WO2002071818A1 - Procede de production de tableau de connexions flexible - Google Patents

Procede de production de tableau de connexions flexible Download PDF

Info

Publication number
WO2002071818A1
WO2002071818A1 PCT/JP2002/001349 JP0201349W WO02071818A1 WO 2002071818 A1 WO2002071818 A1 WO 2002071818A1 JP 0201349 W JP0201349 W JP 0201349W WO 02071818 A1 WO02071818 A1 WO 02071818A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
patterned
wiring board
flexible wiring
coating
Prior art date
Application number
PCT/JP2002/001349
Other languages
English (en)
French (fr)
Inventor
Keiichi Naitoh
Toshihiro Shinohara
Masahiro Watanabe
Original Assignee
Sony Chemicals Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp. filed Critical Sony Chemicals Corp.
Priority to KR10-2003-7011057A priority Critical patent/KR20030080023A/ko
Publication of WO2002071818A1 publication Critical patent/WO2002071818A1/ja
Priority to US10/646,623 priority patent/US6912779B2/en
Priority to US11/087,211 priority patent/US7098132B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
PCT/JP2002/001349 2001-02-23 2002-02-18 Procede de production de tableau de connexions flexible WO2002071818A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR10-2003-7011057A KR20030080023A (ko) 2001-02-23 2002-02-18 플렉서블 배선 기판의 제조 방법
US10/646,623 US6912779B2 (en) 2001-02-23 2003-08-22 Method of manufacturing flexible wiring board
US11/087,211 US7098132B2 (en) 2001-02-23 2005-03-23 Method of manufacturing flexible wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-48878 2001-02-23
JP2001048878A JP2002252446A (ja) 2001-02-23 2001-02-23 フレキシブル配線基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/646,623 Continuation US6912779B2 (en) 2001-02-23 2003-08-22 Method of manufacturing flexible wiring board

Publications (1)

Publication Number Publication Date
WO2002071818A1 true WO2002071818A1 (fr) 2002-09-12

Family

ID=18910069

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/001349 WO2002071818A1 (fr) 2001-02-23 2002-02-18 Procede de production de tableau de connexions flexible

Country Status (6)

Country Link
US (2) US6912779B2 (ja)
JP (1) JP2002252446A (ja)
KR (1) KR20030080023A (ja)
CN (1) CN1231103C (ja)
TW (1) TW521360B (ja)
WO (1) WO2002071818A1 (ja)

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JP2014192483A (ja) * 2013-03-28 2014-10-06 Hitachi Chemical Co Ltd 多層配線基板の製造方法
JP2016086075A (ja) * 2014-10-24 2016-05-19 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及びその製造方法

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JP2003209366A (ja) * 2002-01-15 2003-07-25 Sony Corp フレキシブル多層配線基板およびその製造方法
US7565738B2 (en) * 2004-05-31 2009-07-28 Sanyo Electric Co., Ltd. Method for manufacturing circuit device
JP2006019361A (ja) 2004-06-30 2006-01-19 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP4876396B2 (ja) * 2005-01-05 2012-02-15 東洋紡績株式会社 プリント配線板
US7834273B2 (en) * 2005-07-07 2010-11-16 Ibiden Co., Ltd. Multilayer printed wiring board
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CN101807517B (zh) * 2010-02-25 2011-09-21 中国科学院上海微系统与信息技术研究所 形成铜互连mim电容器结构的方法
US8541693B2 (en) * 2010-03-31 2013-09-24 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
DE102010016780B4 (de) * 2010-05-04 2021-08-12 Cicor Management AG Verfahren zur Herstellung einer flexiblen Schaltungsanordnung
CN102905474B (zh) * 2011-07-28 2015-09-30 景硕科技股份有限公司 电路载板导电凸块的制作方法
KR101397303B1 (ko) * 2012-12-31 2014-05-23 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조 방법
CN103987196A (zh) * 2014-05-26 2014-08-13 蔡新民 一种免烘烤湿膜线路板的制作方法
KR102268385B1 (ko) * 2014-08-14 2021-06-23 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
CN104319240B (zh) * 2014-10-27 2017-06-23 京东方科技集团股份有限公司 一种柔性基板贴附方法
CN105657988B (zh) * 2014-11-21 2019-04-23 宏启胜精密电子(秦皇岛)有限公司 柔性电路板及其制作方法
CN106163102B (zh) * 2015-04-02 2018-11-23 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法
JP6499925B2 (ja) * 2015-06-02 2019-04-10 タツタ電線株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板用補強部材、及びフレキシブルプリント基板
JP6700207B2 (ja) * 2017-02-08 2020-05-27 矢崎総業株式会社 印刷回路の電気接続方法
US10332832B2 (en) * 2017-08-07 2019-06-25 General Electric Company Method of manufacturing an electronics package using device-last or device-almost last placement
US11377749B1 (en) 2017-10-17 2022-07-05 Seagate Technology Llc Electrodeposition of high damping magnetic alloys
US11152020B1 (en) 2018-05-14 2021-10-19 Seagate Technology Llc Electrodeposition of thermally stable alloys
CN108874226B (zh) * 2018-06-29 2021-06-11 信利光电股份有限公司 一种触摸屏ito膜层的刻蚀方法及触摸屏组件
KR102142802B1 (ko) * 2019-02-25 2020-08-10 (주)티에스이 후면 전극을 이용한 전기 도금 처리에 의한 회로 기판의 제조 방법
KR102142803B1 (ko) * 2019-02-25 2020-08-10 (주)티에스이 폴리이미드 필름을 이용한 회로 기판의 제조 방법

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Publication number Priority date Publication date Assignee Title
JPH05283865A (ja) * 1992-03-31 1993-10-29 Dainippon Printing Co Ltd 多層フレキシブルプリント配線板の製造方法
JPH06132630A (ja) * 1992-10-20 1994-05-13 Matsushita Electric Ind Co Ltd フレキシブル配線板の製造方法
JP2000165049A (ja) * 1998-11-27 2000-06-16 Shinko Electric Ind Co Ltd 多層回路基板の製造方法
JP2000261141A (ja) * 1999-03-08 2000-09-22 Shinko Electric Ind Co Ltd 多層配線基板及びその製造方法並びに半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192483A (ja) * 2013-03-28 2014-10-06 Hitachi Chemical Co Ltd 多層配線基板の製造方法
JP2016086075A (ja) * 2014-10-24 2016-05-19 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及びその製造方法
US10426031B2 (en) 2014-10-24 2019-09-24 Sumitomo Electric Printed Circuits, Inc. Flexible printed circuit board and method for producing the same

Also Published As

Publication number Publication date
TW521360B (en) 2003-02-21
US6912779B2 (en) 2005-07-05
CN1505916A (zh) 2004-06-16
US20050164492A1 (en) 2005-07-28
US20040078970A1 (en) 2004-04-29
JP2002252446A (ja) 2002-09-06
CN1231103C (zh) 2005-12-07
KR20030080023A (ko) 2003-10-10
US7098132B2 (en) 2006-08-29

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