WO2003008352A1 - Device and method for scribing fragile material substrate - Google Patents
Device and method for scribing fragile material substrate Download PDFInfo
- Publication number
- WO2003008352A1 WO2003008352A1 PCT/JP2002/007326 JP0207326W WO03008352A1 WO 2003008352 A1 WO2003008352 A1 WO 2003008352A1 JP 0207326 W JP0207326 W JP 0207326W WO 03008352 A1 WO03008352 A1 WO 03008352A1
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- WO
- WIPO (PCT)
- Prior art keywords
- crack
- glass substrate
- material substrate
- brittle material
- scribing
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/386—Removing material by boring or cutting by boring of blind holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Definitions
- the present invention relates to a scribing apparatus and a scribing method used for cutting a brittle material substrate such as a glass substrate and a semiconductor wafer used for a flat panel display (hereinafter referred to as an FPD).
- a scribing apparatus and a scribing method used for cutting a brittle material substrate such as a glass substrate and a semiconductor wafer used for a flat panel display hereinafter referred to as an FPD.
- a liquid crystal panel which is a type of FPD formed by bonding a pair of glass substrates, is divided into a predetermined size after a pair of large-sized mother glass is bonded to each other. Manufactured.
- a scribe line is formed on the mother glass substrate in advance by force.
- fine glass powder or glass cullet was generated, which caused various problems.
- FIG. 3 is a schematic diagram showing a method of forming scribe lines on a glass substrate using a laser beam.
- various pre-processing operations are performed on a portion along the scribe line formed as a result of the scribe operation using a laser or a cutting edge.
- a portion where a scribe line is formed will be described using an expression of a scribe formation planned line or a scheduled scribe line.
- An initial crack TR is formed in advance on the side edge of the glass substrate 50 along the line where the scribe is to be formed.
- the laser beam LB is emitted from the laser oscillation device 61 along the scheduled scribe line from the crack.
- the laser beam LB emitted from the laser oscillation device 61 forms on the glass substrate 50 an oval laser spot LS along a line to be scribed formed on the glass substrate 50.
- the glass substrate 50 is relatively moved with respect to the laser beam LB emitted from the laser oscillator 61 along the longitudinal direction of the laser spot LS.
- a cooling medium such as cooling water is blown from a cooling nozzle 62 in the vicinity of a region heated and irradiated with the laser beam LB on the surface of the glass substrate 50.
- the surface of the glass substrate to which the laser beam is irradiated generates a compressive stress due to heating by the laser beam, and a cooling medium is blown to a region in the vicinity thereof, thereby generating a tensile stress.
- a tensile stress is generated in a region where a compressive stress is generated and a region adjacent to the region, a stress gradient is generated between the two regions based on the respective stresses, and the glass substrate 5 At 0, a vertical crack along the scribe line extends from the initial crack TR formed on the side edge of the glass substrate 50.
- the glass substrate 50 Since the vertical cracks formed on the surface of the glass substrate 50 in this manner are minute, they cannot be seen with the naked eye, and are called blind cracks. Then, the glass substrate 50 is supplied to the next cutting step, and a force is applied to the glass substrate so that a bending moment acts in the width direction of the blind crack. As a result, the glass substrate 50 is divided along the blind crack.
- an initial crack TR is formed on the side edge of the glass substrate 50, and a laser beam is formed on the surface of the glass substrate 50 where the initial crack TR is formed along a scribe line. Is irradiated and heated. In this case, the vicinity of the initial crack on the surface of the glass substrate 50 is rapidly heated by the laser beam. Thus, unnecessary cracks may be newly generated from the initial crack TR. Thus, the cracks derived from the initial cracks are out of control and are not formed along the scheduled scribe line, and the glass substrate having such cracks is defective.
- a new Y crack as shown in Fig. 4
- An initial crack may be formed at the position immediately after the intersection of the end of the glass substrate of the line to be scribed in the direction and the blind crack along the X direction, but also in this case, the part where the initial crack was formed If heated rapidly by laser beam irradiation, unnecessary cracks may be newly formed from the initial cracks.
