numerals, and the following description focuses on the differences from the first embodiment.
- ultrasonic solder diving layers 31 and 36 are formed on the outer surfaces of both ends of the tubular glass lamp container 10. These ultrasonic solder diving layers 31, 36 are used as current conductor layers constituting the external electrodes 21, 26, respectively.
- ultrasonic solder diving is a method in which an ultrasonic vibrator is installed inside a molten solder bath, and the solder is applied while applying ultrasonic vibration to the molten solder.
- the same solder material as in the first embodiment is used, and the ultrasonic vibrator is vibrated at 20 KHZ. For about 30 seconds.
- KDB-100 manufactured by Kuroda Techno Co., Ltd. was used as the ultrasonic bath.
- the solder diving layers 31 and 36 thus formed have a thickness of 5 m and a length in the tube axis direction of 20 mm, as in the first embodiment.
- the diving layers 31, 36 formed by diving the tube ends into an ultrasonic solder bath have a more uniform thickness than the solder diving layers 30, 35 formed by a normal solder bath. As described later, it has higher adhesion to the surface of the tubular glass lamp vessel 10.
- the dielectric barrier discharge type low-pressure discharge lamp 11 shown in FIG. 2 has the same configuration as the discharge lamp 11 shown in FIG. Therefore, the same portions are denoted by the same reference numerals, and the following description focuses on the differences from the second embodiment.
- the outer surfaces at both ends of the tubular glass lamp vessel 10 are made into a roughened surface by a plastic treatment.
- Ultrasonic solder diving layers 31 and 36 are formed on 41 and 46, respectively.
- This blasting is performed, for example, by rotating the tubular glass lamp vessel 10 around its tube axis and spraying an alumina abrasive. This blasting can also be performed by chemical etching with hydrofluoric acid or the like. Both ends of the tubular glass lamp vessel 10 thus blasted are dipped in an ultrasonic solder bath under the same conditions as in the second embodiment, and the ultrasonic solder diving layers 31, 36 are formed. It is formed.
- the contact area between the ultrasonic solder diving layers 31, 36 and the glass surface of the tubular glass lamp container 10 is increased.
- the ultrasonic solder dumping layers 31 and 36 can be hardly peeled off.
- the inventors of the present invention described above used solder diving using ordinary solder.
- the layers were formed as comparative examples, and a comparative experiment was performed between these layers and the ultrasonic solder diving layers of Examples 2 and 3 described above.
- the soldering bath in which the alloy of tin and copper used in the above-described experiments by the present inventors was melted was provided with a tubing-treated tubular glass lamp container and a tubular glass lamp container without the blast treatment. Then, a plating layer was formed, and Comparative Examples 1 and 2 were obtained.
- Electroless plating NG one-electrode with no scratches
- Example 3 From the results of this heat cycle test, it was found that the external electrode of the ultrasonic solder diving layer according to the example of the present invention was formed of a tin-copper alloy or a tin-copper-silver alloy as a solder material. It was confirmed that the heat cycle test was stronger than the external electrode using ordinary solder bath diving using an alloy.
- the smooth surface of the glass lamp vessel 10 is blasted to make the surface uneven as in the third embodiment, and an ultrasonic solder layer is formed on the portion. It can be seen that the contact area between the surface of the glass lamp vessel and the ultrasonic solder diving layer is increased, and the adhesion strength can be increased. In other words, an external electrode which was stronger and hard to peel off could be formed by the blast treatment.
- FIGS. 4 and 5 are diagrams showing an application example of the dielectric barrier discharge type low-pressure discharge lamp of the present invention.
- the low-pressure discharge lamp 12 shown in FIG. 4 has, similarly to the third embodiment shown in FIG. 3, a plastic treated surface 41, 46 formed on the outer surface of both ends of the tubular glass lamp vessel 10, and an ultrasonic wave on the surface.
- Solder diving layers 31, 36 are formed.
- a metal oxide layer 71 such as aluminum oxide, oxide oxide, or zinc oxide is formed on the phosphor layer 70 inside the tubular glass lamp vessel 10 and on the glass surface inside the external electrodes 21 and 26. .
- the low-pressure discharge lamp 12 having such a configuration, the low-pressure discharge lamp of the second embodiment is used.
- the lamp 11 by employing the ultrasonic solder diving method, mass production of a low-priced, high-performance, low-pressure discharge lamp becomes possible.
- mercury consumption due to mercury adsorption on the phosphor layer 70 inside the glass lamp vessel 10 can be suppressed, and mercury consumption due to intrusion of mercury into the glass can be prevented, and the life can be extended. I can do it.
- the low-pressure discharge lamp 13 shown in FIG. 5 has blast-treated surfaces 41 and 46 on the outer surfaces of both ends of the tubular glass lamp vessel 10 and ultrasonic solder diving on the surface.
- Layers 31 and 36 are formed as external electrodes 21 and 26.
