WO2003025085A1 - Suspension epaisse d'une matiere abrasive a base de cerium - Google Patents

Suspension epaisse d'une matiere abrasive a base de cerium Download PDF

Info

Publication number
WO2003025085A1
WO2003025085A1 PCT/JP2002/009330 JP0209330W WO03025085A1 WO 2003025085 A1 WO2003025085 A1 WO 2003025085A1 JP 0209330 W JP0209330 W JP 0209330W WO 03025085 A1 WO03025085 A1 WO 03025085A1
Authority
WO
WIPO (PCT)
Prior art keywords
abrasive material
cerium
based abrasive
material slurry
treo
Prior art date
Application number
PCT/JP2002/009330
Other languages
English (en)
French (fr)
Inventor
Yoshitsugu Uchino
Kazuya Ushiyama
Original Assignee
Mitsui Mining & Smelting Co.,Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co.,Ltd. filed Critical Mitsui Mining & Smelting Co.,Ltd.
Priority to US10/416,470 priority Critical patent/US6893477B2/en
Priority to KR1020037006458A priority patent/KR100543781B1/ko
Priority to EP02760826A priority patent/EP1428862A4/en
Publication of WO2003025085A1 publication Critical patent/WO2003025085A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/60—Compounds characterised by their crystallite size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/77—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by unit-cell parameters, atom positions or structure diagrams
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
PCT/JP2002/009330 2001-09-17 2002-09-12 Suspension epaisse d'une matiere abrasive a base de cerium WO2003025085A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/416,470 US6893477B2 (en) 2001-09-17 2002-09-12 Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry
KR1020037006458A KR100543781B1 (ko) 2001-09-17 2002-09-12 세륨계 연마재 슬러리 및 세륨계 연마재 슬러리의 제조방법
EP02760826A EP1428862A4 (en) 2001-09-17 2002-09-12 THICK SUSPENSION OF AN ABRASIVE MATERIAL BASED ON CERIUM

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-281438 2001-09-17
JP2001281438A JP4033440B2 (ja) 2001-09-17 2001-09-17 セリウム系研摩材スラリー及びセリウム系研摩材スラリーの製造方法

Publications (1)

Publication Number Publication Date
WO2003025085A1 true WO2003025085A1 (fr) 2003-03-27

Family

ID=19105264

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009330 WO2003025085A1 (fr) 2001-09-17 2002-09-12 Suspension epaisse d'une matiere abrasive a base de cerium

Country Status (8)

Country Link
US (1) US6893477B2 (ja)
EP (1) EP1428862A4 (ja)
JP (1) JP4033440B2 (ja)
KR (1) KR100543781B1 (ja)
CN (1) CN1254518C (ja)
MY (1) MY131875A (ja)
TW (1) TW593649B (ja)
WO (1) WO2003025085A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100192472A1 (en) * 2003-08-14 2010-08-05 Hitachi Chemical Co., Ltd. Abrasive compounds for semiconductor planarization

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7300478B2 (en) * 2003-05-22 2007-11-27 Ferro Corporation Slurry composition and method of use
TWI332981B (en) * 2003-07-17 2010-11-11 Showa Denko Kk Method for producing cerium oxide abrasives and cerium oxide abrasives obtained by the method
TWI324176B (en) * 2004-09-03 2010-05-01 Showa Denko Kk Mixed rare earth oxide, mixed rare earth fluoride, cerium-based abrasive using the materials and production processes thereof
KR100637403B1 (ko) 2005-07-14 2006-10-23 주식회사 케이씨텍 연마 입자, 연마용 슬러리 및 이의 제조 방법
KR100641348B1 (ko) 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
AT502308B1 (de) * 2005-07-20 2010-03-15 Treibacher Ind Ag Glasschleifmittel auf ceroxidbasis und verfahren zu dessen herstellung
KR100782258B1 (ko) * 2005-08-12 2007-12-04 데구사 게엠베하 산화 세륨 분말 및 산화 세륨 분산액
JP4756996B2 (ja) * 2005-11-02 2011-08-24 三井金属鉱業株式会社 セリウム系研摩材
JP5237542B2 (ja) * 2006-10-03 2013-07-17 三井金属鉱業株式会社 酸化セリウム系研摩材
JP5819036B2 (ja) * 2008-03-25 2015-11-18 三井金属鉱業株式会社 セリウム系研摩材スラリー
EP2555211B1 (en) * 2010-03-31 2019-11-27 Hitachi Metals, Ltd. Method for recycling slurry, method for manufacturing rare-earth based sintered magnet, and apparatus for recycling slurry
CN103402705B (zh) * 2011-01-27 2017-08-08 福吉米株式会社 研磨材料和研磨用组合物
EP2775589A4 (en) * 2011-10-31 2015-02-25 Showa Denko Kk EMISSION SHEET, TRANSMITTER UNIT, AND NON-CONTACT ELECTRIC POWER TRANSMISSION SYSTEM COMPRISING THE SAME
CN103009230B (zh) * 2012-11-28 2015-04-08 大连大友高技术陶瓷有限公司 一种轴承套圈的研磨方法
JP2015143332A (ja) * 2013-12-24 2015-08-06 旭硝子株式会社 研磨剤、研磨方法および半導体集積回路装置の製造方法
JP6299539B2 (ja) * 2014-09-09 2018-03-28 信越半導体株式会社 ラッピング方法
EP3261114B1 (en) * 2015-02-19 2021-01-13 Fujimi Incorporated Composition for silicon wafer polishing and polishing method
CN105038604A (zh) * 2015-06-01 2015-11-11 华东理工大学 一种含氟稀土复合氧化物的组成及制备方法
KR102463863B1 (ko) 2015-07-20 2022-11-04 삼성전자주식회사 연마용 조성물 및 이를 이용한 반도체 장치의 제조 방법
MY192996A (en) * 2017-09-11 2022-09-20 Showa Denko Kk Manufacturing method for starting material for cerium-based abrasive agent, and manufacturing method for cerium-based abrasive agent
KR102210251B1 (ko) * 2017-11-10 2021-02-01 삼성에스디아이 주식회사 유기막 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법
CN117210136B (zh) * 2023-09-12 2024-04-05 上海理工大学 一种高三价铈离子含量的铈基稀土抛光浆料的制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001011432A (ja) * 1999-06-29 2001-01-16 Seimi Chem Co Ltd 半導体用研磨剤
JP2001035818A (ja) * 1999-07-16 2001-02-09 Seimi Chem Co Ltd 半導体用研磨剤
JP2001089748A (ja) * 1999-07-16 2001-04-03 Seimi Chem Co Ltd 研磨剤
JP2002194334A (ja) * 2000-12-27 2002-07-10 Mitsui Mining & Smelting Co Ltd 粒度分布に優れたセリウム系研摩材粒子粉末、該粒子粉末を含有する研摩材スラリー及び該粒子粉末の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY118582A (en) * 2000-05-12 2004-12-31 Kao Corp Polishing composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001011432A (ja) * 1999-06-29 2001-01-16 Seimi Chem Co Ltd 半導体用研磨剤
JP2001035818A (ja) * 1999-07-16 2001-02-09 Seimi Chem Co Ltd 半導体用研磨剤
JP2001089748A (ja) * 1999-07-16 2001-04-03 Seimi Chem Co Ltd 研磨剤
JP2002194334A (ja) * 2000-12-27 2002-07-10 Mitsui Mining & Smelting Co Ltd 粒度分布に優れたセリウム系研摩材粒子粉末、該粒子粉末を含有する研摩材スラリー及び該粒子粉末の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1428862A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100192472A1 (en) * 2003-08-14 2010-08-05 Hitachi Chemical Co., Ltd. Abrasive compounds for semiconductor planarization
US8439995B2 (en) * 2003-08-14 2013-05-14 Hitachi Chemical Co., Ltd. Abrasive compounds for semiconductor planarization