- a blind crack is formed in the Y direction, or when a full body cut is attempted.
- the present invention is intended to solve such a problem.
- the purpose of the present invention is to solve the problem when the surface of a brittle material substrate such as a glass substrate is rapidly heated to form a blind crack and a scribing operation is started.
- Another object of the present invention is to provide a scribing apparatus and a scribing method for a brittle material substrate, in which an unnecessary crack is not newly generated from the initial crack. Disclosure of the invention
- the scribing device for a brittle material substrate includes a scribing device on a surface of the brittle material substrate.
- Heating means for continuously heating the brittle material substrate at a temperature lower than the softening point of the brittle material substrate along a region where the live line is formed; and a region near the brittle material substrate surface heated by the heating means.
- Cooling means for cooling, and a crack forming means for forming an initial crack along the scribe formation line at the predetermined location after a predetermined location on the surface of the brittle material is heated by the heating means. It is characterized by the following.
- a second heating means for further heating the vicinity of the area cooled by the cooling means is provided.
- the crack forming means has a short-wavelength pulse laser oscillator.
- the portion where the initial crack is to be formed in the brittle material substrate is formed at the time after first heating, at the point where the initial crack is formed along the scheduled scribe line at the predetermined portion. It is characterized by.
- the initial crack is formed by a short wavelength pulsed laser beam.
- the initial crack is formed at a side edge of the brittle material substrate.
- the initial crack is formed so as to intersect with the scribe line that has already been formed, immediately after the scribe line that has been formed.
- FIG. 1 is a front view showing an example of an embodiment of a scribing device for a brittle material substrate according to the present invention.
- FIGS. 2A (a) to 2 (d) show scribes by the scribe device of the present invention, respectively. It is a schematic diagram which shows a brine formation operation process.
- FIGS. 2B (a) to 2 (f) are schematic diagrams each showing a scribe line forming operation process by the scribe device of the present invention.
- FIG. 3 is a schematic diagram showing a state of formation of a conventional blind crack.
- FIG. 4 is a schematic diagram showing a state of formation of a conventional initial crack.
- FIG. 5 (a) is a schematic plan view showing an example of a brittle material substrate
- FIG. 5 (b) is a side view thereof.
- FIG. 6 is a partially enlarged view on a glass substrate schematically showing a situation where blind cracks are formed so as to intersect in two directions.
- FIG. 1 is a schematic configuration diagram showing an embodiment of a scribing apparatus for a brittle material substrate according to the present invention.
- This scribing device is used, for example, to cut a glass substrate used for an FPD, and reciprocates along a predetermined horizontal direction (Y direction) on a horizontal gantry 11 as shown in FIG. It has a slide table 12.
- the slide table 12 slides along the guide rails 14 and 15 in a horizontal state on a pair of guide rails 14 and 15 arranged in parallel in the Y direction on the upper surface of the gantry 11 Supported as possible.
- a pole screw 13 is provided at an intermediate portion between the guide rails 14 and 15 so as to be rotated by a motor (not shown) in parallel with the guide rails 14 and 15.
- the pole screw 13 is capable of normal rotation and reverse rotation, and the pole nut 16 is attached to the pole screw 13 so as to be screwed.
- the pole nut 16 is integrally attached to the slide table 12 without rotating, and slides in both directions along the pole screw 13 by the forward and reverse rotation of the pole screw 13.
- the slide table 12 attached integrally with the pole nut 16 is attached to each of the guide rails 14 and 15. Slide in the Y direction.
- a pedestal 19 is arranged on the slide table 12 in a horizontal state.
- the pedestal 19 is slidably supported by a pair of guide rails 21 arranged in parallel on the slide table 12.
- Each guide rail 21 is arranged along the X direction orthogonal to the ⁇ direction, which is the sliding direction of the slide table 12.
- a pole screw 22 is disposed in the center between the guide rails 21 in parallel with each guide rail 21 so that the pole screw 22 can be rotated forward and reverse by the motor 23. I'm sorry.