- metal oxides such as aluminum oxide, yttrium oxide and zinc oxide are provided between the inner peripheral surface of the tubular glass lamp vessel 10 and the phosphor layer 70 and on the glass surface inside the external electrodes 21 and 26.
- Layer 72 has been formed.
- the mass production of a low-priced, high-performance low-pressure discharge lamp can be realized by employing the @sonic solder diving method. It becomes possible. Furthermore, according to this application example, mercury consumption due to intrusion of mercury into the glass surface of the tubular glass lamp vessel 10 can be prevented, and the life can be extended.
- the present invention is not limited to this, and the low-pressure discharge lamp 11 of the first or third embodiment may be used. Needless to say.
- coiled lead wires 51 and 56 are provided at both ends of a tubular glass lamp vessel 10 on which solder diving layers 30 and 35 or ultrasonic solder diving layers 31 and 36 are formed.
- the conductor may not necessarily be a coiled lead wire as long as it is a conductor that can contact the field diving layer.
- the current formed by the uniform and uniform metal plating layer is used as the external electrodes 21 and 26 of the tubular glass lamp vessel 10.
- a conductor layer can be formed.
- a blast-treated tubular glass lamp vessel 10 By diving the end surfaces 41 and 46 of this into a solder bath, it is possible to form a current conductor layer that is extremely difficult to peel off from the tubular glass lamp container 10. Therefore, a high-performance low-pressure discharge lamp having stable discharge characteristics with low power consumption can be obtained.
- mass production is possible, and the cost of a low-pressure discharge lamp can be reduced.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60324428T DE60324428D1 (de) | 2002-06-17 | 2003-06-17 | Niederspannungsentladungslampe und verfahren zu ihrer herstellung |
KR1020047020425A KR100540722B1 (ko) | 2002-06-17 | 2003-06-17 | 저압 방전 램프 및 그 제조 방법 |
EP03760157A EP1515361B1 (en) | 2002-06-17 | 2003-06-17 | Low-voltage discharge lamp and its manufacturing method |
US10/517,388 US20060055326A1 (en) | 2002-06-17 | 2003-06-17 | Low- Voltage discharge lamp and its manufacturing method |
US10/798,260 US20040222743A1 (en) | 2003-03-13 | 2004-03-12 | Dielectric barrier discharge type low-pressure discharge lamp |
US12/478,194 US7927168B2 (en) | 2002-06-17 | 2009-06-04 | Low-pressure discharge lamp and method for manufacturing thereof |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-176269 | 2002-06-17 | ||
JP2002176269 | 2002-06-17 | ||
JP2002255547 | 2002-08-30 | ||
JP2002-255547 | 2002-08-30 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10517388 A-371-Of-International | 2003-06-17 | ||
US10/798,260 Continuation-In-Part US20040222743A1 (en) | 2003-03-13 | 2004-03-12 | Dielectric barrier discharge type low-pressure discharge lamp |
US12/478,194 Division US7927168B2 (en) | 2002-06-17 | 2009-06-04 | Low-pressure discharge lamp and method for manufacturing thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003107392A1 true WO2003107392A1 (ja) | 2003-12-24 |
Family
ID=29738425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/007679 WO2003107392A1 (ja) | 2002-06-17 | 2003-06-17 | 低圧放電ランプ及びその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20060055326A1 (ja) |
EP (1) | EP1515361B1 (ja) |
KR (3) | KR100540722B1 (ja) |
CN (1) | CN100337302C (ja) |
DE (1) | DE60324428D1 (ja) |
TW (1) | TWI274367B (ja) |
WO (1) | WO2003107392A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4027849B2 (ja) * | 2003-06-19 | 2007-12-26 | ハリソン東芝ライティング株式会社 | 低圧放電ランプ |
US20050253523A1 (en) * | 2004-05-14 | 2005-11-17 | Yi-Shiuan Tsai | Fluorescent lamp for backlight device |
US20060208641A1 (en) * | 2005-03-15 | 2006-09-21 | Takashi Maniwa | Cold-cathode fluorescent lamp having thin coat as electrically connected terminal, production method of the lamp, lighting apparatus having the lamp, backlight unit, and liquid crystal display apparatus |
