WO2003064108A1 - Touret a polir, dispositif a polir et procede de polissage - Google Patents

Touret a polir, dispositif a polir et procede de polissage Download PDF

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Publication number
WO2003064108A1
WO2003064108A1 PCT/JP2002/000777 JP0200777W WO03064108A1 WO 2003064108 A1 WO2003064108 A1 WO 2003064108A1 JP 0200777 W JP0200777 W JP 0200777W WO 03064108 A1 WO03064108 A1 WO 03064108A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
slurry
carrier
polishing pad
peripheral surface
Prior art date
Application number
PCT/JP2002/000777
Other languages
English (en)
Japanese (ja)
Inventor
Yasuyuki Ogata
Manabu Kanemoto
Hiroyuki Kobayashi
Original Assignee
Mitsubishi Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002019148A external-priority patent/JP2003220553A/ja
Priority claimed from JP2002019149A external-priority patent/JP2003220554A/ja
Application filed by Mitsubishi Materials Corporation filed Critical Mitsubishi Materials Corporation
Publication of WO2003064108A1 publication Critical patent/WO2003064108A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

La présente invention concerne un touret à polir (61) comprenant un support en forme de disque (16) destiné à maintenir sur sa surface inférieure une surface de plaquette (W), et une bague de retenue annulaire (17) disposée concentrique par rapport audit support (16), sur la périphérie extérieure de ce dernier, et maintenue sur la surface périphérique intérieure (17a) dudit support tout en étant en contact avec un tampon à polir (4) lors du polissage, et en bloquant la périphérie extérieure de la plaquette (W). Le support précité (16) est muni d'un passage d'écoulement (62) destiné à amener une suspension ou un liquide de nettoyage dans un espace (K) entre une surface périphérique extérieure (16a) et la surface périphérique intérieure (17a) de la bague de retenue (17). Le passage d'écoulement précité (62) est relié à un mécanisme d'alimentation (31) en suspension ou liquide de nettoyage qui permet d'introduire sélectivement dans le passage (62) une suspension ou un liquide de nettoyage.
PCT/JP2002/000777 2002-01-28 2002-01-31 Touret a polir, dispositif a polir et procede de polissage WO2003064108A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002019148A JP2003220553A (ja) 2002-01-28 2002-01-28 研磨ヘッド及び研磨方法
JP2002019149A JP2003220554A (ja) 2002-01-28 2002-01-28 研磨装置及びこれを用いた被研磨材の研磨方法
JP2002-19149 2002-01-28
JP2002-19148 2002-01-28

Publications (1)

Publication Number Publication Date
WO2003064108A1 true WO2003064108A1 (fr) 2003-08-07

Family

ID=27667430

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/000777 WO2003064108A1 (fr) 2002-01-28 2002-01-31 Touret a polir, dispositif a polir et procede de polissage

Country Status (2)

Country Link
TW (1) TW523443B (fr)
WO (1) WO2003064108A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200055160A1 (en) * 2018-08-14 2020-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method and apparatus

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4374370B2 (ja) * 2006-10-27 2009-12-02 信越半導体株式会社 研磨ヘッド及び研磨装置
TWI674171B (zh) * 2012-01-31 2019-10-11 日商荏原製作所股份有限公司 基板保持裝置、研磨裝置、及研磨方法
CN106514482B (zh) * 2016-11-09 2019-08-23 上海华力微电子有限公司 一种晶圆化学机械抛光保持环的清洗装置及清洗方法
TWI602655B (zh) * 2017-03-23 2017-10-21 Coolant flow guide for grinders
JP7372107B2 (ja) * 2019-10-15 2023-10-31 株式会社岡本工作機械製作所 ウェーハ研磨用ヘッド
CN114654379B (zh) * 2022-03-21 2023-04-07 北京晶亦精微科技股份有限公司 一种研磨头及具有其的晶圆研磨装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139060A (ja) * 1994-11-04 1996-05-31 Ricoh Co Ltd 半導体装置の製造方法及び化学的機械研磨装置
JP2000127025A (ja) * 1998-10-23 2000-05-09 Toshiba Corp ポリッシング装置及び研磨加工方法
JP2000190211A (ja) * 1998-12-24 2000-07-11 Lucent Technol Inc 化学的機械的研磨装置および方法
JP2000218517A (ja) * 1999-01-26 2000-08-08 Hitachi Ltd 電子部品の製造方法および製造装置
EP1038636A2 (fr) * 1999-03-26 2000-09-27 Applied Materials, Inc. Tête de support pour alimenter une suspension de polissage

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139060A (ja) * 1994-11-04 1996-05-31 Ricoh Co Ltd 半導体装置の製造方法及び化学的機械研磨装置
JP2000127025A (ja) * 1998-10-23 2000-05-09 Toshiba Corp ポリッシング装置及び研磨加工方法
JP2000190211A (ja) * 1998-12-24 2000-07-11 Lucent Technol Inc 化学的機械的研磨装置および方法
JP2000218517A (ja) * 1999-01-26 2000-08-08 Hitachi Ltd 電子部品の製造方法および製造装置
EP1038636A2 (fr) * 1999-03-26 2000-09-27 Applied Materials, Inc. Tête de support pour alimenter une suspension de polissage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200055160A1 (en) * 2018-08-14 2020-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method and apparatus

Also Published As

Publication number Publication date
TW523443B (en) 2003-03-11

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