- a pole nut 24 is attached to the pole screw 22 in a state where it is screwed.
- the pole nut 24 is integrally attached to the pedestal 19 without rotating, and moves in both directions along the pole screw 22 by the forward and reverse rotation of the pole screw 22. As a result, the pedestal 19 slides in the X direction along each guide rail 21.
- a rotating mechanism 25 is provided on the pedestal 19, and a rotating table 26 on which a glass substrate 50 to be cut is mounted is provided on the rotating mechanism 25 in a horizontal state. ing.
- the rotation mechanism 25 rotates the rotary table 26 around a vertical central axis, and rotates the rotary table 26 so that the rotary table 26 has an arbitrary rotation angle ⁇ ⁇ ⁇ ⁇ with respect to the reference position. Can be rotated.
- a glass substrate 50 is fixed on the rotating table 26 by, for example, a suction chuck.
- a support 31 is disposed at an appropriate distance from the turntable 26.
- the support table 31 is horizontally supported by the lower end of the optical holder 133 arranged vertically.
- the upper end of the optical holder 133 is attached to the lower surface of a mount 32 provided on the gantry 11.
- a first heating laser oscillator 34 for oscillating a scribing laser beam is provided, and the laser beam oscillated from the first heating laser oscillator 34 is supplied to an optical holder.
- the light is irradiated to the optical system held in the one-three-third.
- the laser beam applied to the inside of the optical holder 33 is applied to the glass substrate 50 placed on the rotary table 26 from the lower end surface of the optical holder 33.
- the glass substrate 50 is irradiated with an optical system held in an optical holder 33 as an oblong laser spot extending long in a predetermined direction.
- a cooling nozzle 37 is provided on the support base 31 in the vicinity of the optical holder 133 so that the mounting position is variable. From this cooling nozzle 3 7, cooling water, H e gas, N 2 gas, a coolant such as C 0 2 gas is summer as to be injected into the glass substrate 5 0. The cooling medium injected from the cooling nozzle 37 is sprayed from the optical holder 33 onto a position close to the longitudinal end of the laser spot irradiated on the glass substrate 50, and a cooling spot is formed on the surface of the glass substrate 50.
- the support 31 has an optical connection between the optical holder 33 and the cooling nozzle 37 connected to a crack laser oscillator 41 that oscillates a short wavelength of a YAG laser for forming an initial crack.
- a holder 142 is provided.
- the short wavelength of the YAG laser is more likely to crack than the high-density short-pulse laser of the YAG fundamental.
- the short-wavelength pulse laser oscillated from the crack laser oscillator 41 is applied to the glass substrate 50 via the optical holder 42.
- the location where the pulsed laser beam emitted from the optical holder 14 2 is irradiated is the lengthwise end of the laser spot which is emitted from the optical holder 33 to the glass substrate 50 and the cooling water by the cooling nozzle 37. Is the surface area of the glass substrate 50 located between the glass substrate 50 and the cooling spot to which the glass is sprayed.
- the support 31 is provided with an optical holder 44 connected to the second heating laser oscillator 43 near the cooling nozzle 37.
- the laser beam emitted from the second heating laser oscillator 43 is applied to the surface of the glass substrate 50 via the optical holder 144.
- the area irradiated with the laser beam emitted from the optical holder 144 is an area close to the area where the cooling water is sprayed by the cooling nozzle 37.
- the glass substrate 50 When the glass substrate 50 is scribed by such a scribe device, first, information such as the size of the glass substrate 50 cut into a predetermined size, the scribe line forming position, the initial crack forming position, etc. Input to the control unit.
- the glass substrate 50 cut into a predetermined size is placed on the rotating table 26 of the scribe device and fixed by the suction means.
- the CCD cameras 38 and 39 capture an image of the alignment mark provided on the glass substrate 50.
- the captured alignment marks are displayed on monitors 28 and 29. '
- the rotary table 26 is positioned so that the longitudinal direction of the oblong laser spot irradiated from the optical holder 133 is in the X direction along the scribe line.
