WO2003069023A1 - Procede et appareil de reparation de structure fine - Google Patents

Procede et appareil de reparation de structure fine Download PDF

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Publication number
WO2003069023A1
WO2003069023A1 PCT/JP2002/005320 JP0205320W WO03069023A1 WO 2003069023 A1 WO2003069023 A1 WO 2003069023A1 JP 0205320 W JP0205320 W JP 0205320W WO 03069023 A1 WO03069023 A1 WO 03069023A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
fine pattern
metal
repairing
film
Prior art date
Application number
PCT/JP2002/005320
Other languages
English (en)
Japanese (ja)
Inventor
Hiroshi Kiuchi
Yoshimitsu Nakamura
Original Assignee
Hyper Photon Systems, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyper Photon Systems, Inc. filed Critical Hyper Photon Systems, Inc.
Priority to JP2003568128A priority Critical patent/JPWO2003069023A1/ja
Priority to AU2002304123A priority patent/AU2002304123A1/en
Priority to KR10-2004-7010884A priority patent/KR20050004771A/ko
Publication of WO2003069023A1 publication Critical patent/WO2003069023A1/fr
Priority to HK05108450.1A priority patent/HK1076491A1/xx

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C20/00—Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Definitions

  • Fine pattern repair method and fine / turn repair device Fine pattern repair method and fine / turn repair device
  • the present invention relates to a method for repairing a fine pattern, and more particularly to a method for repairing a fine pattern by heating a liquid film to form a metal solid film, and also relates to an apparatus for repairing a fine pattern.
  • a liquid film is heated with hot air to form a solid film.
  • a solid film is formed by irradiating a laser
  • the use of a YAG laser with a wavelength of 1064 nm facilitates solidification of the liquid, but the action of the laser light is strong and covers the repaired part of the fine pattern.
  • the surface of the substrate or the fine pattern portion other than the liquid film to be irradiated may be damaged such as roughness.
  • a semiconductor laser with a wavelength of 800 nm has a problem that the light beam is thin and difficult to narrow down, and the fine pattern itself may be damaged.
  • the substrate is made of sheet glass or quartz glass which is easily affected by thermal shock, so that there is a problem that the substrate is cracked and the substrate may be broken.
  • the present invention provides a method for repairing a fine pattern in which a substrate is cracked and a substrate is not cracked when a liquid film is heated to form a solid film. And an apparatus. Disclosure of the invention
  • the present invention is directed to a fine pattern for repairing a fine pattern by heating a liquid film of a liquid material containing a metal formed on a defect portion of the fine pattern formed on the surface of the substrate to form a solid film of the metal.
  • a method for repairing a fine pattern is characterized in that high heat conduction means is brought into contact with the back surface of the substrate, and the surface of the substrate is reheated.
  • a fine pattern repair method for repairing a fine pattern by heating a liquid film of a liquid material containing a metal formed on a defective portion of the fine pattern formed on the surface of the substrate to form a solid film of the metal.
  • a method of repairing a fine pattern characterized in that a high heat conducting means is brought into contact with the back surface of the substrate, and the substrate is heated by injecting hot air from the front surface side of the substrate.
  • a fine pattern repair method for repairing a fine pattern by heating a liquid film of a liquid material containing a metal formed on a defective portion of the fine pattern formed on the surface of the substrate to form a solid film of the metal.
  • a method for repairing a fine pattern wherein a heat insulating means is brought into contact with the back surface of the substrate and heating is performed from the front surface side of the substrate.
  • a fine pattern repair method for repairing a fine pattern by heating a liquid film of a liquid material containing a metal formed on a defective portion of the fine pattern formed on the surface of the substrate to form a solid film of the metal.
  • a fine / ⁇ turn repair method characterized by heating from the back side of the substrate is provided.
  • a high thermal conductive plate comprising a hot air heater, the high thermal conductive plate, It is detachably adhered to the back surface of the substrate on which the liquid film of the liquid material containing metal is formed on the defect portion of the fine pattern formed on the surface, and the hot air heater is applied to the liquid film from the front surface side of the substrate.
  • a micropattern repair device characterized by forming a solid metal coating by injecting hot air and heating.
