MY137329A - Process of transferring a thin layer including an over-weakening phase - Google Patents
Process of transferring a thin layer including an over-weakening phaseInfo
- Publication number
- MY137329A MY137329A MYPI20003580A MYPI20003580A MY137329A MY 137329 A MY137329 A MY 137329A MY PI20003580 A MYPI20003580 A MY PI20003580A MY PI20003580 A MYPI20003580 A MY PI20003580A MY 137329 A MY137329 A MY 137329A
- Authority
- MY
- Malaysia
- Prior art keywords
- thin layer
- source substrate
- transferring
- over
- zone
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Abstract
PROCESS OF TRANSFERRING A THIN LAYER (18) FROM A SOURCE SUBSTRATE (10) TO A TARGET SUPPORT (30) INCLUDING THE FOLLOWING STEPS:A) THE IMPLANTATION OF IONS OR GASEOUS KINDS IN THE SOURCE SUBSTRATE SO AS TO FORM IN IT A ZONE (16) CALLED CLEAVING ZONE, THAT DELIMITS THE SAID THIN LAYER (18) IN THE SOURCE SUBSTRATE;@B) THE TRANSFER OF THE SOURCE SUBSTRATE ON THE TARGET SUPPORT AND THE JOINING OF THE THIN LAYER WITH THE TRGET SUPPORT;@C) THE SEPARATION OF THE THIN LAYER (18) FROM THE SOURCE SUBSTRATE (10) ACCORDING TO THE CLEAVING ZONE;@IN COMPLIANCE WITH THE INVENTION, THE PROCESS INCLUDES PRIOR TO STEP B):@- THE OVER- WEAKENING OF THE CLEAVING ZONE (10) CAUSED BY A THERMAL TREATMENT AND/OR BY THE ACTION OF MECHANICAL EFFORTS ON THE SOURCE SUBSTRATE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9910121A FR2797347B1 (en) | 1999-08-04 | 1999-08-04 | METHOD FOR TRANSFERRING A THIN FILM HAVING A SURFRAGILILIZATION STEP |
Publications (1)
Publication Number | Publication Date |
---|---|
MY137329A true MY137329A (en) | 2009-01-30 |
Family
ID=9548879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20003580A MY137329A (en) | 1999-08-04 | 2000-08-04 | Process of transferring a thin layer including an over-weakening phase |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1203403A1 (en) |
JP (1) | JP2003506892A (en) |
KR (1) | KR100742240B1 (en) |
FR (1) | FR2797347B1 (en) |
MY (1) | MY137329A (en) |
TW (1) | TW457565B (en) |
WO (1) | WO2001011667A1 (en) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2773261B1 (en) | 1997-12-30 | 2000-01-28 | Commissariat Energie Atomique | METHOD FOR THE TRANSFER OF A THIN FILM COMPRISING A STEP OF CREATING INCLUSIONS |
FR2823599B1 (en) | 2001-04-13 | 2004-12-17 | Commissariat Energie Atomique | DEMOMTABLE SUBSTRATE WITH CONTROLLED MECHANICAL HOLDING AND METHOD OF MAKING |
FR2830983B1 (en) * | 2001-10-11 | 2004-05-14 | Commissariat Energie Atomique | METHOD FOR MANUFACTURING THIN FILMS CONTAINING MICROCOMPONENTS |
JP4277481B2 (en) | 2002-05-08 | 2009-06-10 | 日本電気株式会社 | Semiconductor substrate manufacturing method and semiconductor device manufacturing method |
FR2845517B1 (en) * | 2002-10-07 | 2005-05-06 | Commissariat Energie Atomique | IMPLEMENTING A DEMONDABLE SEMICONDUCTOR SUBSTRATE AND OBTAINING A SEMICONDUCTOR ELEMENT |
FR2845518B1 (en) * | 2002-10-07 | 2005-10-14 | Commissariat Energie Atomique | IMPLEMENTING A DEMONDABLE SEMICONDUCTOR SUBSTRATE AND OBTAINING A SEMICONDUCTOR ELEMENT |
FR2846788B1 (en) * | 2002-10-30 | 2005-06-17 | PROCESS FOR PRODUCING DETACHABLE SUBSTRATES | |
FR2847075B1 (en) * | 2002-11-07 | 2005-02-18 | Commissariat Energie Atomique | PROCESS FOR FORMING A FRAGILE ZONE IN A SUBSTRATE BY CO-IMPLANTATION |
US7176108B2 (en) | 2002-11-07 | 2007-02-13 | Soitec Silicon On Insulator | Method of detaching a thin film at moderate temperature after co-implantation |
FR2848336B1 (en) | 2002-12-09 | 2005-10-28 | Commissariat Energie Atomique | METHOD FOR PRODUCING A STRESS STRUCTURE FOR DISSOCIATING |
FR2856844B1 (en) | 2003-06-24 | 2006-02-17 | Commissariat Energie Atomique | HIGH PERFORMANCE CHIP INTEGRATED CIRCUIT |
FR2857953B1 (en) * | 2003-07-21 | 2006-01-13 | Commissariat Energie Atomique | STACKED STRUCTURE, AND METHOD FOR MANUFACTURING THE SAME |
FR2861497B1 (en) | 2003-10-28 | 2006-02-10 | Soitec Silicon On Insulator | METHOD FOR CATASTROPHIC TRANSFER OF A FINE LAYER AFTER CO-IMPLANTATION |
US7772087B2 (en) | 2003-12-19 | 2010-08-10 | Commissariat A L'energie Atomique | Method of catastrophic transfer of a thin film after co-implantation |