- the positioning of the rotary table 26 is performed by the slide of the slide table 12, the slide of the pedestal 19, and the rotation of the rotary table 26 by the rotary mechanism 25.
- the laser spot LS has, for example, an elliptical shape with a major axis of 30.0 mm and a minor axis of 1.0 mm, and is irradiated so that the major axis coincides with the scribe line SL to be formed.
- the heating temperature by the laser spot LS is lower than the temperature at which the glass substrate 50 is melted, that is, lower than the softening point of the glass substrate.
- the surface of the glass substrate 50 irradiated with the laser spot LS becomes Heated without melting.
- the laser spot LS can sufficiently heat the surface of the glass substrate 50 so that blind cracks can be reliably formed without causing any problem.
- the laser spot LS moves along the scribe line SL on the surface of the glass substrate 50, and as shown in FIG.
- the side edge of 50 is placed in a state of facing the lower end of the optical holder 142 connected to the laser oscillator 41 for cracking.
- a short-wavelength pulse laser of YAG is oscillated from the laser oscillator 41 for cracking, and the pulse laser is irradiated onto the scribe line SL on the side edge of the glass substrate 50.
- the scribing line SL at the side edge of the glass substrate 50 is melted or sublimated, and the initial crack TR is formed.
- the laser spot LS moves along the scribe line SL on the surface of the glass substrate 50, and as shown in FIG. 2A (c),
- the cooling nozzle 37 faces the portion where the crack TR is formed at the side edge of the glass substrate 50, and a cooling medium, for example, cooling water is injected from the cooling nozzle 37 together with the compressed air.
- the cooling nozzle 37 sprays a cooling medium on a scribe line SL at intervals of, for example, 2.5 mm in the longitudinal direction of the laser spot LS to an area irradiated with the laser spot LS. Thereby, the surface of the glass substrate 50 is cooled, and the cooling point CP is formed. As a result, a temperature gradient is generated in a region between the laser spot LS and the cooling point CP.
- a compressive stress is generated in the surface area of the glass substrate 50 heated by the laser spot LS, and a tensile force is applied to the cooling point CP where the cooling water is blown. Stress occurs.
- compressive stress is generated in the heating area by the laser spot LS and tensile stress is generated at the cooling point CP by the cooling water, it is generated in the heat diffusion area between the laser spot LS and the cooling point CP.
- Due to the compressive stress a large tensile stress is generated in a region opposite to the laser spot LS with respect to the cooling point CP. Then, by the action of the tensile stress, the blind crack propagates from the initial crack TR formed on the side edge of the glass substrate 50 along the scheduled scribe line SL.
- the laser spot LS moves on the surface of the glass substrate 50 along the line to be scribed SL, and is cooled by the cooling nozzle 37.
- the cooling point CP due to the medium also moves along the scribe line SL, and as shown in FIG.2A (d), the second heating is performed at the portion where the initial crack TR is formed at the side edge of the glass substrate 50.
- the lower end of the optical holder 44 connected to the laser oscillator 43 for laser is opposed, and the laser beam oscillated from the second heating laser oscillator 43 is initially irradiated on the surface of the glass substrate 50. Irradiates the side edge where crack TR is formed. Thereby, the heating spot H S is formed on the blind crack.
- the blind cracks formed on the glass substrate 50 are heated, the blind cracks extend from the surface of the glass substrate 50 in the depth direction and reach the back surface of the glass substrate 50. Become.
- the first heating by the laser beam, the cooling by the cooling medium, and the second heating by the laser beam are sequentially performed along the scheduled scribe line SL of the glass substrate 50, so that the scheduled scribe line SL is formed.
- a blind crack is formed along the surface of the glass substrate 50 so as to reach the back surface.
- FIGS. 2A (a) to 2 (d) unlike the conventional laser scribing method, the initial cracks are formed after laser irradiation, so that it is impossible to predict and control the area near the initial crack formation. It is possible to prevent possible cracks from developing.
- Figure 2 In the case of A (a), a compressive stress is generated around the area where the initial crack is to be formed because the laser beam is irradiated before the crack is formed.
