AU2501801A - Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer - Google Patents
Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layerInfo
- Publication number
- AU2501801A AU2501801A AU25018/01A AU2501801A AU2501801A AU 2501801 A AU2501801 A AU 2501801A AU 25018/01 A AU25018/01 A AU 25018/01A AU 2501801 A AU2501801 A AU 2501801A AU 2501801 A AU2501801 A AU 2501801A
- Authority
- AU
- Australia
- Prior art keywords
- support layer
- printed conductor
- conductor support
- producing
- laminating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19955538 | 1999-11-18 | ||
DE1999155538 DE19955538B4 (en) | 1999-11-18 | 1999-11-18 | Printed conductor carrier layer for lamination into a chip card, method for producing a conductor carrier layer Injection molding tool for carrying out the method for producing a conductor carrier layer |
PCT/DE2000/003933 WO2001037622A2 (en) | 1999-11-18 | 2000-11-10 | Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2501801A true AU2501801A (en) | 2001-05-30 |
Family
ID=7929509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU25018/01A Abandoned AU2501801A (en) | 1999-11-18 | 2000-11-10 | Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2501801A (en) |
DE (1) | DE19955538B4 (en) |
WO (1) | WO2001037622A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2820548A1 (en) * | 2001-02-02 | 2002-08-09 | Schlumberger Systems & Service | PORTABLE CHIP AND ANTENNA OBJECT, MODULE FOR FORMING PORTABLE CHIP AND ANTENNA OBJECT AND METHODS OF MAKING SAME |
DE10118487A1 (en) * | 2001-04-12 | 2002-10-17 | Demag Ergotech Gmbh | Plastic component with electrical functions, e.g. a chip card, contains functional elements, e.g. an antenna, made of electrically conducting plastic |
DE10148525B4 (en) * | 2001-10-01 | 2017-06-01 | Morpho Cards Gmbh | Chip card and a method for producing such a chip card |
US7051429B2 (en) * | 2003-04-11 | 2006-05-30 | Eastman Kodak Company | Method for forming a medium having data storage and communication capabilities |
US7370808B2 (en) * | 2004-01-12 | 2008-05-13 | Symbol Technologies, Inc. | Method and system for manufacturing radio frequency identification tag antennas |
DE102004030749A1 (en) * | 2004-06-25 | 2006-01-19 | Giesecke & Devrient Gmbh | Chip module for a portable data carrier |
GB0605239D0 (en) * | 2006-03-16 | 2006-04-26 | Uvasol Ltd | Improvements in the application of conductive tracks to substrates |
DE102007002199A1 (en) * | 2007-01-16 | 2008-06-19 | Siemens Ag | Method for manufacturing carrier fitted with components, involves applying electrical conducting structure including component connection areas on surface of electrically non-conducting carrier |
DE102013007042A1 (en) * | 2013-04-24 | 2014-10-30 | Gottfried Wilhelm Leibniz Universität Hannover | Printed circuit board and method for producing a printed circuit board |
EP2871596A1 (en) * | 2013-11-12 | 2015-05-13 | Gemalto SA | Interconnected electronic device and method for manufacturing same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB583285A (en) * | 1944-10-13 | 1946-12-13 | Murrayfield Nominees Ltd | Improvements in or relating to electrical apparatus, particularly for radio communication |
US4080513A (en) * | 1975-11-03 | 1978-03-21 | Metropolitan Circuits Incorporated Of California | Molded circuit board substrate |
US5271887A (en) * | 1980-08-04 | 1993-12-21 | Witec Cayman Patents, Ltd. | Method of fabricating complex micro-circuit boards, substrates and microcircuits and the substrates and microcircuits |
FR2527036A1 (en) * | 1982-05-14 | 1983-11-18 | Radiotechnique Compelec | METHOD FOR CONNECTING A SEMICONDUCTOR TO ELEMENTS OF A SUPPORT, PARTICULARLY A PORTABLE CARD |
US4645733A (en) * | 1983-11-10 | 1987-02-24 | Sullivan Donald F | High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates |
DE3518975A1 (en) * | 1985-05-25 | 1986-11-27 | Bayer Ag, 5090 Leverkusen | PLASTIC PART |
GB2212332A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Fabrication of electrical circuits |
DE3821121A1 (en) * | 1988-06-23 | 1990-02-08 | Ullmann Ulo Werk | Method of manufacture of contact carriers |
DE3901402A1 (en) * | 1989-01-19 | 1990-07-26 | Telefonbau & Normalzeit Gmbh | Method for the manufacture of a chip card |
US5595771A (en) * | 1994-11-04 | 1997-01-21 | Foltuz; Eugene L. | Modular mold for injection molding and method of use thereof |
DE19601202A1 (en) * | 1996-01-15 | 1997-03-06 | Siemens Ag | Data carrier card using moulded interconnect device technology |
JPH11161760A (en) * | 1997-11-26 | 1999-06-18 | Hitachi Ltd | Thin electronic circuit component and its manufacture and manufacturing device |
-
1999
- 1999-11-18 DE DE1999155538 patent/DE19955538B4/en not_active Expired - Lifetime
-
2000
- 2000-11-10 WO PCT/DE2000/003933 patent/WO2001037622A2/en active Application Filing
- 2000-11-10 AU AU25018/01A patent/AU2501801A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE19955538B4 (en) | 2014-06-05 |
WO2001037622A3 (en) | 2002-05-23 |
DE19955538A1 (en) | 2003-08-28 |
WO2001037622A2 (en) | 2001-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |