WO2003073371A3 - Chipkarte - Google Patents

Chipkarte Download PDF

Info

Publication number
WO2003073371A3
WO2003073371A3 PCT/DE2003/000513 DE0300513W WO03073371A3 WO 2003073371 A3 WO2003073371 A3 WO 2003073371A3 DE 0300513 W DE0300513 W DE 0300513W WO 03073371 A3 WO03073371 A3 WO 03073371A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip card
card base
component
overlay
cavity
Prior art date
Application number
PCT/DE2003/000513
Other languages
English (en)
French (fr)
Other versions
WO2003073371A2 (de
Inventor
Thies Janczek
Original Assignee
Orga Kartensysteme Gmbh
Thies Janczek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme Gmbh, Thies Janczek filed Critical Orga Kartensysteme Gmbh
Priority to AU2003212205A priority Critical patent/AU2003212205A1/en
Priority to DE2003190768 priority patent/DE10390768D2/de
Publication of WO2003073371A2 publication Critical patent/WO2003073371A2/de
Publication of WO2003073371A3 publication Critical patent/WO2003073371A3/de

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Die Erfindung betrifft eine Chipkarte mit einem Chipkartenkörper (1), in dessen wenigstens eine Kavität (2) mindestens ein Bauelement (3) einsetzbar ist, wobei das Bauelement (3) durch ein auf eine Oberfläche (4) des Chipkartenkörpers (1) aufgebrachtes Overlay (5) mit dem Chipkartenkörper (1) zu einer untrennbaren Einheit verbunden ist. Das zur Herstellung einer derartigen Chipkarte bereitgestellte Verfahren umfasst die Verfahrensschritte: -Vorfertigung eines Chipkartenkörpers (1) durch Spritzgießen oder Spritz­prägen unter Ausbildung mindestens einer Kavität (2) in dem Chipkarten­körper (1) sowie Einbringung für die Kontaktierung erforderlicher elektri­scher Leitungen beziehungsweise Kontakte, - Bauelementimplantierung in die mindestens eine hierfür vorgesehene Kavi­tät (2), - Aufbringung eines Overlays (5) auf eine Chipkartenoberfläche (4), sodass der Chipkartenkörper (1), das wenigstens eine Bauelement (3) und das Overlay (5) eine untrennbare Einheit bilden.
PCT/DE2003/000513 2002-02-19 2003-02-19 Chipkarte WO2003073371A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003212205A AU2003212205A1 (en) 2002-02-19 2003-02-19 Chip card
DE2003190768 DE10390768D2 (de) 2002-02-19 2003-02-19 Chipkarte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10207001.6 2002-02-19
DE2002107001 DE10207001A1 (de) 2002-02-19 2002-02-19 Chipkarte

Publications (2)

Publication Number Publication Date
WO2003073371A2 WO2003073371A2 (de) 2003-09-04
WO2003073371A3 true WO2003073371A3 (de) 2004-01-08

Family

ID=27674763

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/000513 WO2003073371A2 (de) 2002-02-19 2003-02-19 Chipkarte

Country Status (3)

Country Link
AU (1) AU2003212205A1 (de)
DE (2) DE10207001A1 (de)
WO (1) WO2003073371A2 (de)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4128900A1 (de) * 1991-08-30 1993-03-04 Gao Ges Automation Org Verfahren zur herstellung normgerechter wertkarten, ausweiskarten oder dergleichen
DE4243654A1 (en) * 1991-12-26 1993-07-01 Mitsubishi Electric Corp Thin integrated circuit card with integral battery - contains circuit board with battery aperture in resin with aperture, connector holding battery in aperture
US5682294A (en) * 1994-02-14 1997-10-28 Us3, Inc. Integrated circuit card with a reinforcement structure for retaining and protecting integrated circuit module
DE19645071A1 (de) * 1996-10-31 1998-05-07 Tomas Meinen Verfahren zur Herstellung von Chipkarten
DE19736063A1 (de) * 1997-08-20 1999-02-25 Orga Kartensysteme Gmbh Chipkarte und Verfahren zum Herstellen von Chipkarten
US6179210B1 (en) * 1999-02-09 2001-01-30 Motorola, Inc. Punch out pattern for hot melt tape used in smartcards
DE19941637A1 (de) * 1999-09-01 2001-03-08 Orga Kartensysteme Gmbh Chipkarte und Verfahren zur Herstellung einer Chipkarte
DE19963165C1 (de) * 1999-11-04 2001-03-08 Giesecke & Devrient Gmbh Kartenförmiger Datenträger mit Anzeigeeinrichtung
DE19959364A1 (de) * 1999-12-09 2001-06-13 Orga Kartensysteme Gmbh Chipkarte

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19800341C2 (de) * 1997-11-12 2002-02-14 Meinen Ziegel & Co Gmbh IC-Karte, insbesondere für ein schlüsselloses Zugangssystem

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4128900A1 (de) * 1991-08-30 1993-03-04 Gao Ges Automation Org Verfahren zur herstellung normgerechter wertkarten, ausweiskarten oder dergleichen
DE4243654A1 (en) * 1991-12-26 1993-07-01 Mitsubishi Electric Corp Thin integrated circuit card with integral battery - contains circuit board with battery aperture in resin with aperture, connector holding battery in aperture
US5682294A (en) * 1994-02-14 1997-10-28 Us3, Inc. Integrated circuit card with a reinforcement structure for retaining and protecting integrated circuit module
DE19645071A1 (de) * 1996-10-31 1998-05-07 Tomas Meinen Verfahren zur Herstellung von Chipkarten
DE19736063A1 (de) * 1997-08-20 1999-02-25 Orga Kartensysteme Gmbh Chipkarte und Verfahren zum Herstellen von Chipkarten
US6179210B1 (en) * 1999-02-09 2001-01-30 Motorola, Inc. Punch out pattern for hot melt tape used in smartcards
DE19941637A1 (de) * 1999-09-01 2001-03-08 Orga Kartensysteme Gmbh Chipkarte und Verfahren zur Herstellung einer Chipkarte
DE19963165C1 (de) * 1999-11-04 2001-03-08 Giesecke & Devrient Gmbh Kartenförmiger Datenträger mit Anzeigeeinrichtung
DE19959364A1 (de) * 1999-12-09 2001-06-13 Orga Kartensysteme Gmbh Chipkarte

Also Published As

Publication number Publication date
WO2003073371A2 (de) 2003-09-04
AU2003212205A1 (en) 2003-09-09
AU2003212205A8 (en) 2003-09-09
DE10207001A1 (de) 2003-09-04
DE10390768D2 (de) 2005-01-13

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