- forming an initial crack in a situation where a compressive stress is generated around a portion where an initial crack is to be formed is more difficult than forming an initial crack at the edge of the substrate surface at room temperature. A case may come along. To avoid these problems, it is possible to adopt another method described below.
- Figs. 2B (a) to 2 (f) show a scribing method that can stabilize the laser scribe operation by forming an initial crack after laser irradiation, as in Figs. 2A (a) to 2 (d).
- FIG. In the following description, the same description as in FIGS. 2A (a) to (d) will not be repeated.
- FIG. 2B (a) shows a situation in which an oblong laser spot LS is formed on the side surface of the glass substrate 50 along the scheduled scribe line SL, as shown in FIG. 2A (a). Is shown. At this point, when a part of the laser spot LS is formed on the end face and a predetermined part is heated during a predetermined time, the laser beam oscillated from the first heating laser oscillator 34 is placed on the glass substrate 50. Irradiation is stopped. Immediately after the irradiation of the laser beam onto the glass substrate 50 is stopped, the glass substrate 50 is slid in the + X direction (the right side of the drawing), as shown in FIG. 2B (b).
- the cooling nozzle 37 is made to face the side edge of 50, and a cooling medium, for example, cooling water is injected from the cooling nozzle 37 together with the compressed air. As a result, the surface of the glass substrate 50 is cooled to form a cooling point CP.
- a cooling medium for example, cooling water is injected from the cooling nozzle 37 together with the compressed air.
- the surface of the glass substrate 50 is cooled to form a cooling point CP.
- the glass substrate 50 is further slid in the ⁇ X direction so that the position where the laser spot LS is formed is near the position where the initial crack is formed. Further, as shown in FIG. 2B (d), when the crack has moved to a position including the inside of the laser spot LS, a laser beam is emitted from the first heating laser oscillator 34, and as a result, a laser spot is emitted. A substrate LS is formed on the substrate 50. The bow 50 is then moved in the opposite + X direction to prepare for crack formation.
- the laser spot LS is moved along the scheduled scribe line SL on the surface of the glass substrate 50, and the cooling nozzle 37 is moved to the position where the initial crack TR is formed.
- the cooling medium is injected into the initial crack TR.
- the cooling point CP due to the cooling medium blown from the cooling nozzle 37 also moves along the scheduled scribe line SL to the initial crack TR at the side edge of the glass substrate 50.
- the portion where the initial crack TR is formed at the side edge of the glass substrate 50 has The lower end of the optical holder 44 connected to the heating laser oscillator 43 is moved to a position facing the optical holder 44, and the heating spot HS by the laser beam emitted from the second heating laser oscillator 43 becomes glass. It is formed on the side edge of the surface of the substrate 50 where the initial crack TR is formed. Thereby, the heating spot HS is formed on the blind crack. As described above, when the blind cracks formed on the glass substrate 50 are heated, the blind cracks extend from the surface of the glass substrate 50 in the depth direction and reach the back surface of the glass substrate 50. .
- the first heating by the laser beam, the cooling by the cooling water, and the second heating by the laser beam are sequentially performed along the scheduled scribe line SL of the glass substrate 50.
- a blind crack is formed along the scheduled scribe line SL in a state reaching the back surface (not shown) of the glass substrate 50.
- a cooling nozzle 37 is attached next to the optical holder 33 of the first heating laser oscillator 34 and the optical holder 42 of the laser oscillator 41 for cracking.
- a cooling nozzle 37 may be provided next to the optical holder 33, and an optical holder 42 may be provided next. In the latter case of the device configuration, the differences from the above description described with reference to FIGS. 2B (a) to (f) will be particularly described below in detail.
- the portion of the substrate 50 where the laser spot LS is formed is heated. Thereafter, the substrate 50 is moved in the + X direction, and the end surface of the substrate 50 on which the cooling point CP is formed is cooled, as in the situation of FIG. 2B (b). Thereafter, the substrate 50 is further moved in the + X direction, and as shown in FIG. 2B (c '), when the end surface of the substrate 50 comes close to just below the optical holder 42 of the cracking laser oscillator 41, The laser beam from the cracking laser oscillator 41 is irradiated. As a result, an initial crack TR is formed on the end face of the substrate 50.