  • the high thermal conductive plate is in contact with the back surface of the substrate, the liquid film is heated from the surface of the substrate, and a solid film is formed from the liquid film.
  • the heat insulating layer comes into contact with the back surface of the substrate, the liquid film is heated from the surface of the substrate, and a solid film is formed from the liquid film.
  • the substrate is heated from the back surface, and the liquid film is heated by heat from the substrate side to form a solid film.
  • FIG. 1 is a conceptual diagram of a fine pattern repair apparatus according to one embodiment of the present invention.
  • FIG. 2 is a sectional view of a hot-air heater according to one embodiment of the present invention.
  • FIG. 3 is a diagram schematically illustrating a temperature distribution when a glass substrate adhered on a polyimide plate is heated by hot air from the surface thereof, for explaining one embodiment of the present invention.
  • FIG. 4 is a diagram schematically illustrating a temperature distribution when a glass substrate adhered on an aluminum plate is heated from the surface thereof with hot air for explaining one embodiment of the present invention.
  • FIG. 5 is a conceptual diagram of a fine pattern repair apparatus according to a second embodiment of the present invention.
  • FIG. 6 is a conceptual diagram of a fine pattern repair apparatus according to a third embodiment of the present invention. It is.
  • FIG. 7 is a conceptual diagram of a fine pattern repair apparatus according to a fourth embodiment of the present invention.
  • FIG. 8 is a conceptual diagram of a fine pattern repair apparatus according to a fifth embodiment of the present invention.
  • FIG. 9 is a conceptual diagram of a fine pattern repair apparatus according to a sixth embodiment of the present invention.
  • FIGS. Fig. 1 is a conceptual diagram of the fine pattern repair device
  • Fig. 2 is a cross-sectional view of a hot air heater
  • Fig. 3 schematically shows the temperature distribution when a glass substrate adhered on a polyimide plate is heated with hot air from its surface.
  • FIG. 4 and FIG. 4 are diagrams schematically showing a temperature distribution when a glass substrate adhered on an aluminum plate is heated by hot air from the surface thereof.
  • Two supports 3 are erected on the base 2 of the fine pattern repairing apparatus 1, and a stopping member 4 is installed on each of the supports 3.
  • a support 5 that can be elastically deformed up and down and that can be sufficiently extended is provided upright.
  • a metal plate 6 is supported on the support 5, and a substrate 7 is placed on the metal plate 6.
  • the substrate 7 has a fine chrome pattern 8 drawn on the c- substrate 7 which is suppressed and in close contact between the metal plate 6 and the restraining member 4, and the defective portion 9 is formed of silver as a metal by a liquid film forming apparatus (not shown).
  • a liquid film 10 of a liquid material containing a colloid is formed by a known method.
  • the hot-air heater 11 is held above the defective portion 9 of the fine pattern 8 of the substrate 7 by a holding member 12 erected on the base 2.
  • the metal plate 6 is an aluminum plate having a thickness of 0.2 to 1 mm and which is not easily deformed. A copper plate or a stainless steel plate may be used.
  • the plate is not necessarily limited to a metal plate as long as it has heat resistance at a temperature of about 300 to 400 degrees and has a high thermal conductivity, and includes, for example, aluminum nitride. It is sufficient that the area spreads about 3 cm around the defect 9, but it is often the case that there are multiple defects 9, and in order to place the substrate 7 on the support 5, Those having a wide area are easy to use.
  • the surface of the metal plate 6 facing the substrate 7 must be sufficiently flat so as to be in close contact with the substrate 7.
  • the substrate 7 is usually made of plate glass or quartz glass, and both surfaces are good polished surfaces.
  • the hot-air heater 11 is composed of a blower tube 13, a blower 14 and a heating unit 15.
  • the blower tube 13 is a thin metal cylinder having openings 13a and 13b at both ends.
  • the inner diameter of the central portion 13c is 8 mm, and the length between the openings 13a and 13b is 100 mm.
  • a blower 14 is connected to the opening 13a.
  • the blower 14 takes in air from the air inlet 14 a and sends it to the blower pipe 13.
  • the standard air volume is 150 ml per second.
  • the opening 13b is connected to the jet port 16.
  • the inside diameter of the tip of the spout 16 is 1 mm.
  • the heating section 15 is a 500 W heater, which is a nichrome wire electric heater wound around an air pipe 13 via an insulator (not shown).
  • the blower tube 13, the blower 14, and the heating section 15 are built in a cylindrical outer cylinder 17, and the ejection port 16 and the air intake port 14 a are exposed outside the outer cylinder 17.
  • the metal plate 6 is supported on the support 5, and the substrate 7 is further placed thereon.