TW200705510A (en) * | 2005-05-13 | 2007-02-01 | Matsushita Electric Ind Co Ltd | Fluorescent lamp, backlight unit, and liquid crystal display device |
KR101170949B1 (ko) * | 2005-06-03 | 2012-08-03 | 엘지디스플레이 주식회사 | 액정표시장치용 외부전극형광램프 |
KR20070009425A (ko) * | 2005-07-14 | 2007-01-18 | 마츠시타 덴끼 산교 가부시키가이샤 | 외부 전극을 구비한 방전램프 및 그 제조방법, 당해방전램프를 구비한 백라이트 유닛 및 액정표시장치 |
KR100795832B1 (ko) | 2005-12-26 | 2008-01-17 | 주식회사 디엠에스 | 막 형성용 조성물, 이를 이용하여 제조된 형광램프 및 이의제조방법 |
KR100606201B1 (ko) * | 2006-04-18 | 2006-07-31 | 주식회사 멕스기연 | 저압 방전 램프의 제조 방법 |
WO2008093768A1 (ja) * | 2007-02-01 | 2008-08-07 | Panasonic Corporation | 蛍光ランプ、並びに蛍光ランプを用いた発光装置及び表示装置 |
CN112997271B (zh) | 2018-11-13 | 2022-04-26 | 优志旺电机株式会社 | 准分子灯光源装置及准分子灯点亮方法 |
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JPS5178586A (en) * | 1974-12-30 | 1976-07-08 | Harumi Handa | Toriga waiyakoteihoho |
JPS5265740A (en) * | 1975-11-28 | 1977-05-31 | Hitachi Ltd | Ultrasonic dip solder bath |
JPH1140109A (ja) * | 1997-07-18 | 1999-02-12 | Ushio Inc | 蛍光ランプ |
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US6123248A (en) * | 1997-06-18 | 2000-09-26 | Kabushiki Kaisha Toshiba | Soldering method and soldering apparatus |
JP2002270097A (ja) * | 2001-03-13 | 2002-09-20 | West Electric Co Ltd | 曲管形状放電管の製造方法および曲管形状放電管 |
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GB431298A (en) * | 1934-07-20 | 1935-07-04 | Luminous Tube Lighting Corp | Improvement in luminous electric discharge tubes |
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US2756361A (en) * | 1951-07-06 | 1956-07-24 | Kenneth J Germeshausen | Gaseous-discharge device and method of making the same |
US4178059A (en) | 1978-08-09 | 1979-12-11 | General Electric Company | Aluminum base for electric lamps having a plastic coating for improved corrosion resistance |
KR820002451Y1 (ko) | 1979-08-01 | 1982-11-25 | 제네럴 일렉트릭 컴페니 | 개선된 내식성을 위해 플라스틱 코팅이 되어있는 전등용 알루미늄 베이스 |
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-
2003
- 2003-06-17 US US10/517,388 patent/US20060055326A1/en not_active Abandoned
- 2003-06-17 WO PCT/JP2003/007679 patent/WO2003107392A1/ja active IP Right Grant
- 2003-06-17 KR KR1020047020425A patent/KR100540722B1/ko not_active IP Right Cessation
- 2003-06-17 KR KR1020057018942A patent/KR100561993B1/ko not_active IP Right Cessation
- 2003-06-17 CN CNB038140527A patent/CN100337302C/zh not_active Expired - Fee Related
- 2003-06-17 DE DE60324428T patent/DE60324428D1/de not_active Expired - Fee Related
- 2003-06-17 TW TW092116432A patent/TWI274367B/zh not_active IP Right Cessation
- 2003-06-17 EP EP03760157A patent/EP1515361B1/en not_active Expired - Fee Related
- 2003-06-17 KR KR1020067001271A patent/KR100721067B1/ko not_active IP Right Cessation
-
2009
- 2009-06-04 US US12/478,194 patent/US7927168B2/en not_active Expired - Fee Related
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JPS5178586A (en) * | 1974-12-30 | 1976-07-08 | Harumi Handa | Toriga waiyakoteihoho |
JPS5265740A (en) * | 1975-11-28 | 1977-05-31 | Hitachi Ltd | Ultrasonic dip solder bath |
US6123248A (en) * | 1997-06-18 | 2000-09-26 | Kabushiki Kaisha Toshiba | Soldering method and soldering apparatus |
JPH1140109A (ja) * | 1997-07-18 | 1999-02-12 | Ushio Inc | 蛍光ランプ |
JP2000141078A (ja) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
JP2002270097A (ja) * | 2001-03-13 | 2002-09-20 | West Electric Co Ltd | 曲管形状放電管の製造方法および曲管形状放電管 |
Non-Patent Citations (1)
Title |
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See also references of EP1515361A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP1515361A4 (en) | 2006-10-18 |
KR20050010931A (ko) | 2005-01-28 |
KR20060015697A (ko) | 2006-02-17 |
CN100337302C (zh) | 2007-09-12 |
DE60324428D1 (de) | 2008-12-11 |
KR100540722B1 (ko) | 2006-01-10 |
US7927168B2 (en) | 2011-04-19 |
KR100561993B1 (ko) | 2006-03-20 |
KR20050103520A (ko) | 2005-10-31 |
CN1663021A (zh) | 2005-08-31 |
TWI274367B (en) | 2007-02-21 |
EP1515361B1 (en) | 2008-10-29 |
TW200400531A (en) | 2004-01-01 |
US20090253330A1 (en) | 2009-10-08 |
KR100721067B1 (ko) | 2007-05-23 |
US20060055326A1 (en) | 2006-03-16 |
EP1515361A1 (en) | 2005-03-16 |
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