Also Published As

Publication number Publication date
KR100543781B1 (ko) 2006-01-23
CN1473186A (zh) 2004-02-04
EP1428862A4 (en) 2006-04-26
EP1428862A1 (en) 2004-06-16
MY131875A (en) 2007-09-28
CN1254518C (zh) 2006-05-03
JP4033440B2 (ja) 2008-01-16
US6893477B2 (en) 2005-05-17
JP2003082333A (ja) 2003-03-19
TW593649B (en) 2004-06-21
KR20030059243A (ko) 2003-07-07
US20040031206A1 (en) 2004-02-19

Similar Documents

Publication Publication Date Title
WO2003025085A1 (fr) Suspension epaisse d'une matiere abrasive a base de cerium
WO2001004226A3 (en) Cmp composition containing silane modified abrasive particles
EP1167565A3 (en) Method for thermal spray coating and rare earth oxide powder used therefor
AU2001276591A1 (en) Method of producing an abrasive product containing diamond
EP1153987A3 (de) Zusammensetzungen für die Herstellung schwer benetzbarer Oberflächen
AU2002213054A1 (en) Ceramic aggregate particles
WO2002028979A1 (fr) Matiere abrasive a base de cerium et procede de production de ladite matiere
AU2002349144A1 (en) Amorphous silica
AU1660101A (en) Composition and method for planarizing surfaces
AU1660001A (en) Composition and method for planarizing surfaces
AU3138597A (en) Fluoride additive containing chemical mechanical polishing slurry and method for use of same
WO2002045907A3 (en) Abrasive diamond composite and method of making thereof
EP0875547A3 (en) Polishing agent for semiconductor and method for its production
DE60334096D1 (de) Nkoxid, polymerzusammensetzung enthaltend dieses pulver sowie daraus hergestellte formkörper
TW353112B (en) Polishing composition
CA2412951A1 (en) Mixture of silica sols
AU3179597A (en) Silica which can be used in toothpaste compositions
AU6566300A (en) Detergent for glass-ceramic surfaces
EP1256548A4 (en) ALUMINA PARTICLES, METHOD FOR THE PRODUCTION THEREOF. COMPOSITION COMPRISING SAID PARTICLES, AND POLISHING ALUMINA SLUDGE
CA2004673A1 (en) Aluminum hydroxide, process for preparation thereof and composition
WO2005030453A3 (en) Textured grout composition, dispenser therefor, and method of use
MY154723A (en) Cerium-based abrasive, abrasive slurry, and production of cerium-based abrasive.
AU2001272778A1 (en) Single crystal fine diamond powder having narrow particle size distribution and method for production thereof
RU94045279A (ru) Порошок металлического кобальта в качестве связующего для изготовления инструментов и/или износостойких покрытий на основе алмаза и/или твердого сплава и металлокерамическое изделие, включающее указанное связующее
WO2005051846A3 (fr) Procede de preparation d'une poudre submicronique, nanostructuree, de sesquioxyde, oxohydroxyde, hydroxyde ou oxyde mixte de terre rare

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN KR PH

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FR GB GR IE IT LU MC NL PT SE SK TR

WWE Wipo information: entry into national phase

Ref document number: 10416470

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 1020037006458

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 1-2003-500362

Country of ref document: PH

WWE Wipo information: entry into national phase

Ref document number: 028029631

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWP Wipo information: published in national office

Ref document number: 1020037006458

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2002760826

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2002760826

Country of ref document: EP

WWG Wipo information: grant in national office

Ref document number: 1020037006458

Country of ref document: KR