  • the metal plate 6 has a sufficiently large area and can cope with a plurality of defective portions 9. Also, it has a smooth surface and a thickness that does not deform, and can be in close contact with the substrate 7.
  • the operation of bringing the substrate 7 into close contact with the metal plate 6 is as follows. First, the support table 5 is pressed downward by a pressing device (not shown) to be compressed. Next, the substrate 7 is placed on the metal plate 6. After applying the upper surface of the substrate 7 to the lower surface of the restraining member 4, the downward pressing force by the pressing device is removed. Then, the compression of the support 5 is loosened and extended. When the support base 5 is sufficiently extended, the substrate 7 is sandwiched between the metal plate 6 and the restraining member 4 and adheres under pressure.
  • the expansion and contraction of the support 5 can be performed manually without using the pressing device.
  • the liquid film 10 is at least 300 ° C or more and 400 ° C. Heated to below ° C to form a solid film. At this time, there is no crack in the substrate, the substrate does not crack, and no damage such as roughness occurs.
  • Aluminum and aluminum nitride are good conductors of heat, and polyimide is a poor conductor of heat.
  • FIG. 3 is a diagram schematically showing a temperature distribution when a glass substrate adhered on a polyimide plate is heated by hot air from the surface thereof.
  • the back surface 31 a of the glass substrate 31 is in close contact with the front surface 32 a of the polyimide plate 32.
  • the liquid film 33 is formed on the surface 31b of the substrate 31.
  • Part of the line 34 d belongs to the polyimide plate 32. Since there is no large difference in thermal conductivity between glass and polyimide, there is no large step in the contour of the line 34d and only a monotonous change. Then, after the portion exceeding 300 ° C. is expanded to the line 34, the liquid film 33 is sufficiently heated to complete the formation of the solid film 33a. There is a large difference in the spread in the surface direction between the front surface 3 1b and the back surface 3 1a of the substrate 3 1 of this line 3 4d, and a large temperature gradient between the two surfaces causes a large difference in the back surface 3 1a of the substrate 31. Tension distortion occurs. When this distortion cannot be tolerated, breakage of the substrate 31 is caused. In contrast, the temperature distribution is completely different for a glass substrate that is in close contact with an aluminum plate.
  • FIG. 4 is a diagram schematically showing a temperature distribution when a glass substrate adhered on an aluminum plate is heated from the surface by hot air.
  • the front surface 42 a of the aluminum plate 42 is in close contact with the back surface 41 a of the glass substrate 41.
  • a liquid film 43 is formed on a surface 41b of the substrate 41.
  • the line 44a which is the boundary line of the portion exceeding 300 ° C., spreads in the plane direction most greatly on the front surface 41b, but expands again when approaching the rear surface 41a.
  • the spread in the plane direction with the back surface 41a is not large. That is, there is no large temperature gradient between both sides. Therefore, the tensile strain generated on the back surface 41 a of the substrate 41 does not increase, and the substrate 41 is not damaged.
  • heating can be performed by light energy such as laser light instead of hot air.
  • FIG. 5 is a conceptual diagram of the fine butter repair device.
  • two columns 50 are erected, and the columns 50 are provided with members 51 that can be slid vertically with respect to the columns 50 by a sliding device (not shown).
  • a restraining member 53 is provided on the upper part of 1.
  • a support 52 is provided upright at the center of the base 2, and a receiver 54 is provided above the support 52. The metal plate 6 placed on the receiver 54 is in close contact with the substrate 7 suppressed by the stopping member 53.
  • the operation of the close contact is as follows. First, the member 51 is slid upward by a slide device (not shown). Next, the metal plate 6 is placed on the receiver 54, and the substrate 7 is further placed thereon. The upper surface of the substrate 7 is applied to the lower surface of the stopping member 53, and the member 51 is slid downward. Then, the substrate 7 is sandwiched between the metal plate 6 and the stopping member 53 and is brought into close contact under pressure.
  • a method of repairing a fine pattern according to a third embodiment of the present invention will be described with reference to FIG.
  • the same or similar parts as those of the above-described embodiments are denoted by the same reference numerals, and the detailed description of the same or similar parts is omitted.
  • a metal foil 55 is attached to the back surface of the substrate 7 corresponding to the liquid film 10 formed on the defective portion 9 of the fine pattern 8 formed on the surface of the substrate 7. Copper foil or aluminum foil with a thickness of 12 to 15 Um is suitable.