- the substrate 50 is moved in the negative X direction until the rear end of the laser spot LS is located at the end face of the substrate 50.
- the irradiation of the laser beam from the first heating laser oscillator 34 is started from that position, and the substrate 50 is again moved in the + X direction.
- scribe lines are formed and the depth of the crack is further increased.
- FIG. 6 is a partially enlarged view of a glass substrate 50 schematically showing a state in which black is formed so as to intersect in two directions.
- an initial crack is formed by the following two methods based on data input to the control unit, as described above. That is, (1) Laser oscillator for heating and cracking by laser spot LS 41 (or cutting edge used for scribing brittle material substrate, for example, cutting edge such as wheel cutter and boring cutter).
- An initial crack TR is formed at the cutting edge, for example, at the edge of the cutting edge, such as at the tip of a knife.
- the initial crack TR may be formed by the laser oscillator 41 for cracking. For example, when a part of a blind crack line once formed in the X direction and the Y direction is joined again, a blind crack is formed again in the joined part.
- the area where the initial cracks were formed was preheated with the first heating laser spot, then cooled using cooling means, and then cooled. Since the initial crack is formed by the YAGG laser, there is no possibility that an unnecessary crack is newly generated from the initial crack.
- the YAG laser was used as the means for forming the initial crack.
- a cutting tool used for scribing the brittle material substrate such as a wheel cutting tool or a point cutter, may be used as the means for forming the initial crack. You may use as.
- a glass substrate is used as the brittle material substrate, a glass substrate constituting each mother-glass substrate when a pair of mother-glass substrates are bonded together, and as shown in FIGS. 5 (a) and 5 (b).
- a glass substrate 72 which is a mother glass substrate when a glass substrate 71 obtained by dividing one mother glass substrate into predetermined dimensions is bonded to the other mother glass substrate 72, a semiconductor wafer, and a ceramic substrate. Etc. are included.
- the short-wavelength pulse laser emitted from the laser oscillator 41 for cracking is controlled at the above-described timing based on the data input to the control unit. Irradiation and initial crack formation.
- an initial crack is formed by the YAG laser after passing through the first heating laser spot, so that there is no possibility that a new crack will be derived from the initial crack.
- the YAG laser was used as the means for forming the initial cracks.
- a cutting tool used for scribing a brittle material substrate for example, a diamond cutting tool, a boring cutting tool, or the like, may be used. It may be used as forming means.
- a tip holder with a cutter blade attached would be attached near the optical holder 33 as an equipment configuration.
- the tip holder has a mechanism capable of moving up and down, and when it is necessary to form an initial crack, it is necessary to use the tip holder in such a configuration that the tip of the cutting edge can contact the corresponding portion of the substrate.
- a glass substrate is used as the brittle material substrate, and a glass substrate constituting each mother-glass substrate when a pair of mother-glass substrates are bonded to each other, as shown in FIGS. 5 (a) and 5 (b).
- a glass substrate 71 which is a mother glass substrate when a glass substrate 71 obtained by dividing one mother glass substrate into predetermined dimensions and bonded to the other mother glass substrate 72, semiconductor wafers, ceramics, etc. included.
- the scribing apparatus and the scribing method of the present invention include a liquid crystal display substrate, a transmissive liquid crystal display substrate, an organic EL element, a PDP (plasma display panel) substrate, a FED (field emission display) substrate,
- the present invention is also applicable to scribing of a reflective liquid crystal display substrate in which a glass substrate and a silicon substrate are bonded.
- the scribing apparatus and the scribing method for a brittle material substrate according to the present invention when forming a blind crack by heating and then cooling the brittle material substrate, form the initial crack by heating the brittle material substrate. Therefore, when the brittle material substrate is heated, there is no possibility that an unnecessary crack is newly generated from the initial crack. Also, when forming a blind crack that reaches the back surface of the brittle material substrate, an initial crack can be easily formed immediately after the intersection point that intersects each other. It can be surely formed in the intersection state.
