WO2003028942A1 - Dispositif projetant de la lumiere et procede de projection de lumiere - Google Patents

Dispositif projetant de la lumiere et procede de projection de lumiere Download PDF

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Publication number
WO2003028942A1
WO2003028942A1 PCT/JP2002/009928 JP0209928W WO03028942A1 WO 2003028942 A1 WO2003028942 A1 WO 2003028942A1 JP 0209928 W JP0209928 W JP 0209928W WO 03028942 A1 WO03028942 A1 WO 03028942A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
light projecting
intensity
intensity distribution
machining
Prior art date
Application number
PCT/JP2002/009928
Other languages
English (en)
Japanese (ja)
Inventor
Koki Ichihashi
Daisuke Yokohagi
Daiji Narita
Katsuichi Ukita
Hidehiko Karasaki
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Priority to KR10-2003-7007071A priority Critical patent/KR100491558B1/ko
Publication of WO2003028942A1 publication Critical patent/WO2003028942A1/fr
Priority to US10/606,805 priority patent/US7005605B2/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Abstract

L'invention concerne un appareil d'usinage par rayon laser permettant d'usiner une pièce (19) à l'aide d'un faisceau laser d'une distribution d'intensité uniforme. Cette dernière est obtenue par conversion de la distribution d'intensité d'un faisceau laser CO2 (11) en une distribution d'intensité uniforme au moyen d'un élément de conversion d'intensité (14) et d'un élément de mise en correspondance de phase (15). Dans cet appareil, un système optique de transmission de lumière (13) est placé de façon que le point de départ d'un vecteur de pointage de faisceau laser et la surface de sortie de l'élément de conversion d'intensité soient en relation mutuelle conjuguée. Grâce à cette structure, même si le vecteur de pointage du faisceau laser change, ce dernier est toujours incident sur le centre de l'élément de conversion d'intensité, ce qui permet un usinage équilibré.
PCT/JP2002/009928 2001-09-28 2002-09-26 Dispositif projetant de la lumiere et procede de projection de lumiere WO2003028942A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR10-2003-7007071A KR100491558B1 (ko) 2001-09-28 2002-09-26 광 조사 장치와 광 조사 방법
US10/606,805 US7005605B2 (en) 2001-09-28 2003-06-27 Laser irradiation apparatus and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-301713 2001-09-28
JP2001301713A JP3666435B2 (ja) 2001-09-28 2001-09-28 光照射装置と光加工装置およびその加工方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/606,805 Continuation-In-Part US7005605B2 (en) 2001-09-28 2003-06-27 Laser irradiation apparatus and method

Publications (1)

Publication Number Publication Date
WO2003028942A1 true WO2003028942A1 (fr) 2003-04-10

Family

ID=19122078

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009928 WO2003028942A1 (fr) 2001-09-28 2002-09-26 Dispositif projetant de la lumiere et procede de projection de lumiere

Country Status (6)