  • the substrate 7 is placed on a support 56 erected on the base 2 with the front side up. Installed above substrate 7 Hot air is blown from the hot air heater 11 to the defect 9 on the surface of the substrate 7. In both embodiments described above, reheating can be performed by light energy such as laser light instead of hot air.
  • a fine pattern repair method and a fine pattern repair apparatus will be described with reference to FIG.
  • the same or similar parts as those in the above-described embodiments are denoted by the same reference numerals, and the detailed description of the same or similar parts is omitted.
  • a support 63 is erected on the base 2, and a flat 61 is installed on the support 63.
  • the flat plate 61 is a rectangular flat plate 6 1a and an extremely low height of about 0.5 to 3 mm, a bank-shaped protrusion 6 1b erected on its four sides. 1b forms a quadrangular frame 61c with a smooth upper surface.
  • the substrate 7 is placed in close contact with the liquid film 10 formed on the defect 9 of the fine pattern 8 formed on the surface thereof so as to correspond to the frame 61c. You. Then, the substrate 7 and the flat 61 form a flat thin-layer space 62. Although the inside of the thin layer space 62 is usually filled with air at normal pressure, the pressure can be reduced by a pressure reducing device (not shown) if necessary. In this manner, the thin layer space 62 is formed as a heat insulating layer in contact with the back surface of the substrate 7. If necessary, a heat insulating material such as a synthetic resin thin film may be provided on the bottom of the flat 61 to further increase the heat insulating effect.
  • a heat insulating material such as a synthetic resin thin film may be provided on the bottom of the flat 61 to further increase the heat insulating effect.
  • the substrate 7 When hot air is blown from the hot air heater 11 to the defective portion 9 on the surface of the substrate 7, the substrate 7 is heated from the surface and heat is sequentially transferred to the inside of the substrate 7.
  • the thin layer space 62 acts as a heat insulating layer on the back surface of the substrate 7, and the heat conducted from the surface is accumulated without being dissipated outside the substrate 7, and the temperature difference between the front surface and the back surface does not increase. Therefore, the temperature gradient is not so large as to destroy the substrate 7, and the substrate 7 is not damaged.
  • the frame is formed in a flat body, but as another embodiment, a thin-layer space may be formed by placing a frame of a quadrilateral or other shape on a flat plate. it can. Also, a solid heat-insulating thin film can be attached to the back surface of the substrate.
  • a fine pattern repair method and a fine pattern repair apparatus will be described with reference to FIG.
  • the same or similar parts as those in the above-described embodiments are denoted by the same reference numerals, and the detailed description of the same or similar parts is omitted.
  • a support base 71 is erected on the base 2, and the substrate 7 is supported on the support base 71.
  • An extendable column 72 is also provided on the base 2, and a heating plate 73 having a smooth surface is fixed to the upper end of the column 72.
  • the heating plate 73 is connected to a power source (not shown).
  • the surface of the heating plate 73 is brought into close contact with the back surface of the substrate 7 so as to correspond to the liquid film 10 formed on the defective portion 9 of the fine pattern 8 formed on the surface of the substrate 7.
  • a metal foil can be inserted between the two to improve adhesion and thermal conductivity.
  • liquid film 10 is heated not from its surface but from the substrate 7 side, a high quality metal film with high uniformity is formed without wrinkles on the surface.
  • a fine pattern repair method and a fine pattern repair apparatus will be described with reference to FIG.
  • the same or similar parts as those in the above-described embodiments are denoted by the same reference numerals, and the detailed description of the same or similar parts is omitted.
  • a support 7 1 is erected on the base 2, and the substrate 7 is supported on the support 7 1 with the surface where the liquid film 10 is formed on the defective portion 9 of the fine pattern 8 facing up. . 20
  • Hot air is blown from a hot-air heater 11 installed below the substrate 7 toward a portion corresponding to the liquid film 10 on the back surface of the substrate 7 to heat the hot air.
  • the present invention has the following effects. That is, according to the present invention, when the liquid film formed on the surface of the substrate is heated to form the solid film portion, the substrate or the fine pattern is not damaged.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Surface Heating Bodies (AREA)

