WO2001037622A3 - Leiterbahnträgerschicht zur einlaminierung in eine chipkarte, verfahren zur herstellung einer leiterbahnträgerschicht spritzgusswerkzeug zur durchführung des verfahrens zur herstellung einer leiterbahnträgerschicht - Google Patents

Leiterbahnträgerschicht zur einlaminierung in eine chipkarte, verfahren zur herstellung einer leiterbahnträgerschicht spritzgusswerkzeug zur durchführung des verfahrens zur herstellung einer leiterbahnträgerschicht Download PDF

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Publication number
WO2001037622A3
WO2001037622A3 PCT/DE2000/003933 DE0003933W WO0137622A3 WO 2001037622 A3 WO2001037622 A3 WO 2001037622A3 DE 0003933 W DE0003933 W DE 0003933W WO 0137622 A3 WO0137622 A3 WO 0137622A3
Authority
WO
WIPO (PCT)
Prior art keywords
printed conductor
support layer
conductor support
producing
laminating
Prior art date
Application number
PCT/DE2000/003933
Other languages
English (en)
French (fr)
Other versions
WO2001037622A2 (de
Inventor
Carsten Senge
Original Assignee
Orga Kartensysteme Gmbh
Carsten Senge
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme Gmbh, Carsten Senge filed Critical Orga Kartensysteme Gmbh
Priority to AU25018/01A priority Critical patent/AU2501801A/en
Publication of WO2001037622A2 publication Critical patent/WO2001037622A2/de
Publication of WO2001037622A3 publication Critical patent/WO2001037622A3/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Abstract

Es wird eine Leiterbahnträgerschicht (1) zur Einlaminierung in eine Chipkarte mit mindestens einer auf der Leiterbahnträgerschicht (1) aufgebrachten Leiterbahn (7) und mit der Leiterbahn (2) verbundenen Anschlussflächen vorgestellt, bei der die Leiterbahnträgerschicht (1) auf mindestens einer Flachseite an den für die Leiterbahn (7) und die Anschlussflächen vorgesehenen Bereichen mit einem leitfähigen Material gefüllte Vertiefungen (3) aufweist, wobei die Oberfläche der Leiterbahnträgerschicht (1) in den nicht mit Vertiefungen versehenen Bereichen für das leitfähige Material hafthemmend ausgebildet ist. Die Erfindung betrifft darüberhinaus ein Verfahren zur Herstellung der o. a. Leiterbahnträgerschicht sowie eine Vorrichtung zur Durchführung des Verfahrens.
PCT/DE2000/003933 1999-11-18 2000-11-10 Leiterbahnträgerschicht zur einlaminierung in eine chipkarte, verfahren zur herstellung einer leiterbahnträgerschicht spritzgusswerkzeug zur durchführung des verfahrens zur herstellung einer leiterbahnträgerschicht WO2001037622A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU25018/01A AU2501801A (en) 1999-11-18 2000-11-10 Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1999155538 DE19955538B4 (de) 1999-11-18 1999-11-18 Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Verfahren zur Herstellung einer Leiterbahnträgerschicht Spritzgusswerkzeug zur Durchführung des Verfahrens zur Herstellung einer Leiterbahnträgerschicht
DE19955538.9 1999-11-18

Publications (2)

Publication Number Publication Date
WO2001037622A2 WO2001037622A2 (de) 2001-05-25
WO2001037622A3 true WO2001037622A3 (de) 2002-05-23

Family

ID=7929509

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/003933 WO2001037622A2 (de) 1999-11-18 2000-11-10 Leiterbahnträgerschicht zur einlaminierung in eine chipkarte, verfahren zur herstellung einer leiterbahnträgerschicht spritzgusswerkzeug zur durchführung des verfahrens zur herstellung einer leiterbahnträgerschicht

Country Status (3)

Country Link
AU (1) AU2501801A (de)
DE (1) DE19955538B4 (de)
WO (1) WO2001037622A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2820548A1 (fr) * 2001-02-02 2002-08-09 Schlumberger Systems & Service Objet portatif a puce et a antenne, module destine a former un objet portatif a puce et a antenne et leurs procedes de fabrication
DE10118487A1 (de) * 2001-04-12 2002-10-17 Demag Ergotech Gmbh Kunststoffformteil mit Leiterbahnstruktur, insbesondere kontaktlose Chipkarte mit Antennenstruktur, und Verfahren zur Herstellung eines solchen Formteils
DE10148525B4 (de) * 2001-10-01 2017-06-01 Morpho Cards Gmbh Chipkarte sowie ein Verfahren zur Herstellung einer derartigen Chipkarte
US7051429B2 (en) 2003-04-11 2006-05-30 Eastman Kodak Company Method for forming a medium having data storage and communication capabilities
US7370808B2 (en) * 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
DE102004030749A1 (de) * 2004-06-25 2006-01-19 Giesecke & Devrient Gmbh Chipmodul für einen tragbaren Datenträger
GB0605239D0 (en) * 2006-03-16 2006-04-26 Uvasol Ltd Improvements in the application of conductive tracks to substrates
DE102007002199A1 (de) * 2007-01-16 2008-06-19 Siemens Ag Mit Bauelementen bestückter Träger und Verfahren zum Herstellen eines mit Bauelementen bestückten Trägers
DE102013007042A1 (de) * 2013-04-24 2014-10-30 Gottfried Wilhelm Leibniz Universität Hannover Leiterplatte und Verfahren zum Herstellen einer Leiterplatte
EP2871596A1 (de) * 2013-11-12 2015-05-13 Gemalto SA Vernetzte elektronische Vorrichtung und ihr Herstellungsverfahren

Citations (6)

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Publication number Priority date Publication date Assignee Title
US4645733A (en) * 1983-11-10 1987-02-24 Sullivan Donald F High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates
US4731645A (en) * 1982-05-14 1988-03-15 U.S. Philips Corporation Connection of a semiconductor to elements of a support, especially of a portable card
GB2212332A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Fabrication of electrical circuits
DE3901402A1 (de) * 1989-01-19 1990-07-26 Telefonbau & Normalzeit Gmbh Verfahren zur herstellung einer chipkarte
US5595771A (en) * 1994-11-04 1997-01-21 Foltuz; Eugene L. Modular mold for injection molding and method of use thereof
EP0920056A2 (de) * 1997-11-26 1999-06-02 Hitachi, Ltd. IC-Karte, Methode und Apparat zu ihrer Herstellung

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GB583285A (en) * 1944-10-13 1946-12-13 Murrayfield Nominees Ltd Improvements in or relating to electrical apparatus, particularly for radio communication
US4080513A (en) * 1975-11-03 1978-03-21 Metropolitan Circuits Incorporated Of California Molded circuit board substrate
US5271887A (en) * 1980-08-04 1993-12-21 Witec Cayman Patents, Ltd. Method of fabricating complex micro-circuit boards, substrates and microcircuits and the substrates and microcircuits
DE3518975A1 (de) * 1985-05-25 1986-11-27 Bayer Ag, 5090 Leverkusen Kunststoffteil
DE3821121A1 (de) * 1988-06-23 1990-02-08 Ullmann Ulo Werk Verfahren zur herstellung von kontakttraegerkoerpern
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Publication number Priority date Publication date Assignee Title
US4731645A (en) * 1982-05-14 1988-03-15 U.S. Philips Corporation Connection of a semiconductor to elements of a support, especially of a portable card
US4645733A (en) * 1983-11-10 1987-02-24 Sullivan Donald F High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates
GB2212332A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Fabrication of electrical circuits
DE3901402A1 (de) * 1989-01-19 1990-07-26 Telefonbau & Normalzeit Gmbh Verfahren zur herstellung einer chipkarte
US5595771A (en) * 1994-11-04 1997-01-21 Foltuz; Eugene L. Modular mold for injection molding and method of use thereof
EP0920056A2 (de) * 1997-11-26 1999-06-02 Hitachi, Ltd. IC-Karte, Methode und Apparat zu ihrer Herstellung

Non-Patent Citations (1)

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Title
ANONYMOUS: "Subsurface Circuitry on Polymeric Substrates", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 27, no. 5, 1 October 1984 (1984-10-01), New York, US, pages 2937 - 2938, XP002169791 *

Also Published As

Publication number Publication date
DE19955538B4 (de) 2014-06-05
AU2501801A (en) 2001-05-30
DE19955538A1 (de) 2003-08-28
WO2001037622A2 (de) 2001-05-25

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