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- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003513913A JP4133812B2 (ja) | 2001-07-18 | 2002-07-18 | 脆性材料基板のスクライブ装置およびスクライブ方法 |
KR1020037010418A KR100551526B1 (ko) | 2001-07-18 | 2002-07-18 | 취성재료 기판의 스크라이브 장치 및 스크라이브 방법 |
HK05101802A HK1069377A1 (en) | 2001-07-18 | 2005-03-01 | Device and method for scribing fragile material substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001218572 | 2001-07-18 | ||
JP2001-218572 | 2001-07-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003008352A1 true WO2003008352A1 (en) | 2003-01-30 |
WO2003008352B1 WO2003008352B1 (en) | 2003-03-20 |
Family
ID=19052739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/007326 WO2003008352A1 (en) | 2001-07-18 | 2002-07-18 | Device and method for scribing fragile material substrate |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4133812B2 (ja) |
KR (1) | KR100551526B1 (ja) |
CN (1) | CN1264768C (ja) |
HK (1) | HK1069377A1 (ja) |
TW (1) | TW592868B (ja) |
WO (1) | WO2003008352A1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005042421A1 (ja) * | 2003-10-31 | 2005-05-12 | The Japan Steel Works, Ltd. | ガラスの切断方法 |
WO2006070825A1 (ja) * | 2004-12-28 | 2006-07-06 | Mitsuboshi Diamond Industrial Co., Ltd. | 脆性材料基板の分断方法および基板分断システム |
WO2009128334A1 (ja) * | 2008-04-14 | 2009-10-22 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法 |
JP2009294461A (ja) * | 2008-06-05 | 2009-12-17 | Toshiba Mobile Display Co Ltd | 液晶表示装置及びその製造方法 |
JP2011006313A (ja) * | 2009-06-29 | 2011-01-13 | Mitsuboshi Diamond Industrial Co Ltd | 薄板ガラス基板のスクライブ方法およびスクライブ装置 |
JP2012046400A (ja) * | 2010-08-30 | 2012-03-08 | Nippon Electric Glass Co Ltd | ガラスフィルムの製造方法及び製造装置 |
US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
KR20180035111A (ko) * | 2016-09-28 | 2018-04-05 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 분단 방법 그리고 분단 장치 |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100849696B1 (ko) * | 2004-10-01 | 2008-07-31 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료의 스크라이브 방법 및 스크라이브 장치 |
JP5011048B2 (ja) * | 2007-09-27 | 2012-08-29 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法 |
CN101234850B (zh) * | 2008-02-20 | 2010-12-08 | 友达光电股份有限公司 | 玻璃基板的激光切割方法 |
WO2011002089A1 (ja) * | 2009-07-03 | 2011-01-06 | 旭硝子株式会社 | 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス |
CN102596831B (zh) * | 2009-11-03 | 2015-01-07 | 康宁股份有限公司 | 具有非恒定速度的移动玻璃带的激光刻划 |
JP5237318B2 (ja) * | 2010-03-19 | 2013-07-17 | 三星ダイヤモンド工業株式会社 | 基板分断装置 |
JP6500917B2 (ja) * | 2015-02-03 | 2019-04-17 | セントラル硝子株式会社 | 脆性材料の切断方法、脆性材料の切断装置、切断脆性材料の製造方法及び切断脆性材料 |
CN110416155B (zh) * | 2019-07-05 | 2021-10-15 | 佛山市国星半导体技术有限公司 | 一种led晶圆切割劈裂方法及led芯片 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000167681A (ja) * | 1998-12-04 | 2000-06-20 | Samsung Electronics Co Ltd | レ―ザ切断用基板,液晶表示装置パネルおよび液晶表示装置パネルの製造方法 |
JP2001176820A (ja) * | 1999-12-15 | 2001-06-29 | Hitachi Cable Ltd | 基板の加工方法及びその加工装置 |
JP2002100590A (ja) * | 2000-09-22 | 2002-04-05 | Sony Corp | 割断装置及びその方法 |
