WO2003025678A3 - Verfahren und vorrichtung zur steuerung des datenflusses beim einsatz von retikeln einer halbleiter-bauelement produktion - Google Patents

Verfahren und vorrichtung zur steuerung des datenflusses beim einsatz von retikeln einer halbleiter-bauelement produktion Download PDF

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Publication number
WO2003025678A3
WO2003025678A3 PCT/DE2002/003196 DE0203196W WO03025678A3 WO 2003025678 A3 WO2003025678 A3 WO 2003025678A3 DE 0203196 W DE0203196 W DE 0203196W WO 03025678 A3 WO03025678 A3 WO 03025678A3
Authority
WO
WIPO (PCT)
Prior art keywords
reticles
semiconductor component
application
control
data flow
Prior art date
Application number
PCT/DE2002/003196
Other languages
English (en)
French (fr)
Other versions
WO2003025678A2 (de
Inventor
Thomas Albrecht
Norbert Haase
Henning Haffner
Carmen Jaehnert
Olaf Kronefeld
Manfred Stiegler
Original Assignee
Infineon Technologies Ag
Thomas Albrecht
Norbert Haase
Henning Haffner
Carmen Jaehnert
Olaf Kronefeld
Manfred Stiegler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Thomas Albrecht, Norbert Haase, Henning Haffner, Carmen Jaehnert, Olaf Kronefeld, Manfred Stiegler filed Critical Infineon Technologies Ag
Priority to KR10-2004-7002966A priority Critical patent/KR20040044506A/ko
Priority to JP2003529246A priority patent/JP2005502925A/ja
Priority to EP02798682A priority patent/EP1423759A2/de
Priority to US10/488,486 priority patent/US20050090925A1/en
Publication of WO2003025678A2 publication Critical patent/WO2003025678A2/de
Publication of WO2003025678A3 publication Critical patent/WO2003025678A3/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Library & Information Science (AREA)
  • General Factory Administration (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

Die Erfindung betrifft ein Verfahren und eine Vorrichtung zur Steuerung des Datenflusses beim Einsatz von Retikeln in einer Halbleiter-Bauelement Produktion, dadurch gekennzeichnet, dass den Retikeln jeweils eindeutig ein strukturierter Retikeldatensatz zugeordnet ist, wobei der Inhalt des Retikeldatensatzes in Abhängigkeit vom Herstellungsprozess eines Halbleiter-Bauelementes automatisch geändert und / oder ergänzt wird. Damit kann die Verwendung von Retikeln in einer Halbleiter-Bauelement Fertigung effizient gesteuert werden.
PCT/DE2002/003196 2001-08-30 2002-08-28 Verfahren und vorrichtung zur steuerung des datenflusses beim einsatz von retikeln einer halbleiter-bauelement produktion WO2003025678A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR10-2004-7002966A KR20040044506A (ko) 2001-08-30 2002-08-28 반도체 구성요소 생산 시 레티클의 적용에 관한 데이터흐름을 제어하는 방법 및 디바이스
JP2003529246A JP2005502925A (ja) 2001-08-30 2002-08-28 半導体素子の製造におけるレチクルの使用に関するデータフローを制御する方法および装置
EP02798682A EP1423759A2 (de) 2001-08-30 2002-08-28 Verfahren und vorrichtung zur steuerung des datenflusses beim einsatz von retikeln einer halbleiter-bauelement produktion
US10/488,486 US20050090925A1 (en) 2001-08-30 2002-08-28 Method and device for control of the data flow on application of reticles in a semiconductor component production

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10143711.0 2001-08-30
DE10143711A DE10143711A1 (de) 2001-08-30 2001-08-30 Verfahren und Vorrichtung zur Steuerung des Datenflusses beim Einsatz von Retikeln einer Halbleiter-Bauelement Produktion

Publications (2)

Publication Number Publication Date
WO2003025678A2 WO2003025678A2 (de) 2003-03-27
WO2003025678A3 true WO2003025678A3 (de) 2003-10-09

