WO2003067949A1 - Mecanisme de refroidissement et dispositif de traitement d'informations utilisant un mecanisme de refroidissement - Google Patents

Mecanisme de refroidissement et dispositif de traitement d'informations utilisant un mecanisme de refroidissement Download PDF

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Publication number
WO2003067949A1
WO2003067949A1 PCT/JP2003/000937 JP0300937W WO03067949A1 WO 2003067949 A1 WO2003067949 A1 WO 2003067949A1 JP 0300937 W JP0300937 W JP 0300937W WO 03067949 A1 WO03067949 A1 WO 03067949A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat sink
air
cooling
housing
Prior art date
Application number
PCT/JP2003/000937
Other languages
English (en)
Japanese (ja)
Inventor
Toshio Hashimoto
Original Assignee
Sony Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corporation filed Critical Sony Corporation
Priority to JP2003567149A priority Critical patent/JPWO2003067949A1/ja
Publication of WO2003067949A1 publication Critical patent/WO2003067949A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention radiates heat generated from a heat generating element disposed in a housing of an information processing device such as a personal computer to the outside of the housing. And a data processing apparatus using the cooling mechanism.
  • BACKGROUND ART mobile is in this kind of an information processing apparatus miniaturized information processing apparatus is used to a size capable, c notebook personal computers with Notopukku type personal computer, A computer main body provided with a keyboard constituting input means and a display unit for performing various displays are provided integrally.
  • the main body of the computer houses electronic components such as a CPU (Central Processing Unit) together with a recording / reproducing unit that records data handled by the computer.
  • Electronic components such as CPUs generate large heat when driven.
  • a cooling mechanism is provided in the main body of the computer to radiate heat generated from electronic components such as the CPU to the outside of the housing constituting the main body of the computer.
  • a forced cooling method using a fan motor is mainly used as the thickness of a housing constituting a computer main body is reduced.
  • the fan motor drives the cooling air generated by the rotating fan to the cooling fins of the heat sink to generate heat from the heating elements such as electronic components. To the outside of the housing.
  • the use of the cooling mechanism employing the forced cooling method has the following problems. Even if the computational load applied to the heating elements such as CPU is small and the heat generated by the heating elements is small, the fan motor is running at full speed. For this reason, the power consumption of the fan motor cannot be reduced even when the heat generation amount of the heating element is small, and the power consumption of the entire computer cannot be reduced. Furthermore, since the fan motor always rotates at full speed, noise such as wind noise generated by the rotation of the fan is constantly generated. 'In addition, the heat sink used in the cooling mechanism needs to have a large heat dissipation area to improve heat dissipation efficiency. Methods for increasing the heat dissipation area include narrowing the pitch between the heat dissipation fins of one heat sink and increasing the height of the heat dissipation fins.
  • heat sinks used in the cooling mechanism are made of aluminum die-cast products, so the pitch between the heat radiation fins provided on one heat sink can be narrowed, or the height of the fins can be reduced. There is a limit to raising it, and there is a limit to improving the heat dissipation effect. The same problem occurs when one heat sink is formed by extruding a metal material such as aluminum using an extruded material.
  • An object of the present invention is to provide a novel cooling mechanism and an information processing apparatus that can solve the problems of the conventional cooling mechanism and the information processing apparatus using the cooling mechanism as described above. It is to provide a device.
  • Another object of the present invention is to provide a cooling mechanism and an information processing apparatus which can switch a cooling state according to a heat generation state of a heat generating element such as an electronic component arranged in an apparatus main body of an information processing apparatus. It is in.
  • the present invention is a cooling mechanism for dissipating heat from the heat generating element disposed in the housing to the outside of the housing, and comprises: a heat sink; and a heat sink for transferring heat of the heat generating element in the housing to the heat sink.
  • the heat release portion has a plurality of air holes formed at positions corresponding to the heat sink to take in air from outside into the housing during natural cooling.
  • the air discharge hole of the heat release section is open during natural cooling, has an opening / closing section for closing during forced cooling, and has another air hole for discharging heat from the heating element to the outside of the housing during forced cooling.
  • the heat sink used in the cooling mechanism according to the present invention includes: a first heat sink having a plurality of radiating fins; and a second heat sink combined with the first heat sink and having a plurality of radiating fins. It is formed by providing a space between the fins and the radiating fins of the second heat sink, and has an air passage portion for allowing air to contact and pass through the radiating fins of the first heat sink and the radiating fins of the second heat sink. .