JP2002144067A (ja) * | 2000-10-21 | 2002-05-21 | Samsung Electronics Co Ltd | レーザビームを利用した非メタル基板の切断方法及び装置 |
-
2002
- 2002-07-18 TW TW091116002A patent/TW592868B/zh not_active IP Right Cessation
- 2002-07-18 CN CNB028084691A patent/CN1264768C/zh not_active Expired - Fee Related
- 2002-07-18 WO PCT/JP2002/007326 patent/WO2003008352A1/ja active IP Right Grant
- 2002-07-18 JP JP2003513913A patent/JP4133812B2/ja not_active Expired - Fee Related
- 2002-07-18 KR KR1020037010418A patent/KR100551526B1/ko not_active IP Right Cessation
-
2005
- 2005-03-01 HK HK05101802A patent/HK1069377A1/xx not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000167681A (ja) * | 1998-12-04 | 2000-06-20 | Samsung Electronics Co Ltd | レ―ザ切断用基板,液晶表示装置パネルおよび液晶表示装置パネルの製造方法 |
JP2001176820A (ja) * | 1999-12-15 | 2001-06-29 | Hitachi Cable Ltd | 基板の加工方法及びその加工装置 |
JP2002100590A (ja) * | 2000-09-22 | 2002-04-05 | Sony Corp | 割断装置及びその方法 |
JP2002144067A (ja) * | 2000-10-21 | 2002-05-21 | Samsung Electronics Co Ltd | レーザビームを利用した非メタル基板の切断方法及び装置 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7423237B2 (en) | 2003-10-31 | 2008-09-09 | The Japan Steel Works, Ltd. | Method of cutting laminated glass with laser beams |
WO2005042421A1 (ja) * | 2003-10-31 | 2005-05-12 | The Japan Steel Works, Ltd. | ガラスの切断方法 |
WO2006070825A1 (ja) * | 2004-12-28 | 2006-07-06 | Mitsuboshi Diamond Industrial Co., Ltd. | 脆性材料基板の分断方法および基板分断システム |
TWI380963B (zh) * | 2008-04-14 | 2013-01-01 | Mitsuboshi Diamond Ind Co Ltd | Method for processing brittle material substrates |
WO2009128334A1 (ja) * | 2008-04-14 | 2009-10-22 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法 |
JP5325209B2 (ja) * | 2008-04-14 | 2013-10-23 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法 |
JP2009294461A (ja) * | 2008-06-05 | 2009-12-17 | Toshiba Mobile Display Co Ltd | 液晶表示装置及びその製造方法 |
JP2011006313A (ja) * | 2009-06-29 | 2011-01-13 | Mitsuboshi Diamond Industrial Co Ltd | 薄板ガラス基板のスクライブ方法およびスクライブ装置 |
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
US9533910B2 (en) | 2009-08-28 | 2017-01-03 | Corning Incorporated | Methods for laser cutting glass substrates |
US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
US10358374B2 (en) | 2009-11-30 | 2019-07-23 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
JP2012046400A (ja) * | 2010-08-30 | 2012-03-08 | Nippon Electric Glass Co Ltd | ガラスフィルムの製造方法及び製造装置 |
US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
KR20180035111A (ko) * | 2016-09-28 | 2018-04-05 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 분단 방법 그리고 분단 장치 |
KR102472644B1 (ko) | 2016-09-28 | 2022-11-29 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 분단 방법 그리고 분단 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP4133812B2 (ja) | 2008-08-13 |
KR20040010588A (ko) | 2004-01-31 |
CN1525944A (zh) | 2004-09-01 |
KR100551526B1 (ko) | 2006-02-13 |
WO2003008352B1 (en) | 2003-03-20 |
TW592868B (en) | 2004-06-21 |
HK1069377A1 (en) | 2005-05-20 |
JPWO2003008352A1 (ja) | 2004-11-04 |
CN1264768C (zh) | 2006-07-19 |
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