Country Link
US (1) US7005605B2 (fr)
JP (1) JP3666435B2 (fr)
KR (1) KR100491558B1 (fr)
CN (1) CN1227092C (fr)
TW (1) TW550137B (fr)
WO (1) WO2003028942A1 (fr)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
JP4782510B2 (ja) * 2004-10-05 2011-09-28 日立ビアメカニクス株式会社 レーザービーム送出システムの安定性のためにビーム整形を用いる補償器光学系、及び横方向ビームドリフトによるエネルギー分布形状歪みを補正するための径方向非対称ビーム形成素子
JP2006317508A (ja) * 2005-05-10 2006-11-24 Yokogawa Electric Corp 光強度分布補正光学系およびそれを用いた光学顕微鏡
US8417700B2 (en) * 2005-12-01 2013-04-09 Northrop Grumman Systems Corporation Interactive tool for constructing and editing process diagrams
US7996019B2 (en) * 2006-12-26 2011-08-09 Motorola Mobilty, Inc. Intelligent location-based services
JP4818958B2 (ja) * 2007-03-02 2011-11-16 住友重機械工業株式会社 ビーム照射装置、及び、ビーム照射方法
WO2009081577A1 (fr) 2007-12-26 2009-07-02 Panasonic Corporation Source de lumière laser, appareil d'affichage d'image et appareil de traitement utilisant la source de lumière laser
KR100863187B1 (ko) * 2008-01-10 2008-10-13 (주)다사로봇 지능형 로봇 장치의 제어시스템 및 그 제어방법
WO2011004311A1 (fr) * 2009-07-07 2011-01-13 Koninklijke Philips Electronics N.V. Dispositif de formation de motifs pour générer un motif dans et/ou sur une couche
US8435437B2 (en) * 2009-09-04 2013-05-07 Abbott Cardiovascular Systems Inc. Setting laser power for laser machining stents from polymer tubing
JP5848877B2 (ja) * 2011-02-14 2016-01-27 浜松ホトニクス株式会社 レーザ光整形及び波面制御用光学系
US9291825B2 (en) * 2013-03-22 2016-03-22 Applied Materials Israel, Ltd. Calibratable beam shaping system and method
KR101881708B1 (ko) * 2014-07-03 2018-07-24 신닛테츠스미킨 카부시키카이샤 레이저 가공 장치
DE102014224182A1 (de) * 2014-11-26 2016-06-02 Robert Bosch Gmbh Vorrichtung und Verfahren zur Lasermaterialbearbeitung
CN104914584B (zh) * 2015-07-02 2018-04-03 中国科学院光电技术研究所 一种基于波前校正器的激光束三维整形系统
CN105328331B (zh) * 2015-11-10 2017-08-04 哈尔滨工程大学 用于激光车削和磨削复合加工的强聚焦光学系统及加工方法
CN107309556A (zh) * 2016-04-14 2017-11-03 大族激光科技产业集团股份有限公司 一种激光钻孔装置及方法
EP3491450B1 (fr) * 2016-07-27 2024-02-28 TRUMPF Laser GmbH Éclairage de ligne laser
CN106908956A (zh) * 2017-03-22 2017-06-30 中国工程物理研究院激光聚变研究中心 对靶面光强分布进行匀滑的方法及其装置
JP6598833B2 (ja) 2017-09-11 2019-10-30 キヤノン株式会社 照明光学系、露光装置、および物品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5442487A (en) * 1990-04-12 1995-08-15 Nidek Co., Ltd. Ophthalmic photocoagulating apparatus using a laser diode and a lens system for the apparatus
JP2001121282A (ja) * 1999-10-21 2001-05-08 Matsushita Electric Ind Co Ltd レーザ加工装置及びレーザ加工方法

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
US3476463A (en) * 1965-05-11 1969-11-04 Perkin Elmer Corp Coherent light optical system yielding an output beam of desired intensity distribution at a desired equiphase surface
JPH082511B2 (ja) 1989-05-08 1996-01-17 松下電器産業株式会社 レーザ加工装置
JP3555179B2 (ja) 1994-06-20 2004-08-18 凸版印刷株式会社 液体用カートン開口部シール部の加熱方法及び加熱装置
US5994006A (en) * 1996-06-04 1999-11-30 Nikon Corporation Projection exposure methods
TW436357B (en) * 1997-12-12 2001-05-28 Matsushita Electric Ind Co Ltd Laser drilling equipment and control method
US6392742B1 (en) * 1999-06-01 2002-05-21 Canon Kabushiki Kaisha Illumination system and projection exposure apparatus
JP3407715B2 (ja) * 2000-06-06 2003-05-19 松下電器産業株式会社 レーザ加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5442487A (en) * 1990-04-12 1995-08-15 Nidek Co., Ltd. Ophthalmic photocoagulating apparatus using a laser diode and a lens system for the apparatus
JP2001121282A (ja) * 1999-10-21 2001-05-08 Matsushita Electric Ind Co Ltd レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
CN1227092C (zh) 2005-11-16
US20040084607A1 (en) 2004-05-06
KR20030063397A (ko) 2003-07-28
KR100491558B1 (ko) 2005-05-27
CN1481289A (zh) 2004-03-10
JP2003112280A (ja) 2003-04-15
US7005605B2 (en) 2006-02-28
TW550137B (en) 2003-09-01
JP3666435B2 (ja) 2005-06-29

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