Abstract

La présente invention concerne un procédé de réparation de structure fine qui permet d'empêcher qu'un substrat ne craque et se brise ensuite lorsque l'on forme un film métallique à l'état solide en chauffant un revêtement liquide. Selon l'invention, on met une plaque à haute conductivité thermique ou une couche d'isolation thermique en butée contre la surface arrière d'un substrat muni d'un revêtement d'une matière liquide contenant un métal formé sur une partie défectueuse d'une structure fine formée à sa surface, et on chauffe ensuite la surface du substrat afin de former un revêtement à l'état solide, réparant de la sorte la structure fine. Dans un autre mode de réalisation, on chauffe la surface arrière du substrat pour former un revêtement à l'état solide, réparant de la sorte la structure fine. Le procédé de l'invention permet d'obtenir un substrat qui n'est ni craquelé, ni brisé.
PCT/JP2002/005320 2002-02-14 2002-05-30 Procede et appareil de reparation de structure fine WO2003069023A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003568128A JPWO2003069023A1 (ja) 2002-02-14 2002-05-30 微細パターン補修方法および微細パターン補修装置
AU2002304123A AU2002304123A1 (en) 2002-02-14 2002-05-30 Method for repairing fine pattern and apparatus for repairing fine pattern
KR10-2004-7010884A KR20050004771A (ko) 2002-02-14 2002-05-30 미세 패턴 보수 방법 및 미세 패턴 보수 장치
HK05108450.1A HK1076491A1 (en) 2002-02-14 2005-09-26 Method for repairing fine pattern and apparatus for repairing fine pattern

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002036079 2002-02-14
JP2002-36079 2002-02-14

Publications (1)

Publication Number Publication Date
WO2003069023A1 true WO2003069023A1 (fr) 2003-08-21

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PCT/JP2002/005320 WO2003069023A1 (fr) 2002-02-14 2002-05-30 Procede et appareil de reparation de structure fine

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JP (1) JPWO2003069023A1 (fr)
KR (1) KR20050004771A (fr)
CN (1) CN100390318C (fr)
AU (1) AU2002304123A1 (fr)
HK (1) HK1076491A1 (fr)
WO (1) WO2003069023A1 (fr)

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Publication number Priority date Publication date Assignee Title
US20130341077A1 (en) * 2012-06-25 2013-12-26 Ibiden Co., Ltd. Method for repairing disconnection in wiring board, method for manufacturing wiring board, method for forming wiring in wiring board and wiring board
CN104768331B (zh) * 2015-03-30 2018-01-23 深圳崇达多层线路板有限公司 一种pcb中线路开路的修补方法

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JPH0219838A (ja) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd 配線パターンの修正法
JPH0267517A (ja) * 1988-09-02 1990-03-07 Seiko Epson Corp 液晶表示パネルの製造方法
JPH0385523A (ja) * 1989-08-29 1991-04-10 Sharp Corp 透明電極の欠陥修正方法
JPH06104255A (ja) * 1992-09-14 1994-04-15 Hoya Corp レーザ加工装置
US5883437A (en) * 1994-12-28 1999-03-16 Hitachi, Ltd. Method and apparatus for inspection and correction of wiring of electronic circuit and for manufacture thereof
US20010006722A1 (en) * 1997-10-20 2001-07-05 Alps Electric Co., Ltd Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate

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Publication number Priority date Publication date Assignee Title
JP2559264B2 (ja) * 1987-12-17 1996-12-04 富士写真フイルム株式会社 ハロゲン化銀乳剤及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219838A (ja) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd 配線パターンの修正法
JPH0267517A (ja) * 1988-09-02 1990-03-07 Seiko Epson Corp 液晶表示パネルの製造方法
JPH0385523A (ja) * 1989-08-29 1991-04-10 Sharp Corp 透明電極の欠陥修正方法
JPH06104255A (ja) * 1992-09-14 1994-04-15 Hoya Corp レーザ加工装置
US5883437A (en) * 1994-12-28 1999-03-16 Hitachi, Ltd. Method and apparatus for inspection and correction of wiring of electronic circuit and for manufacture thereof
US20010006722A1 (en) * 1997-10-20 2001-07-05 Alps Electric Co., Ltd Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate

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CN1617950A (zh) 2005-05-18
HK1076491A1 (en) 2006-01-20
JPWO2003069023A1 (ja) 2005-06-02
KR20050004771A (ko) 2005-01-12
AU2002304123A1 (en) 2003-09-04
CN100390318C (zh) 2008-05-28

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