JP4879737B2 (en) * | 2004-01-29 | 2012-02-22 | ソワテク | Method for separating semiconductor layers |
EP1605504B1 (en) | 2004-06-10 | 2011-05-25 | S.O.I. Tec Silicon on Insulator Technologies S.A. | Method for manufacturing a SOI wafer |
FR2886051B1 (en) | 2005-05-20 | 2007-08-10 | Commissariat Energie Atomique | METHOD FOR DETACHING THIN FILM |
FR2889887B1 (en) | 2005-08-16 | 2007-11-09 | Commissariat Energie Atomique | METHOD FOR DEFERING A THIN LAYER ON A SUPPORT |
FR2891281B1 (en) | 2005-09-28 | 2007-12-28 | Commissariat Energie Atomique | METHOD FOR MANUFACTURING A THIN FILM ELEMENT |
FR2899378B1 (en) | 2006-03-29 | 2008-06-27 | Commissariat Energie Atomique | METHOD FOR DETACHING A THIN FILM BY FUSION OF PRECIPITS |
JP5284576B2 (en) * | 2006-11-10 | 2013-09-11 | 信越化学工業株式会社 | Manufacturing method of semiconductor substrate |
FR2910179B1 (en) | 2006-12-19 | 2009-03-13 | Commissariat Energie Atomique | METHOD FOR MANUFACTURING THIN LAYERS OF GaN BY IMPLANTATION AND RECYCLING OF A STARTING SUBSTRATE |
WO2008132895A1 (en) * | 2007-04-20 | 2008-11-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing soi substrate and semiconductor device |
KR101440930B1 (en) * | 2007-04-20 | 2014-09-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method of manufacturing soi substrate |
JP5367330B2 (en) | 2007-09-14 | 2013-12-11 | 株式会社半導体エネルギー研究所 | Method for manufacturing SOI substrate and method for manufacturing semiconductor device |
JP5464843B2 (en) | 2007-12-03 | 2014-04-09 | 株式会社半導体エネルギー研究所 | Method for manufacturing SOI substrate |
FR2925221B1 (en) | 2007-12-17 | 2010-02-19 | Commissariat Energie Atomique | METHOD FOR TRANSFERRING A THIN LAYER |
JP5339785B2 (en) * | 2008-06-03 | 2013-11-13 | 信越半導体株式会社 | Manufacturing method of bonded wafer |
FR2947098A1 (en) | 2009-06-18 | 2010-12-24 | Commissariat Energie Atomique | METHOD OF TRANSFERRING A THIN LAYER TO A TARGET SUBSTRATE HAVING A THERMAL EXPANSION COEFFICIENT DIFFERENT FROM THAT OF THE THIN LAYER |
US8524572B2 (en) * | 2011-10-06 | 2013-09-03 | Micron Technology, Inc. | Methods of processing units comprising crystalline materials, and methods of forming semiconductor-on-insulator constructions |
US9281233B2 (en) * | 2012-12-28 | 2016-03-08 | Sunedison Semiconductor Limited | Method for low temperature layer transfer in the preparation of multilayer semiconductor devices |
FR3055063B1 (en) * | 2016-08-11 | 2018-08-31 | Soitec | METHOD OF TRANSFERRING A USEFUL LAYER |
FR3108787B1 (en) * | 2020-03-31 | 2022-04-01 | Commissariat Energie Atomique | LOW TEMPERATURE TRANSFER AND CURE PROCESS OF A SEMICONDUCTOR LAYER |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2738671B1 (en) * | 1995-09-13 | 1997-10-10 | Commissariat Energie Atomique | PROCESS FOR PRODUCING THIN FILMS WITH SEMICONDUCTOR MATERIAL |
FR2748851B1 (en) * | 1996-05-15 | 1998-08-07 | Commissariat Energie Atomique | PROCESS FOR PRODUCING A THIN FILM OF SEMICONDUCTOR MATERIAL |
CN1146973C (en) * | 1997-05-12 | 2004-04-21 | 硅源公司 | Controlled cleavage process |
US5877070A (en) * | 1997-05-31 | 1999-03-02 | Max-Planck Society | Method for the transfer of thin layers of monocrystalline material to a desirable substrate |
US5909627A (en) * | 1998-05-18 | 1999-06-01 | Philips Electronics North America Corporation | Process for production of thin layers of semiconductor material |
-
1999
- 1999-08-04 FR FR9910121A patent/FR2797347B1/en not_active Expired - Fee Related
-
2000
- 2000-08-03 JP JP2001516228A patent/JP2003506892A/en active Pending
- 2000-08-03 KR KR1020027001366A patent/KR100742240B1/en not_active IP Right Cessation
- 2000-08-03 EP EP00956612A patent/EP1203403A1/en not_active Withdrawn
- 2000-08-03 WO PCT/FR2000/002239 patent/WO2001011667A1/en active Search and Examination
- 2000-08-04 MY MYPI20003580A patent/MY137329A/en unknown
- 2000-09-05 TW TW089115613A patent/TW457565B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FR2797347A1 (en) | 2001-02-09 |
KR20020085868A (en) | 2002-11-16 |
KR100742240B1 (en) | 2007-07-24 |
EP1203403A1 (en) | 2002-05-08 |
TW457565B (en) | 2001-10-01 |
JP2003506892A (en) | 2003-02-18 |
WO2001011667A1 (en) | 2001-02-15 |
FR2797347B1 (en) | 2001-11-23 |
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