WO2002079297A3 - Beschichtungsmaterial für elektronische bauelemente - Google Patents

Beschichtungsmaterial für elektronische bauelemente Download PDF

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Publication number
WO2002079297A3
WO2002079297A3 PCT/EP2002/003577 EP0203577W WO02079297A3 WO 2002079297 A3 WO2002079297 A3 WO 2002079297A3 EP 0203577 W EP0203577 W EP 0203577W WO 02079297 A3 WO02079297 A3 WO 02079297A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
coating material
relates
novel
compounds
Prior art date
Application number
PCT/EP2002/003577
Other languages
English (en)
French (fr)
Other versions
WO2002079297A2 (de
Inventor
Marcus Halik
Klaus Lowack
Recai Sezi
Andreas Walter
Original Assignee
Infineon Technologies Ag
Marcus Halik
Klaus Lowack
Recai Sezi
Andreas Walter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Marcus Halik, Klaus Lowack, Recai Sezi, Andreas Walter filed Critical Infineon Technologies Ag
Priority to KR1020037010752A priority Critical patent/KR100625767B1/ko
Priority to US10/472,772 priority patent/US7064176B2/en
Publication of WO2002079297A2 publication Critical patent/WO2002079297A2/de
Publication of WO2002079297A3 publication Critical patent/WO2002079297A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polyamides (AREA)

Abstract

Die vorliegende Erfindung betrifft neue Polyhydroxyamidverbindungen, die in Form ihrer Oxazole als Beschichtungsmaterial, insbesondere für elektronische Bauteile, geeignet sind, ein Verfahren zu deren Herstellung sowie deren Verwendung.
PCT/EP2002/003577 2001-03-30 2002-03-28 Beschichtungsmaterial für elektronische bauelemente WO2002079297A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020037010752A KR100625767B1 (ko) 2001-03-30 2002-03-28 전자 소자용 코팅 물질
US10/472,772 US7064176B2 (en) 2001-03-30 2002-03-28 Coating material for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10115882.3 2001-03-30
DE10115882A DE10115882B4 (de) 2001-03-30 2001-03-30 Polyhydroxamide, daraus durch Cyclisierung erhältliche Polybenzoxazole, Verfahren zur Herstellung der Polyhydroxamide und Polybenzoxazole, Beschichtungsmaterial für elektronische Bauelemente, elektronische Bauteile mit einer Schicht der Polybenzoxazole, Verfahren zur Beschichtung von Substraten mit den Polyhydroxamiden, Verwendung von Polybenzoxazolen als Isolier- und/oder Schutzschicht und Zusammensetzung enthaltend das Polyhydroxamid

Publications (2)

Publication Number Publication Date
WO2002079297A2 WO2002079297A2 (de) 2002-10-10
WO2002079297A3 true WO2002079297A3 (de) 2003-01-30

Family

ID=7679748

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/003577 WO2002079297A2 (de) 2001-03-30 2002-03-28 Beschichtungsmaterial für elektronische bauelemente

Country Status (4)

Country Link
US (1) US7064176B2 (de)
KR (1) KR100625767B1 (de)
DE (1) DE10115882B4 (de)
WO (1) WO2002079297A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10357673A1 (de) * 2003-12-09 2005-07-28 Infineon Technologies Ag Montage- und Klebeschicht für Halbleiterbauelement
FR2874615B1 (fr) * 2004-08-30 2006-10-27 Nexans Sa Composition de vernis d'emaillage notamment pour fil de bobinage
US7309738B1 (en) * 2004-10-06 2007-12-18 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Approach for achieving flame retardancy while retaining physical properties in a compatible polymer matrix
US8357753B2 (en) * 2007-07-18 2013-01-22 Cda Processing Limited Liability Company Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
US8270145B2 (en) 2007-12-04 2012-09-18 Cda Processing Limited Liability Company Screen-printable encapsulants based on soluble polybenzoxazoles
US10526467B2 (en) * 2016-03-10 2020-01-07 The University Of Massachusetts Porous material and methods of making and of using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3718212A1 (de) * 1986-05-30 1987-12-03 Central Glass Co Ltd Verfahren zur herstellung von aromatischen polyamiden und polybenzoxazolen
EP0317942A2 (de) * 1987-11-24 1989-05-31 Hoechst Celanese Corporation Wärmebeständige Polyamide und Polybenzoxazole von Bis-(aminohydroxyphenyl)hexafluoroisopropyldiphenylether
US5077378A (en) * 1986-10-02 1991-12-31 Hoechst Celanese Corporation Polyamide containing the hexafluoroisopropylidene group
JPH04170431A (ja) * 1990-11-02 1992-06-18 Asahi Chem Ind Co Ltd 含フッ素芳香族ポリアミド、その誘導体及びその製法並びに用途

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10125372B4 (de) * 2001-05-23 2007-09-13 Infineon Technologies Ag Mischung zur Verwendung als Antireflexionsschicht, Substrat mit einer Antireflexionsschicht und Verfahren zur Herstellung einer Antireflexionsschicht
DE10126572B4 (de) * 2001-05-31 2006-10-26 Infineon Technologies Ag Polyhydroxyamide und daraus erhältliche hochvernetzte chemisch und thermisch stabile Polymere
DE10130601B4 (de) * 2001-06-26 2008-08-14 Qimonda Ag Substanz und Verfahren zur Herstellung einer porösen Schicht unter Verwendung der Substanz
DE10137376A1 (de) * 2001-07-31 2003-02-27 Infineon Technologies Ag Geklebte Chip- und Waferstapel
DE10145463B4 (de) * 2001-09-14 2013-04-04 Qimonda Ag Verbindungen mit Pufferschichten
DE10228770A1 (de) * 2002-06-27 2004-02-12 Infineon Technologies Ag Dielektrikum mit Sperrwirkung gegen Kupferdiffusion

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3718212A1 (de) * 1986-05-30 1987-12-03 Central Glass Co Ltd Verfahren zur herstellung von aromatischen polyamiden und polybenzoxazolen
US4820793A (en) * 1986-05-30 1989-04-11 Central Glass Company, Limited Method of preparing aromatic polyamides and polybenzoxazoles
US5077378A (en) * 1986-10-02 1991-12-31 Hoechst Celanese Corporation Polyamide containing the hexafluoroisopropylidene group
EP0317942A2 (de) * 1987-11-24 1989-05-31 Hoechst Celanese Corporation Wärmebeständige Polyamide und Polybenzoxazole von Bis-(aminohydroxyphenyl)hexafluoroisopropyldiphenylether
JPH04170431A (ja) * 1990-11-02 1992-06-18 Asahi Chem Ind Co Ltd 含フッ素芳香族ポリアミド、その誘導体及びその製法並びに用途

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 473 (C - 0991) 2 October 1992 (1992-10-02) *

Also Published As

Publication number Publication date
US20040138406A1 (en) 2004-07-15
DE10115882A1 (de) 2002-12-05
KR100625767B1 (ko) 2006-09-20
WO2002079297A2 (de) 2002-10-10
US7064176B2 (en) 2006-06-20
KR20030094250A (ko) 2003-12-11
DE10115882B4 (de) 2006-08-24

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