  • the first heat sink has a heat radiating fin and a base for arranging the heat radiating fins in parallel
  • the second heat sink has a heat radiating fin and a base for arranging the heat radiating fins in parallel.
  • the end of the heat sink fin of the first heat sink is connected to the base of the second heat sink via thermal conductive grease
  • the end of the heat sink of the second heat sink is connected to the base of the first heat sink. Contact via thermal conductive grease Has been continued.
  • the present invention is an information processing apparatus having a cooling mechanism for radiating heat from a heating element provided in a housing to the outside of the housing, and the cooling mechanism provided in the information processing apparatus includes a heat sink and a heat sink.
  • a heat pipe for transmitting heat of the heating element in the housing to the heat sink; a fan motor for blowing cooling air to the heat sink; and a housing for housing the heat sink, the heat pipe, and the fan motor.
  • the fan motor is driven according to the amount of heat generated by the heat-generating element to apply cooling air to the heat sink to perform forced cooling and when the heat sink is naturally cooled, the heat of the heat-generating element is A heat-dissipating part provided in the housing for discharging the heat to the outside of the body.
  • the heat sink used for the cooling mechanism of the information processing apparatus includes: a first heat sink having a plurality of heat radiating fins; and a second heat sink combined with the first heat sink and having a plurality of heat radiating fins. It is formed by providing a space between the radiator fins of the first heat sink and the radiator fins of the second heat sink. And an air passage section for
  • FIG. 1 is a perspective view showing a portable computer using a cooling mechanism according to the present invention.
  • FIG. 2 is a perspective view showing a cooling mechanism according to the present invention,
  • FIG. 3 is a side view thereof, and
  • FIG. 4 is a plan view.
  • FIG. 5 is a plan view showing another example of the fan motor used in the cooling mechanism according to the present invention.
  • FIG. 6 is a side view showing an example of the structure of the cooling mechanism of the computer shown in Fig. 1 and showing a state in which the fan is rotating and performing forced cooling.
  • FIG. 8 is a side view showing another embodiment of the cooling mechanism according to the present invention.
  • FIG. 9 is a side view showing still another embodiment of the cooling mechanism according to the present invention, showing a state in which the fan is being rotated for forced cooling
  • FIG. 10 is a view in which the fan is stopped. It is a side view which shows the state which is cooling naturally.
  • FIG. 11 is a perspective view showing another example of a cooling mechanism provided with a heat sink
  • FIG. 12 is a side view thereof.
  • FIG. 13 is a front view showing another example of the heat sink used in the cooling mechanism according to the present invention. '
  • FIG. 14 is a front view showing still another example of the heat sink used in the cooling mechanism according to the present invention.
  • FIG. 15 is a front view showing still another example of the heat sink used in the cooling mechanism according to the present invention.
  • FIG. 16 is a front view showing still another example of the heat sink used in the cooling mechanism according to the present invention.
  • FIG. 17 is a front view showing still another example of the heat sink used in the cooling mechanism according to the present invention.
  • FIG. 18 is a front view showing still another example of the heat sink used in the cooling mechanism according to the present invention.
  • FIG. 19 is a front view showing still another example of the heat sink used in the cooling mechanism according to the present invention.
  • FIG. 20 is a front view showing still another example of the heat sink used in the cooling mechanism according to the present invention.
  • BEST MODE FOR CARRYING OUT THE INVENTION embodiments of a cooling mechanism according to the present invention and an information processing apparatus using the cooling mechanism will be described in detail with reference to the drawings.
  • the notebook personal computer 1 to which the cooling mechanism according to the present invention is applied is provided with a keyboard 5 constituting an input means for inputting commands and data to the computer. It comprises a computer body 3 and a display section 2 for performing various displays.
  • the keyboard 5 is provided on the upper surface side of the computer main body 3.
  • the display unit 2 is rotatably connected to the computer main body 3 via a rotatable connection unit 4.
  • the display unit 2 is turned on the keyboard 5 to cover the upper surface of the computer main body 3 on which the keyboard 5 is provided.
  • the housing 6 constituting the computer main body 3 is made of plastic or metal.
  • the casing 6 houses the cooling mechanism 10 according to the present invention.
  • the cooling mechanism 10 includes a heat sink 14, a heat pipe 16, a fan motor 18, and a heat receiving block 20. And a heat emitting portion 50 formed as a part of the housing 6.
