WO2003041135A1 - Dispositif d'exposition a faisceau d'electrons - Google Patents

Dispositif d'exposition a faisceau d'electrons Download PDF

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Publication number
WO2003041135A1
WO2003041135A1 PCT/JP2002/011622 JP0211622W WO03041135A1 WO 2003041135 A1 WO2003041135 A1 WO 2003041135A1 JP 0211622 W JP0211622 W JP 0211622W WO 03041135 A1 WO03041135 A1 WO 03041135A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
mask
state
chamber
electron beam
Prior art date
Application number
PCT/JP2002/011622
Other languages
English (en)
Japanese (ja)
Inventor
Nobuo Shimazu
Akihiro Endou
Tohru Ise
Toyoji Fukui
Taichi Fujita
Yoshiaki Yanagi
Yukio Tsuda
Hideaki Tsuda
Koichi Nihei
Original Assignee
Tokyo Seimitsu Co., Ltd.
Leepl Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co., Ltd., Leepl Corporation filed Critical Tokyo Seimitsu Co., Ltd.
Publication of WO2003041135A1 publication Critical patent/WO2003041135A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

L'invention concerne un dispositif d'exposition à faisceau d'électrons à haut débit contenu dans un système d'exposition fermé. Ce dispositif comprend un étage; une colonne optique électronique; une chambre à vide; une partie mécanisme de transfert de masque destinée à transférer un masque vers la colonne optique électronique après que le masque a été retiré d'une cassette de masque à l'état de pression atmosphérique et à mettre l'intérieur du masque à l'état de vide; une chambre de préchargement destinée à recevoir une plaquette à partir d'une cassette de plaquette et à distribuer cette plaquette vers ladite cassette; ainsi qu'une chambre de chargement destinée à transférer la plaquette vers l'étage, après l'avoir reçue de la chambre de préchargement à l'état de pression atmosphérique, puis à mettre l'intérieur de celle-ci à l'état de vide et à transférer la plaquette vers ladite chambre de préchargement après l'avoir reçue de l'étage à l'état de vide, et à mettre l'intérieur de ladite plaquette à l'état de pression atmosphérique.
PCT/JP2002/011622 2001-11-07 2002-11-07 Dispositif d'exposition a faisceau d'electrons WO2003041135A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001342226A JP2003142391A (ja) 2001-11-07 2001-11-07 電子ビーム露光装置
JP2001-342226 2001-11-07

Publications (1)

Publication Number Publication Date
WO2003041135A1 true WO2003041135A1 (fr) 2003-05-15

Family

ID=19156117

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/011622 WO2003041135A1 (fr) 2001-11-07 2002-11-07 Dispositif d'exposition a faisceau d'electrons

Country Status (3)

Country Link
JP (1) JP2003142391A (fr)
TW (1) TW200303038A (fr)
WO (1) WO2003041135A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4593316B2 (ja) * 2005-02-28 2010-12-08 株式会社ユーシン精機 成形品取出機用チャック
JP5129626B2 (ja) * 2008-03-24 2013-01-30 株式会社ニューフレアテクノロジー 電子ビーム描画装置および電子ビーム描画方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154749A (ja) * 1985-12-27 1987-07-09 Hitachi Ltd 処理装置
JPS63250818A (ja) * 1987-04-08 1988-10-18 Toshiba Corp 電子線描画装置
JPH04367866A (ja) * 1991-06-17 1992-12-21 Nippon Telegr & Teleph Corp <Ntt> 電子ビーム描画装置
JPH0582429A (ja) * 1991-09-20 1993-04-02 Hitachi Ltd 荷電粒子露光装置
JPH07254540A (ja) * 1994-03-15 1995-10-03 Fujitsu Ltd 電子ビーム露光装置
JPH1049229A (ja) * 1996-08-05 1998-02-20 Osaka Gas Co Ltd 曲面走行装置
JPH10284373A (ja) * 1997-04-03 1998-10-23 Nikon Corp 荷電粒子線露光装置
US5831272A (en) * 1997-10-21 1998-11-03 Utsumi; Takao Low energy electron beam lithography
US6093931A (en) * 1997-02-28 2000-07-25 Kabushiki Kaisha Toshiba Pattern-forming method and lithographic system
JP2001052987A (ja) * 1999-08-11 2001-02-23 Nikon Corp 半導体製造装置とデバイス製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154749A (ja) * 1985-12-27 1987-07-09 Hitachi Ltd 処理装置
JPS63250818A (ja) * 1987-04-08 1988-10-18 Toshiba Corp 電子線描画装置
JPH04367866A (ja) * 1991-06-17 1992-12-21 Nippon Telegr & Teleph Corp <Ntt> 電子ビーム描画装置
JPH0582429A (ja) * 1991-09-20 1993-04-02 Hitachi Ltd 荷電粒子露光装置
JPH07254540A (ja) * 1994-03-15 1995-10-03 Fujitsu Ltd 電子ビーム露光装置
JPH1049229A (ja) * 1996-08-05 1998-02-20 Osaka Gas Co Ltd 曲面走行装置
US6093931A (en) * 1997-02-28 2000-07-25 Kabushiki Kaisha Toshiba Pattern-forming method and lithographic system
JPH10284373A (ja) * 1997-04-03 1998-10-23 Nikon Corp 荷電粒子線露光装置
US5831272A (en) * 1997-10-21 1998-11-03 Utsumi; Takao Low energy electron beam lithography
JP2001052987A (ja) * 1999-08-11 2001-02-23 Nikon Corp 半導体製造装置とデバイス製造方法

Also Published As

Publication number Publication date
TW200303038A (en) 2003-08-16
JP2003142391A (ja) 2003-05-16

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