Family

ID=7697933

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003196 WO2003025678A2 (de) 2001-08-30 2002-08-28 Verfahren und vorrichtung zur steuerung des datenflusses beim einsatz von retikeln einer halbleiter-bauelement produktion

Country Status (7)

Country Link
US (1) US20050090925A1 (de)
EP (1) EP1423759A2 (de)
JP (1) JP2005502925A (de)
KR (1) KR20040044506A (de)
DE (1) DE10143711A1 (de)
TW (1) TW546539B (de)
WO (1) WO2003025678A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4543671B2 (ja) * 2003-12-16 2010-09-15 凸版印刷株式会社 Ｒｆ−ｉｄ管理によるフォトマスクの製造方法及びそれを用いたフォトマスクの描画方法
US7206652B2 (en) 2004-08-20 2007-04-17 International Business Machines Corporation Method and system for intelligent automated reticle management
US7305634B2 (en) * 2004-11-23 2007-12-04 Lsi Corporation Method to selectively identify at risk die based on location within the reticle
CN104166317B (zh) * 2014-08-27 2018-10-16 上海华力微电子有限公司 一种光罩自动派工控制方法及控制系统
CN104516215A (zh) * 2014-12-25 2015-04-15 中国科学院长春光学精密机械与物理研究所 一种光刻投影物镜控制装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5396312A (en) * 1991-10-28 1995-03-07 Matsushita Electric Industrial Co., Ltd. Apparatus for optically forming pattern
US6077632A (en) * 1998-02-24 2000-06-20 Oki Electric Industry Co., Ltd. Mask and device for managing the same
EP1184724A1 (de) * 2000-08-29 2002-03-06 Motorola, Inc. Elektronische Vorrichtung für einen lithographischen Maskenbehälter und Verfahren unter Verwendung derselben

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608638A (en) * 1995-02-06 1997-03-04 Advanced Micro Devices Device and method for automation of a build sheet to manufacture a packaged integrated circuit
US5989752A (en) * 1996-05-29 1999-11-23 Chiu; Tzu-Yin Reconfigurable mask
US6578188B1 (en) * 1997-09-17 2003-06-10 Numerical Technologies, Inc. Method and apparatus for a network-based mask defect printability analysis system
AU2001259151A1 (en) * 2000-04-25 2001-11-07 Pri Automation, Inc. Reticle management system
US6351684B1 (en) * 2000-09-19 2002-02-26 Advanced Micro Devices, Inc. Mask identification database server
JP4198877B2 (ja) * 2000-12-25 2008-12-17 株式会社ルネサステクノロジ 半導体デバイスの製造方法
JP2002328463A (ja) * 2001-04-27 2002-11-15 Mitsubishi Electric Corp 半導体回路用フォトマスクの発注方法
US6725237B2 (en) * 2001-06-01 2004-04-20 International Business Machines Corporation System and method of preparing data for a semiconductor mask manufacturer
TW526437B (en) * 2001-08-08 2003-04-01 Macronix Int Co Ltd Photolithography rework analysis method and system
US6819967B2 (en) * 2002-07-24 2004-11-16 International Business Machines Corporation Relational database for producing bill-of-materials from planning information

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5396312A (en) * 1991-10-28 1995-03-07 Matsushita Electric Industrial Co., Ltd. Apparatus for optically forming pattern
US6077632A (en) * 1998-02-24 2000-06-20 Oki Electric Industry Co., Ltd. Mask and device for managing the same
EP1184724A1 (de) * 2000-08-29 2002-03-06 Motorola, Inc. Elektronische Vorrichtung für einen lithographischen Maskenbehälter und Verfahren unter Verwendung derselben

Also Published As

Publication number Publication date
WO2003025678A2 (de) 2003-03-27
EP1423759A2 (de) 2004-06-02
TW546539B (en) 2003-08-11
DE10143711A1 (de) 2003-06-26
US20050090925A1 (en) 2005-04-28
JP2005502925A (ja) 2005-01-27
KR20040044506A (ko) 2004-05-28

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