  • a circuit board 24 is mounted in a housing 6 constituting the computer main body 3.
  • a CPU (Central Processing Unit) 26 is electrically connected.
  • CPU 26 is a type of heat generating element that generates heat when energized and driven.
  • the fan motor 18, the heat sink 1, and the sink 14 may be mounted on the circuit board 24, or may be fixed to the inner surface 6 d of the lower housing half 6 b of the housing 6.
  • the heat sink 14 shown in FIG. 2 is made of a metal having excellent thermal conductivity and heat dissipation, for example, aluminum copper.
  • the heat sink 14 may be formed by cutting an aluminum block or by bending an aluminum plate or a copper plate.
  • the heat sink 14 produced by any of the methods has a base 30 and several heat radiation fins 33.
  • the base 30 is a flat plate-shaped portion, and a plurality of heat radiation fins 33 are formed perpendicular to the base 30.
  • the plurality of radiating fins 33 are formed in parallel at equal intervals.
  • the heat receiving block 20 is in close contact with the upper surface of the CPU 26 via, for example, a sheet-like heat conducting member.
  • the heat receiving block 20 is fixed to the surface of the circuit board 24 by screws, for example.
  • Heat receiving block 2 0 7 is connected to a heat sink 14 using a heat pipe 16.
  • Heat pipe 16 is a heat transport device that contains a small amount of liquid in a metal sealed tube. In the heat pipe 16, the heat of the heat receiving block 20 is absorbed from one end by the evaporation of the liquid, and the heat is released from the other end to the heat sink 14 by the condensation of the liquid.
  • the arrangement direction of the heat pipe 16 is a direction orthogonal to the extension direction of the radiation fins 33.
  • a centrifugal fan type as shown in FIG. 4 is preferably used. Since the fan motor 18 shown in FIG. 4 is a centrifugal fan type, it has an air inlet 34 and an air outlet 36.
  • the air intake 34 is also called a fan intake
  • the air exhaust 36 is also called a fan exhaust.
  • the air inlet 34 and the air outlet 36 are formed so as to be orthogonal to each other as shown in FIG.
  • the direction of the arrow Y2 which is the air discharge direction, is a direction parallel to the direction in which the heat radiation fins 33 of the heat sink 14 extend in parallel with each other.
  • the opening area of the air intake port 34 that is, the area for air intake can be increased, and the cooling capacity of the fan motor 18 can be improved.
  • the fan motor 18 of the centrifugal fan type can send the cooling air 40 sent to the heat sink 14 uniformly because the air velocity distribution at the air outlet 36 is uniform. is there.
  • the cooling capacity of the heat sink 14 can be improved, the heat radiation capacity of the heat generated from 0 to 11 26 can be improved, and the turbulence of the air generated in the heat sink 14 can be reduced to reduce the noise.
  • an axial fan or a fan as shown in FIG. 5 may be used as the fan motor 18, an axial fan or a fan as shown in FIG. 5.
  • the type of fan motor 18 shown in FIG. 5 has a fan 1 18 a and an air intake 1 34, and the air sucked through the air intake 1 34 is indicated by an arrow Y in FIG.
  • the paper of FIG. 5 along three directions, ie parallel to the axis of the fan 118 a It is sucked downward in a direction perpendicular to the surface.
  • the air sucked by the rotation of the fan 118a is sent to the outside of the fan motor 18 as the cooling air 40 through the air outlet 36a.
  • the fan motor 18 used in the cooling mechanism 10 shown in FIGS. 2, 3 and 4 uses a centrifugal fan type motor, the fan motor 18 has a centrifugal fan 18a.
  • Centrifugal fan 1 8 a is cooling mechanism 1 0 according to c present invention which is continuously rotated about the center axis CL is used sirocco fan or an axial flow fan such as shown in FIG. 5 in place of the motor of the centrifugal fan type You may. ⁇
  • FIG. 6 shows a state in which the fan motor 18, the heat sink 14, the heat generating element 26, and the heat receiving block 20 shown in FIG. 2 are housed in the housing 6 constituting the computer main body 3.
  • the housing 6 is a part of the computer main body 3 shown in FIG. 1, and is made of, for example, plastic. Housing 6 is formed by the upper housing half 6 a and the side housing half 6 c and the lower housing half 6 b abutting integral with each other.
