WO2003102690A3 - Verfahren zur herstellung von fotomasken für die strukturierung von halbleitersubstraten durch optische lithografie - Google Patents

Verfahren zur herstellung von fotomasken für die strukturierung von halbleitersubstraten durch optische lithografie Download PDF

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Publication number
WO2003102690A3
WO2003102690A3 PCT/DE2003/001394 DE0301394W WO03102690A3 WO 2003102690 A3 WO2003102690 A3 WO 2003102690A3 DE 0301394 W DE0301394 W DE 0301394W WO 03102690 A3 WO03102690 A3 WO 03102690A3
Authority
WO
WIPO (PCT)
Prior art keywords
photoresist masks
semiconductor substrates
optical lithography
structuring
producing photoresist
Prior art date
Application number
PCT/DE2003/001394
Other languages
English (en)
French (fr)
Other versions
WO2003102690A2 (de
WO2003102690B1 (de
Inventor
Oliver Kirch
Michael Sebald
Original Assignee
Infineon Technologies Ag
Oliver Kirch
Michael Sebald
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Oliver Kirch, Michael Sebald filed Critical Infineon Technologies Ag
Priority to EP03735270A priority Critical patent/EP1508070A2/de
Priority to US10/516,262 priority patent/US20060083993A1/en
Priority to KR1020047019174A priority patent/KR100748742B1/ko
Priority to JP2004509512A priority patent/JP2005535910A/ja
Publication of WO2003102690A2 publication Critical patent/WO2003102690A2/de
Publication of WO2003102690A3 publication Critical patent/WO2003102690A3/de
Publication of WO2003102690B1 publication Critical patent/WO2003102690B1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung von Fotomasken für die Strukturierung von Halbleitern. Dabei wird ein Resist verwendet, welcher ein Polymer mit siliziumhaltigen Gruppen enthält. Bei der Strukturierung in einem sauerstoffhaltigen Plasma werden die Siliziumatome in Siliziumdioxid umgewandelt, das unter dem Siliziumdioxid angeordnete Bereiche des Absorbers vor einem Abtrag durch das Plasma schützt.
PCT/DE2003/001394 2002-05-29 2003-04-30 Verfahren zur herstellung von fotomasken für die strukturierung von halbleitersubstraten durch optische lithografie WO2003102690A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP03735270A EP1508070A2 (de) 2002-05-29 2003-04-30 Verfahren zur herstellung von fotomasken für die strukturierung von halbleitersubstraten durch optische lithografie
US10/516,262 US20060083993A1 (en) 2002-05-29 2003-04-30 Process for the production of photomasks for structuring semiconductor substrates by optical lithography
KR1020047019174A KR100748742B1 (ko) 2002-05-29 2003-04-30 광학 석판인쇄에 의해 반도체 기판을 구성하기 위한포토레지스트 마스크의 제조방법
JP2004509512A JP2005535910A (ja) 2002-05-29 2003-04-30 光リソグラフィによって半導体基板をパターニングするためのフォトマスク製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10223997.5 2002-05-29
DE10223997A DE10223997A1 (de) 2002-05-29 2002-05-29 Verfahren zur Herstellung von Fotomasken für die Strukturierung von Halbleitersubstraten durch optische Lithografie

Publications (3)

Publication Number Publication Date
WO2003102690A2 WO2003102690A2 (de) 2003-12-11
WO2003102690A3 true WO2003102690A3 (de) 2004-07-01
WO2003102690B1 WO2003102690B1 (de) 2004-10-21

Family

ID=29557397

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/001394 WO2003102690A2 (de) 2002-05-29 2003-04-30 Verfahren zur herstellung von fotomasken für die strukturierung von halbleitersubstraten durch optische lithografie

Country Status (8)

