WO2002084719A1 - Dispositif et procede d'exposition a un faisceau d'electrons - Google Patents

Dispositif et procede d'exposition a un faisceau d'electrons Download PDF

Info

Publication number
WO2002084719A1
WO2002084719A1 PCT/JP2002/002530 JP0202530W WO02084719A1 WO 2002084719 A1 WO2002084719 A1 WO 2002084719A1 JP 0202530 W JP0202530 W JP 0202530W WO 02084719 A1 WO02084719 A1 WO 02084719A1
Authority
WO
WIPO (PCT)
Prior art keywords
electron beam
shot
exposure region
basis
partial exposure
Prior art date
Application number
PCT/JP2002/002530
Other languages
English (en)
French (fr)
Inventor
Tomohiro Sakazaki
Shinichi Hamaguchi
Hiroshi Yasuda
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Publication of WO2002084719A1 publication Critical patent/WO2002084719A1/ja

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045Object or beam position registration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/3175Lithography

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
PCT/JP2002/002530 2001-04-09 2002-03-18 Dispositif et procede d'exposition a un faisceau d'electrons WO2002084719A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-109838 2001-04-09
JP2001109838A JP4251784B2 (ja) 2001-04-09 2001-04-09 電子ビーム露光装置、照射位置算出方法

Publications (1)

Publication Number Publication Date
WO2002084719A1 true WO2002084719A1 (fr) 2002-10-24

Family

ID=18961723

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/002530 WO2002084719A1 (fr) 2001-04-09 2002-03-18 Dispositif et procede d'exposition a un faisceau d'electrons

Country Status (3)

Country Link
JP (1) JP4251784B2 (ja)
TW (1) TW541590B (ja)
WO (1) WO2002084719A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10079206B2 (en) 2016-10-27 2018-09-18 Mapper Lithography Ip B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
US10522472B2 (en) 2016-09-08 2019-12-31 Asml Netherlands B.V. Secure chips with serial numbers

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4434573B2 (ja) 2002-11-29 2010-03-17 株式会社東芝 ライセンス移動装置及びプログラム
JP6147528B2 (ja) * 2012-06-01 2017-06-14 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置
JP6215061B2 (ja) * 2014-01-14 2017-10-18 株式会社アドバンテスト 電子ビーム露光装置
JP2017063101A (ja) * 2015-09-24 2017-03-30 株式会社アドバンテスト 露光装置および露光方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531191A (en) * 1980-12-26 1985-07-23 Tokyo Shibaura Denki Kabushiki Kaisha Electron beam pattern generation system
EP0220668A2 (en) * 1985-10-25 1987-05-06 Hitachi, Ltd. Charged particle beam lithography system
JPS6420619A (en) * 1987-07-15 1989-01-24 Toshiba Corp Electron beam aligner
JPH0529202A (ja) * 1991-07-23 1993-02-05 Hitachi Ltd 電子線描画データ作成装置、及び電子線描画システム
US6047116A (en) * 1997-03-18 2000-04-04 Kabushiki Kaisha Toshiba Method for generating exposure data for lithographic apparatus
US6057907A (en) * 1995-09-07 2000-05-02 Fujitsu Limited Method of and system for exposing pattern on object by charged particle beam

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531191A (en) * 1980-12-26 1985-07-23 Tokyo Shibaura Denki Kabushiki Kaisha Electron beam pattern generation system
EP0220668A2 (en) * 1985-10-25 1987-05-06 Hitachi, Ltd. Charged particle beam lithography system
JPS6420619A (en) * 1987-07-15 1989-01-24 Toshiba Corp Electron beam aligner
JPH0529202A (ja) * 1991-07-23 1993-02-05 Hitachi Ltd 電子線描画データ作成装置、及び電子線描画システム
US6057907A (en) * 1995-09-07 2000-05-02 Fujitsu Limited Method of and system for exposing pattern on object by charged particle beam
US6047116A (en) * 1997-03-18 2000-04-04 Kabushiki Kaisha Toshiba Method for generating exposure data for lithographic apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10522472B2 (en) 2016-09-08 2019-12-31 Asml Netherlands B.V. Secure chips with serial numbers
US10714427B2 (en) 2016-09-08 2020-07-14 Asml Netherlands B.V. Secure chips with serial numbers
US11004800B2 (en) 2016-09-08 2021-05-11 Asml Netherlands B.V. Secure chips with serial numbers
US11688694B2 (en) 2016-09-08 2023-06-27 Asml Netherlands B.V. Secure chips with serial numbers
US10079206B2 (en) 2016-10-27 2018-09-18 Mapper Lithography Ip B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
US10418324B2 (en) 2016-10-27 2019-09-17 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
US10600733B2 (en) 2016-10-27 2020-03-24 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
US11152302B2 (en) 2016-10-27 2021-10-19 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system

Also Published As

Publication number Publication date
JP2002305141A (ja) 2002-10-18
JP4251784B2 (ja) 2009-04-08
TW541590B (en) 2003-07-11

Similar Documents

Publication Publication Date Title
TWI457969B (zh) Multi - charged particle beam rendering device and multi - charged particle beam rendering method
US9715993B2 (en) Multi charged particle beam writing apparatus, and multi charged particle beam writing method
US8563953B2 (en) Charged particle beam writing apparatus and charged particle beam writing method
US9899187B2 (en) Charged particle beam writing apparatus and charged particle beam writing method
US20190103252A1 (en) Multi charged particle beam writing apparatus and multi charged particle beam writing method
TW201327578A (zh) 多重荷電粒子束描繪裝置及多重荷電粒子束描繪方法
US9852876B2 (en) Multi charged particle beam writing apparatus and multi charged particle beam writing method
KR960013137B1 (ko) 근접효과의 보정으로 물체상에 패턴을 기록하는 전자빔 노광방법
JP2018133552A (ja) 荷電粒子ビーム装置及び荷電粒子ビームの位置ずれ補正方法
JP6253924B2 (ja) 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
JP2001168017A5 (ja) 荷電粒子線露光装置、荷電粒子線露光装置を用いたデバイス製造方法
US6503671B1 (en) Electron beam writing method
WO2002084719A1 (fr) Dispositif et procede d'exposition a un faisceau d'electrons
JP2009038055A (ja) 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
CN110737178A (zh) 描绘数据生成方法、计算机可读记录介质及多带电粒子束描绘装置
JP4601146B2 (ja) 電子ビーム露光装置
US20180122616A1 (en) Charged Particle Beam Writing Apparatus, and Charged Particle Beam Writing Method
US11443918B2 (en) Charged particle beam writing method and charged particle beam writing apparatus
US11901156B2 (en) Multi-charged-particle-beam writing apparatus and multi-charged-particle-beam writing method
JP4056140B2 (ja) 荷電粒子ビーム露光装置
KR101001498B1 (ko) 빔 번짐 효과를 감소시킨 브이에스비 방식의 마스크제조방법
US10157723B2 (en) Multi charged particle beam writing apparatus and method of adjusting the same
US7105844B2 (en) Method for eliminating low frequency error sources to critical dimension uniformity in shaped beam writing systems
JP2004014591A (ja) 露光装置および露光方法
JPS61183926A (ja) 荷電ビ−ム照射装置

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): DE KR US

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642