  • the internal space S of the housing 6 houses the fan motor 18, the heat sink 14, the heat receiving block 20, the heat pipe 16, the CPU 26, and the like as described above.
  • the housing 6 forming the computer main body 3 is provided with a heat emitting section 50.
  • the heat release section 50 is formed in the upper housing half 6a, the side housing half 6c and the lower housing half 6b.
  • the heat releasing section 50 is used for forced cooling, in which the fan motor 18 is driven in accordance with the amount of heat generated by the CPU 26 to apply cooling air 40 to the heat sink 14 to perform forced cooling, and Provided to discharge the heat of the CPU 26 to the outside of the housing 6 during natural cooling, in which the cooling air is not forcibly applied to the heat sink 14 without driving the motor 18.
  • the heat emitting portion 50 has a plurality of air holes 60, a plurality of air holes 70, and a plurality of other air holes 75.
  • the air discharge hole 60 is formed in the upper housing half 6 a of the housing 6. These air discharge holes 60 are formed at positions near the keyboard 5 provided on the upper surface side of the computer main body 3 and opposed to the heat sink 14. Air release hole 9
  • the 60 may be formed in a grid shape, or may be dispersed as circular or elliptical, or even square-shaped holes, and may be arranged at equal intervals, for example.
  • the air hole 70 is formed in the lower housing half 6 b of the housing 6.
  • the plurality of air holes 70 may be formed in a grid shape, or may be dispersed as circular or elliptical or even rectangular holes, for example, arranged at equal intervals. .
  • the plurality of air holes 70 are formed at positions facing the heat sink 14.
  • the air discharge holes 60 are located on the side of the heat sink 14 where the heat radiation fins 33 protrude, and the air holes 70 are provided at positions facing the base 30 side of the heat sink 14. ing.
  • the air hole 75 is formed on the inclined side surface of the side housing half 6c.
  • the air holes 75 are desirably formed at positions where the cooling air 40 passing between the heat radiating fins 33 of the heat sink 14 can be discharged almost directly to the outside of the housing 6.
  • FIG. 6 shows a forced cooling state in which the fan 18a of the fan motor 18 is continuously rotating to perform forced cooling.
  • FIG. 7 shows a state in which the fan 18a is naturally cooled without rotating.
  • FIG. 6 shows a state in which the fan 18 a rotates and the heat sink 14 is forcibly cooled by the cooling air 40.
  • FIG. 7 shows a state in which the rotation of the fan 18a is stopped and the heat sink 14 is naturally cooled.
  • FIG. 2 when the fan 18a of the fan motor 18 rotates, air is taken into the fan motor 18 from the air intake 34 along the Y1 direction.
  • the intake air flows along the direction of arrow Y 2 in FIGS. 2 and 4 and is sent between the heat radiation fins 33 of the heat sink 14. Since the cooling air 40 passes between the grooves of the radiation fins 33, the radiation fins 33 are forcibly cooled.
  • the cooling air 40 thus circulated passes between the radiating fins 33 and is discharged from the air holes 75 to the outside of the housing 6.
  • the heated air flows from the heat sink 14 to the air hole 70 and the air discharge hole 60 in the directions of the arrows Y5 and Y6, respectively, and is discharged out of the housing 6. .
  • the fan motor 18 is driven to forcibly cool the heat sink 14.
  • an air hole 75 is formed in the side housing half 6 c constituting the housing 6, and an air hole 70 is formed in the lower housing half 6, whereby the upper portion is formed.
  • the heat sink 14 can be efficiently cooled using the so-called chimney effect in relation to the air discharge holes 60 of the housing half 6a. .
  • Both the forced cooling system shown in Fig. 6 and the natural cooling system shown in Fig. 7 can be selectively used. In comparison, power consumption can be reduced and noise such as wind noise can be reduced.
  • the cooling mechanism 10 shown in FIG. 8 is substantially the same as the cooling mechanism 10 shown in FIG. 6 and FIG. Since they are common, common parts are denoted by common reference numerals and detailed description is omitted.
  • the distance between the upper housing half 6a and the lower housing half 6b of the housing 6 is set to be larger.
  • the height of the side housing half 6 c increases, and the distance L from the inner surface of the upper housing half 6 a to the base 30 of the heat sink 14 is the height L of the heat sink 14. It is set considerably larger than.
