CN100390318C - 细微图案修补方法和细微图案修补装置 - Google Patents

细微图案修补方法和细微图案修补装置 Download PDF

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Publication number
CN100390318C
CN100390318C CNB02827895XA CN02827895A CN100390318C CN 100390318 C CN100390318 C CN 100390318C CN B02827895X A CNB02827895X A CN B02827895XA CN 02827895 A CN02827895 A CN 02827895A CN 100390318 C CN100390318 C CN 100390318C
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CN
China
Prior art keywords
fine pattern
substrate
tunicle
glass substrate
repairing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB02827895XA
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English (en)
Chinese (zh)
Other versions
CN1617950A (zh
Inventor
木内浩
中村义光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HYPER PHOTON SYSTEMS Inc
Original Assignee
HYPER PHOTON SYSTEMS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HYPER PHOTON SYSTEMS Inc filed Critical HYPER PHOTON SYSTEMS Inc
Publication of CN1617950A publication Critical patent/CN1617950A/zh
Application granted granted Critical
Publication of CN100390318C publication Critical patent/CN100390318C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C20/00—Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Surface Heating Bodies (AREA)
CNB02827895XA 2002-02-14 2002-05-30 细微图案修补方法和细微图案修补装置 Expired - Fee Related CN100390318C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36079/2002 2002-02-14
JP2002036079 2002-02-14

Publications (2)

Publication Number Publication Date
CN1617950A CN1617950A (zh) 2005-05-18
CN100390318C true CN100390318C (zh) 2008-05-28

Family

ID=27678074

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB02827895XA Expired - Fee Related CN100390318C (zh) 2002-02-14 2002-05-30 细微图案修补方法和细微图案修补装置

Country Status (6)

Country Link
JP (1) JPWO2003069023A1 (fr)
KR (1) KR20050004771A (fr)
CN (1) CN100390318C (fr)
AU (1) AU2002304123A1 (fr)
HK (1) HK1076491A1 (fr)
WO (1) WO2003069023A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130341077A1 (en) * 2012-06-25 2013-12-26 Ibiden Co., Ltd. Method for repairing disconnection in wiring board, method for manufacturing wiring board, method for forming wiring in wiring board and wiring board
CN104768331B (zh) * 2015-03-30 2018-01-23 深圳崇达多层线路板有限公司 一种pcb中线路开路的修补方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02838A (ja) * 1987-12-17 1990-01-05 Fuji Photo Film Co Ltd ハロゲン化銀乳剤及びその製造方法
US20010006722A1 (en) * 1997-10-20 2001-07-05 Alps Electric Co., Ltd Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219838A (ja) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd 配線パターンの修正法
JPH0267517A (ja) * 1988-09-02 1990-03-07 Seiko Epson Corp 液晶表示パネルの製造方法
JPH0385523A (ja) * 1989-08-29 1991-04-10 Sharp Corp 透明電極の欠陥修正方法
JPH06104255A (ja) * 1992-09-14 1994-04-15 Hoya Corp レーザ加工装置
KR100213603B1 (ko) * 1994-12-28 1999-08-02 가나이 쯔또무 전자회로기판의 배선수정방법 및 그 장치와 전자회로기판

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02838A (ja) * 1987-12-17 1990-01-05 Fuji Photo Film Co Ltd ハロゲン化銀乳剤及びその製造方法
US20010006722A1 (en) * 1997-10-20 2001-07-05 Alps Electric Co., Ltd Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate

Also Published As

Publication number Publication date
JPWO2003069023A1 (ja) 2005-06-02
WO2003069023A1 (fr) 2003-08-21
HK1076491A1 (en) 2006-01-20
CN1617950A (zh) 2005-05-18
KR20050004771A (ko) 2005-01-12
AU2002304123A1 (en) 2003-09-04

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