Country Link
US (1) US20060083993A1 (de)
EP (1) EP1508070A2 (de)
JP (1) JP2005535910A (de)
KR (1) KR100748742B1 (de)
CN (1) CN1656423A (de)
DE (1) DE10223997A1 (de)
TW (1) TWI225971B (de)
WO (1) WO2003102690A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI366218B (en) * 2004-06-01 2012-06-11 Semiconductor Energy Lab Method for manufacturing semiconductor device
US7790334B2 (en) * 2005-01-27 2010-09-07 Applied Materials, Inc. Method for photomask plasma etching using a protected mask
US7807336B2 (en) * 2005-12-28 2010-10-05 Hynix Semiconductor Inc. Method for manufacturing semiconductor device
KR100811431B1 (ko) * 2005-12-28 2008-03-07 주식회사 하이닉스반도체 반도체 소자의 제조 방법
WO2007142163A1 (en) * 2006-06-09 2007-12-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8530147B2 (en) 2007-11-21 2013-09-10 Macronix International Co., Ltd. Patterning process
CA2787249C (en) 2009-01-29 2017-09-12 Digiflex Ltd. Process for producing a photomask on a photopolymeric surface
US11320738B2 (en) * 2018-06-27 2022-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Pattern formation method and material for manufacturing semiconductor devices
KR102127740B1 (ko) * 2018-12-12 2020-06-29 아주대학교산학협력단 전계 효과 트랜지스터의 제조 방법 및 그래핀 소자에서 pmma를 제거하는 방법
CN110010634B (zh) * 2019-02-27 2021-07-06 德淮半导体有限公司 隔离结构及其形成方法，图像传感器及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4357369A (en) * 1981-11-10 1982-11-02 Rca Corporation Method of plasma etching a substrate
US4722882A (en) * 1985-01-11 1988-02-02 U.S. Philips Corporation Method of manufacturing a semiconductor device
JPH05323611A (ja) * 1992-05-18 1993-12-07 Oki Electric Ind Co Ltd 放射線感応性樹脂組成物
EP0744659A1 (de) * 1995-05-26 1996-11-27 AT&T Corp. Lithographisches Trockenätzverfahren
US6342562B1 (en) * 1999-04-23 2002-01-29 Fujitsu Limited Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346362A (en) * 1993-04-26 1994-09-13 United Technologies Corporation Mechanical damper
US6210856B1 (en) * 1999-01-27 2001-04-03 International Business Machines Corporation Resist composition and process of forming a patterned resist layer on a substrate
KR100682169B1 (ko) * 1999-07-30 2007-02-12 주식회사 하이닉스반도체 신규의 포토레지스트용 공중합체 및 이를 이용한 포토레지스트조성물
JP3433153B2 (ja) * 2000-03-22 2003-08-04 株式会社東芝 パターン形成材料、パターン形成方法、及び露光用マスクの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4357369A (en) * 1981-11-10 1982-11-02 Rca Corporation Method of plasma etching a substrate
US4722882A (en) * 1985-01-11 1988-02-02 U.S. Philips Corporation Method of manufacturing a semiconductor device
JPH05323611A (ja) * 1992-05-18 1993-12-07 Oki Electric Ind Co Ltd 放射線感応性樹脂組成物
EP0744659A1 (de) * 1995-05-26 1996-11-27 AT&T Corp. Lithographisches Trockenätzverfahren
US6342562B1 (en) * 1999-04-23 2002-01-29 Fujitsu Limited Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 0181, no. 46 (P - 1707) 10 March 1994 (1994-03-10) *

Also Published As

Publication number Publication date
WO2003102690A2 (de) 2003-12-11
WO2003102690B1 (de) 2004-10-21
KR100748742B1 (ko) 2007-08-13
TWI225971B (en) 2005-01-01
JP2005535910A (ja) 2005-11-24
DE10223997A1 (de) 2003-12-18
KR20050005497A (ko) 2005-01-13
US20060083993A1 (en) 2006-04-20
TW200401169A (en) 2004-01-16
CN1656423A (zh) 2005-08-17
EP1508070A2 (de) 2005-02-23

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