  • the opening / closing section 80 allows the air discharge hole 60 to be opened and closed freely. As shown in Fig. 9, in the forced cooling state in which the fan 18a is rotating, the opening / closing section 80 automatically closes the air discharge hole 60 by the generated cooling air 41. On the other hand, in the natural cooling state when the fan is stopped as shown in FIG. 10, the opening / closing section 80 rotates toward the inside of the housing 6 around the center 85 by its own weight. As a result, the air discharge hole 60 can be automatically opened.
  • the opening / closing section 80 goes down by its own weight and the air discharge hole 60 is opened, so that the heat of the heat sink 14 passes through the air discharge hole 60. It flows along the direction of the arrow Y 6 in FIG. 10 and is discharged to the outside of the housing 6, and the outside air flows through the air holes 70 inside the housing 6 along the direction of the arrow Y 7 in FIG. Then, outside air enters the housing 6 through the air hole 75 along the direction of the arrow Y8 in FIG. 0937
  • the mode can be switched between the forced cooling mode and the natural cooling mode, and the heat stored in the heat sink 14 can be efficiently cooled.
  • the use of the cooling mechanism according to the present invention has the following advantages.
  • the fan motor does not always run at full rotation, the power consumption of the entire device can be reduced, so that the battery used in the information processing device can be reduced and the device can be used for a long time. Since the fan motor is not constantly driven, an information processing device with low noise can be configured. For example, by using a centrifugal fan as the fan motor, the intake port (air intake port) can be made large and a large air volume can be realized. By performing natural cooling using the chimney effect in the housing, a natural cooling module that does not use fans can be realized.
  • the static pressure can be reduced and noise can be reduced even when the fan is running.
  • heat generated from a heat-generating element such as a CPU is transferred to a heat sink and released to the outside air environment. Cooling can be provided. If the heating elements generate a lot of heat, forced cooling is possible, in which the fan motor is driven and the air sent from the fan motor is applied to the heat sink to release the heat.
  • the air intake can be widened while further reducing the thickness of information processing devices such as personal computers, and by improving the heat dissipation efficiency by extracting the maximum air volume of the centrifugal fan. Can be.
  • the position of the air intake port 34 of the fan motor 18 is determined by changing the position of the air release hole 60, the air hole 70, and the air hole of the heat release section 50 of the housing 6. It is located far away from 5. For this reason, the airflow is less likely to be disturbed and noise can be prevented, as compared with, for example, a type in which the position of the air intake hole of the fan motor and the position of the air discharge hole on the housing side are close.
  • the cooling mechanism 10 according to the present invention employs a centrifugal fan type fan motor 18 shown in FIG. 4 to provide a housing that is smaller than an axial flow fan or a sirocco fan type fan motor shown in FIG. Can be further reduced in thickness. That is, by using the fan motor 18 of the type shown in FIG. 4, the air intake port 34 can take in air from a direction perpendicular to the thickness direction of the housing 6.
  • the present invention is not limited to the above embodiment.
  • the shape of the air discharge hole 60, the air hole 70, and the air hole 75 of the heat release portion 50 shown in FIG. 6 described above is not limited to a grid-like (grid-like) or slit-like hole.
  • the hole may have a circular shape, an elliptical shape, or another shape.
  • FIG. 1 1 to 1 may be one which is configured as shown in 3 c Figure 1 1 to 1
  • the heat sink 114 shown in FIG. 3 is generally configured by combining a first heat sink 150 and a second heat sink 160.
  • the first heat sink 150 constituting the heat sink 114 has a base 152 and a plurality of radiation fins 154.
  • the second heat sink 160 has a base 162 and a plurality of radiating fins 164.
  • the first heat sink 150 and the second heat sink 160 are both formed of a metal having excellent heat dissipation, for example, aluminum die casting.
  • the first heat sink 150 is hatched to distinguish the first and second heat sinks 150 and 160, and the second heat sink 150 is hatched. 60 is displayed without hatching.
  • the heat radiation fins 154 of the first heat sink 150 are formed at a predetermined pitch P and perpendicular to the base 152.
  • the cross section of each heat radiation fin 154 is substantially rectangular.
  • the base 152 is a flat member.
  • the base 162 of the second heat sink 160 is a plate-shaped member.
  • the heat radiating fins 164 are formed in parallel with the base 162 at a predetermined pitch P.
  • the cross section of each heat radiation fin 164 is also substantially rectangular.
  • the protruding length R of the radiation fins 15 4 and 16 4 is set to be equal.
