HK1076491A1 - Method for repairing fine pattern and apparatus for repairing fine pattern - Google Patents

Method for repairing fine pattern and apparatus for repairing fine pattern

Info

Publication number
HK1076491A1
HK1076491A1 HK05108450.1A HK05108450A HK1076491A1 HK 1076491 A1 HK1076491 A1 HK 1076491A1 HK 05108450 A HK05108450 A HK 05108450A HK 1076491 A1 HK1076491 A1 HK 1076491A1
Authority
HK
Hong Kong
Prior art keywords
fine pattern
repairing fine
repairing
pattern
fine
Prior art date
Application number
HK05108450.1A
Inventor
Hiroshi Kiuchi
Yoshimitsu Nakamura
Original Assignee
Hyper Photon Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyper Photon Systems Inc filed Critical Hyper Photon Systems Inc
Publication of HK1076491A1 publication Critical patent/HK1076491A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C20/00—Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Surface Heating Bodies (AREA)
HK05108450.1A 2002-02-14 2005-09-26 Method for repairing fine pattern and apparatus for repairing fine pattern HK1076491A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002036079 2002-02-14
PCT/JP2002/005320 WO2003069023A1 (en) 2002-02-14 2002-05-30 Method for repairing fine pattern and apparatus for repairing fine pattern

Publications (1)

Publication Number Publication Date
HK1076491A1 true HK1076491A1 (en) 2006-01-20

Family

ID=27678074

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05108450.1A HK1076491A1 (en) 2002-02-14 2005-09-26 Method for repairing fine pattern and apparatus for repairing fine pattern

Country Status (6)

Country Link
JP (1) JPWO2003069023A1 (en)
KR (1) KR20050004771A (en)
CN (1) CN100390318C (en)
AU (1) AU2002304123A1 (en)
HK (1) HK1076491A1 (en)
WO (1) WO2003069023A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130341077A1 (en) * 2012-06-25 2013-12-26 Ibiden Co., Ltd. Method for repairing disconnection in wiring board, method for manufacturing wiring board, method for forming wiring in wiring board and wiring board
CN104768331B (en) * 2015-03-30 2018-01-23 深圳崇达多层线路板有限公司 The method for repairing and mending of open lines in a kind of PCB

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2559264B2 (en) * 1987-12-17 1996-12-04 富士写真フイルム株式会社 Silver halide emulsion and method for producing the same
JPH0219838A (en) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd Method for correcting wiring pattern
JPH0267517A (en) * 1988-09-02 1990-03-07 Seiko Epson Corp Production of liquid crystal display panel
JPH0385523A (en) * 1989-08-29 1991-04-10 Sharp Corp Method for correcting defect of transparent electrode
JPH06104255A (en) * 1992-09-14 1994-04-15 Hoya Corp Laser processing apparatus
KR100213603B1 (en) * 1994-12-28 1999-08-02 가나이 쯔또무 Wiring correcting method and its device of electronic circuit substrate, and electronic circuit substrate
JPH11189883A (en) * 1997-10-20 1999-07-13 Alps Electric Co Ltd Substrate having recovered metallic pattern, method for recovering metallic pattern in substrate and recovering device

Also Published As

Publication number Publication date
AU2002304123A1 (en) 2003-09-04
CN1617950A (en) 2005-05-18
CN100390318C (en) 2008-05-28
JPWO2003069023A1 (en) 2005-06-02
KR20050004771A (en) 2005-01-12
WO2003069023A1 (en) 2003-08-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20130530