  • the heat radiation fins 15 of the first heat sink 150 and the heat radiation fins 16 of the second heat sink 16 An air passage section 170 is formed between 54 and the heat radiation fins 16 4.
  • the air passage section 170 is a space for passing the cooling air in the Y2 direction sent by the centrifugal fan 18A of the fan motor 18 as shown in FIG. This allows the cooling air to pass through the air passage section 170 along the Y3 direction.
  • a thermally conductive grease 180 is provided between the inner bottom surface 62 a of the base 16 2.
  • a thermal conductive ball 180 is arranged between the end 16 4 a of the heat radiation fin 16 4 and the inner bottom surface 15 2 a of the base 15 2.
  • thermally conductive greases 180 are also referred to as high thermal conductive greases. '
  • the pitch between the radiating fins 15 4 and the radiating fins 16 4 is arranged at the pitch of P'2 compared to using one heat sink. Therefore, the pitch of the so-called heat radiation fins can be easily reduced, and the cooling capacity of the heat sink 114 can be further increased.
  • the heatsink 114 shown in Fig. 13 is prepared in advance with a first heatsink 150 having wide pitch radiation fins 150 and a second heat sink 160 having wide pitch radiation fins 164, respectively.
  • first heat sink 150 and the second heat sink 160 it is possible to easily obtain a heat sink 114 having a narrow pitch heat radiation fin.
  • FIG. 14 is a diagrammatic representation of the heat sink used in the cooling mechanism 10 according to the present invention.
  • the heat sink 1 and the sink 2 14 shown in FIG. 21 have a first heat sink 250 and a second heat sink 260.
  • the first heat sink 250 has a substantially U-shaped base 252 and a plurality of heat radiation buses 254.
  • the heat radiating fins 25 4 are provided at a predetermined pitch in parallel with the vertical portion 253 of the base portion 252.
  • the second heat sink 260 has a base portion 262 and a plurality of heat dissipation fins 264.
  • the heat dissipating fins 26 4 are formed perpendicularly and parallel to the base 26 2 (when the first heat sink 250 and the second heat sink 260 are combined, the heat dissipating fins 25 4 Is connected to the inner bottom surface of the base 2 52 using thermal conductive grease 180.
  • the end of the heat radiation fin 26 4 is connected to the inner bottom surface of the base 26 2. Is connected via thermal conductive grease 180.
  • the vertical portion 25 3 of the first heat sink 250 is connected to the facing side surface of the heat radiating fin 26 4 via thermal conductive grease 180.
  • the pitch of the heat radiation fins 25 4 and 26 4 of the heat sink 2 14 can be made narrower, and the cooling capability of the heat sink 2 14 can be increased. Can be.
  • FIG. 15 shows still another example of the heat sink 3 14.
  • the heat sink 2 14 shown in FIG. 15 has a first heat sink 350 and a second heat sink 360 like the heat sink shown in FIG.
  • the first heat sink 360 has a base 352 and a plurality of heat radiation fins 354.
  • the second heat sink 360 has a base 362 and a plurality of radiating fins 364.
  • the heat sink 3 14 is provided with a concave portion 99 in each of a base portion 35 2 and a base portion 36 2.
  • the heat conductive grease 180 is accommodated in the upper part 99.
  • the ends of the radiation fins 354 are fitted and fixed in the recesses 99 via the heat conductive grease 180.
  • the ends of the radiating fins 364 are fitted and connected by using the heat conductive grease 180 in the recessed portion 99.
  • the heat sink 4 14 shown in FIG. 16 is configured by combining a first heat sink 450, a second heat sink 450, and a third heat sink 200.
  • the first heat sink 450 has a base 452 and a plurality of radiating fins 454.
  • the second heat sink 460 has a base 462 and a plurality of heat radiating fins 464. The ends of the radiating fins 464 are connected to the inner bottom surface of the base 452 via thermal conductive grease 180.
  • the end of the heat radiating bus 454 is connected to the inner bottom surface of the base 462 using a thermally conductive grease 180.
  • the two third heat sinks 200 are composed of the first heat sink 450 and the second heat sink 450.
  • the heat sink grease 180 is connected to the left and right positions between the heat sinks 460, respectively. That is, the base 202 of the third heat sink 200 has a plurality of heat radiation fins 204. The ends of the radiating fins 204 are connected to the side surfaces of the radiating fins 454 using thermal conductive grease 180. The end of the base 202 is connected to the inner bottom surface of the base 452 and the inner bottom surface of the base 462 via thermal conductive grease 180.
  • the amount of the air passage portion 170 formed between the heat radiation fins can be further increased.
  • the heat sink 5 14 shown in FIG. 17 and FIG. 18 has concave portions 1 9 9 and 2 9 9 respectively provided on a first heat sink 5 50 and a second heat sink 5 60.
  • the concave portion 199 shown in FIG. 17 has a substantially M-shaped cross section.
  • the concave portion 299 shown in FIG. 18 has a substantially semicircular cross section. '
  • concave portions 199 and concave portions 299 contain thermal conductive grease 180, respectively.
  • the end of the heat radiating fins 554 is connected to the concave portion 199 of the base 562 by being fitted through a heat conductive grease 180.
  • the radiating fins 564 are connected to the concave portions 199 of the base portion 552 by using a thermally conductive resistor 180.
  • FIG. 19 shows still another example of the heat sink 6 14 used in the cooling mechanism 10 according to the present invention.
  • the heat sink 6 14 in FIG. 19 has a first heat sink 65 0 and a second heat sink 6 60.
  • the first heat sink 650 and the second heat sink 660 are formed by bending a copper plate or an aluminum plate, respectively.
  • the first heat sink 65 has a base 652 and a plurality of heat radiation fins 654.
  • the second heat sink 660 also has a base 662 and a plurality of radiating fins 664.
  • the end of the heat dissipating fin 654 is connected to the inner bottom surface of the base 662 via a heat conductive durable 180.
  • the end of the heat radiation fin 6 64 It is connected to the inner bottom surface of the part 652 by using thermal conductive grease 180.
  • FIG. 20 shows still another example of the heat sink 7.14 used in the cooling mechanism 10 according to the present invention.
  • the heat sink 7 14 shown in FIG. 20 has the same basic configuration as the heat sink 111 shown in FIG. 13 described above, but differs in that the heat radiation fins 15 4 and the heat radiation fins 16 4 are different. Are formed with convex portions 700 respectively. By forming the protrusions 700 in this manner, the surface area for heat radiation in the air passage portion 170 can be further increased.
  • the cooling mechanism according to the present invention is not limited to the notebook personal computer described above, but can be applied to other types of devices that require the cooling mechanism, for example, various information processing devices such as portable information terminals.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Mécanisme de refroidissement (10) et dispositif de traitement d'informations comprenant le mécanisme de refroidissement (10). Il comprend un puits de chaleur (14), un tuyau thermique (16) pour transférer la chaleur générée dans un élément chauffant (26) vers le puits de chaleur (14), un moteur de ventilateur (18) pour appliquer l'air de refroidissement au puits de chaleur (14) et un boîtier (6) comprenant le puits de chaleur (14), le tuyau thermique (16) et le moteur de ventilateur (18) disposés dans le boîtier. Le boîtier comprend en outre une partie d'émission de chaleur (50) pour émettre la chaleur depuis l'élément chauffant vers l'extérieur du boîtier (6) lorsqu'un refroidissement forcé est effectué par l'entraînement du moteur (18) du ventilateur en fonction de la quantité de chaleur générée par l'élément chauffant afin de diriger l'air de refroidissement vers le puits de chaleur (14) et lorsque le refroidissement naturel s'effectue quand le moteur du ventilateur (18) est à l'arrêt. Dans le dispositif d'information, si la chaleur produite par l'élément chauffant est élevée, on procède au refroidissement forcé, et lorsque la chaleur produite par l'élément chauffant est plutôt limitée, on procède au refroidissement par voie naturelle.
PCT/JP2003/000937 2002-02-06 2003-01-30 Mecanisme de refroidissement et dispositif de traitement d'informations utilisant un mecanisme de refroidissement WO2003067949A1 (fr)

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JP2005093604A (ja) * 2003-09-16 2005-04-07 Sony Corp 冷却装置及び電子機器
JP2011012680A (ja) * 2009-06-30 2011-01-20 Intel Corp 横断流送風機およびシステム
JP2012003153A (ja) * 2010-06-18 2012-01-05 Toshiba Corp 電子機器
JP2012028575A (ja) * 2010-07-23 2012-02-09 Mitsubishi Electric Corp 電子機器
US20130057776A1 (en) * 2011-09-01 2013-03-07 Kabushiki Kaisha Toshiba Television and electronic apparatus
WO2013161617A1 (fr) * 2012-04-26 2013-10-31 エヌイーシーコンピュータテクノ株式会社 Boîtier refroidi par air
JP2014535174A (ja) * 2011-11-15 2014-12-25 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 熱的絶縁層を用いて組み立てられた電子デバイス
JP2016519425A (ja) * 2013-03-16 2016-06-30 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 熱吸収および／または熱的絶縁組成物を用いて組み立てられた電子デバイス
JP2018006701A (ja) * 2016-07-08 2018-01-11 レノボ・シンガポール・プライベート・リミテッド 電子機器
US10481653B2 (en) 2013-12-19 2019-11-19 Henkel IP & Holding GmbH Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
TWI733597B (zh) 2019-10-07 2021-07-11 仁寶電腦工業股份有限公司 電子裝置

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JPH02108392U (fr) * 1989-02-15 1990-08-29
JPH10303580A (ja) * 1997-04-30 1998-11-13 Toshiba Corp 冷却装置およびそれを用いた電子機器
JP2000150728A (ja) * 1998-11-17 2000-05-30 Nec Corp 半導体装置
JP2000223875A (ja) * 1999-01-29 2000-08-11 Matsushita Electric Ind Co Ltd 平面表示装置
JP2000277964A (ja) * 1999-03-25 2000-10-06 Internatl Business Mach Corp <Ibm> ノートブック型パーソナルコンピューターの冷却方法及び冷却装置
JP2001196773A (ja) * 2000-01-07 2001-07-19 Toshiba Corp 発熱部品の冷却装置および電子機器

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JPH02108392U (fr) * 1989-02-15 1990-08-29
JPH10303580A (ja) * 1997-04-30 1998-11-13 Toshiba Corp 冷却装置およびそれを用いた電子機器
JP2000150728A (ja) * 1998-11-17 2000-05-30 Nec Corp 半導体装置
JP2000223875A (ja) * 1999-01-29 2000-08-11 Matsushita Electric Ind Co Ltd 平面表示装置
JP2000277964A (ja) * 1999-03-25 2000-10-06 Internatl Business Mach Corp <Ibm> ノートブック型パーソナルコンピューターの冷却方法及び冷却装置
JP2001196773A (ja) * 2000-01-07 2001-07-19 Toshiba Corp 発熱部品の冷却装置および電子機器

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093604A (ja) * 2003-09-16 2005-04-07 Sony Corp 冷却装置及び電子機器
US7458415B2 (en) 2003-09-16 2008-12-02 Sony Corporation Cooling apparatus and electronic equipment
JP2011012680A (ja) * 2009-06-30 2011-01-20 Intel Corp 横断流送風機およびシステム
JP2012003153A (ja) * 2010-06-18 2012-01-05 Toshiba Corp 電子機器
US8531838B2 (en) 2010-06-18 2013-09-10 Kabushiki Kaisha Toshiba Television apparatus and electronic device
JP2012028575A (ja) * 2010-07-23 2012-02-09 Mitsubishi Electric Corp 電子機器
US20130057776A1 (en) * 2011-09-01 2013-03-07 Kabushiki Kaisha Toshiba Television and electronic apparatus
JP2014535174A (ja) * 2011-11-15 2014-12-25 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 熱的絶縁層を用いて組み立てられた電子デバイス
WO2013161617A1 (fr) * 2012-04-26 2013-10-31 エヌイーシーコンピュータテクノ株式会社 Boîtier refroidi par air
JPWO2013161617A1 (ja) * 2012-04-26 2015-12-24 Ｎｅｃプラットフォームズ株式会社 空冷式筐体
US9585286B2 (en) 2012-04-26 2017-02-28 Nec Platforms, Ltd. Air-cooled case
JP2016519425A (ja) * 2013-03-16 2016-06-30 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 熱吸収および／または熱的絶縁組成物を用いて組み立てられた電子デバイス
US10481653B2 (en) 2013-12-19 2019-11-19 Henkel IP & Holding GmbH Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
US11155065B2 (en) 2013-12-19 2021-10-26 Henkel IP & Holding GmbH Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
JP2018006701A (ja) * 2016-07-08 2018-01-11 レノボ・シンガポール・プライベート・リミテッド 電子機器
TWI733597B (zh) 2019-10-07 2021-07-11 仁寶電腦工業股份有限公司 電子裝置

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