WO2002042016A1 - Traitement des rebuts de cartes imprimées, et appareil à cet effet - Google Patents

Traitement des rebuts de cartes imprimées, et appareil à cet effet Download PDF

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Publication number
WO2002042016A1
WO2002042016A1 PCT/JP2000/008345 JP0008345W WO0242016A1 WO 2002042016 A1 WO2002042016 A1 WO 2002042016A1 JP 0008345 W JP0008345 W JP 0008345W WO 0242016 A1 WO0242016 A1 WO 0242016A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
waste material
board waste
printed board
Prior art date
Application number
PCT/JP2000/008345
Other languages
English (en)
Japanese (ja)
Inventor
Keinosuke Fujita
Original Assignee
Maxgain Co Ltd
Keinosuke Fujita
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxgain Co Ltd, Keinosuke Fujita filed Critical Maxgain Co Ltd
Priority to PCT/JP2000/008345 priority Critical patent/WO2002042016A1/fr
Priority to AU2001215526A priority patent/AU2001215526A1/en
Publication of WO2002042016A1 publication Critical patent/WO2002042016A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Definitions

  • Patent application title Printed circuit board waste material treatment method and apparatus
  • the present invention relates to a method and an apparatus for treating printed circuit board waste used in electronic devices such as personal computers and mobile phones that are no longer required.
  • Printed circuit boards used for electronic devices such as personal computers and mobile phones are made of reinforcing fibers such as Kepler fiber as the core material and are hardened with polyester resin or epoxy resin, etc. And electronic components such as IC boards and capacitors are soldered and mounted.
  • the printed circuit board waste material is crushed as it is, the resin that is a substrate material component is burned, then melted using chemicals, etc. They were melted in a melting furnace and made into ingots.
  • the recovered ingot contains many kinds of valuable materials, and in order to separate and recover them, it is necessary to use an acid treatment, a alkali treatment, and an electrolytic treatment. And other chemical treatments, and in these processes, various harmful substances are emitted, and there is a problem that secondary pollution may occur.
  • the conventional method of treating printed circuit board waste has a problem in that many substances that cannot be reused after the treatment are discharged, and that the treatment of the substances becomes difficult.
  • the conventional method of treating printed circuit board waste has a problem in that each processing step has a long time and processing efficiency is poor.
  • the present invention has been made with the object of solving the above-mentioned conventional problems, and it is possible to reuse a part of the collected printed circuit boards and electronic components, and to perform chemical treatment. Because there is no risk of secondary pollution, the amount of substances that cannot be reused after processing is small, and each processing step can be performed continuously and in a short time, resulting in extremely high processing efficiency.
  • An object of the present invention is to provide an excellent method for treating printed circuit board waste and an apparatus therefor. Disclosure of the invention
  • a method of treating printed substrate waste material includes the steps of: heating a chucked printed substrate waste material to separate and recover solder from the printed substrate waste material; A step of separating and recovering the surface mount component from the waste material, a step of vibrating the printed substrate waste material and a step of separating and recovering the through-mount component from the printed circuit board waste material, The method includes a step of separating and collecting the remaining mounted components from the waste material, and a step of collecting the printed board from which the mounted components are separated.
  • the printed circuit board waste material processing apparatus of the present invention includes a transfer device 20 that is arranged so as to be capable of being transported into a heating furnace 10 for heating the printed circuit board waste material W by grasping the printed circuit board waste material W with a chuck.
  • the printed circuit board collecting means 100 from which the mounted components are separated is provided.
  • FIG. 1 is a block diagram showing steps of a method for treating printed circuit board waste according to the present invention.
  • FIG. 2 is an overall explanatory view of the printed board waste material treating apparatus of the present invention.
  • FIG. 3 is an explanatory view of the printed circuit board waste material treating apparatus of the present invention viewed from above in FIG.
  • FIG. 4 is an enlarged explanatory view of the printed board waste material processing apparatus of the present invention as viewed from the left direction in FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • the method for treating printed circuit board waste according to the present invention includes the following steps.
  • the printed circuit board waste material can be checked by the expansion / contraction chuck regardless of the size and shape of the printed circuit board waste material.
  • a uniform preheating (block 2a) is performed to about 150 ° C with an infrared lamp and a heater, and then a temperature about 300 times the solder melting temperature (300 ° C).
  • Main heating (block 2b) is performed before and after).
  • the surface of the printed circuit board waste is rubbed with a rotating brush or the like to remove the odd-shaped parts left on the printed circuit board waste.
  • Step 6 Step of recovering the printed circuit board from which the mounted components have been separated (block 6) In this step, the printed circuit board from which the mounted components have been separated is cooled down with a fan or the like, and then collected by dropping it on a tray or the like. ing.
  • the printed board waste material processing apparatus of the present invention includes a heating furnace 10, a transfer apparatus 20, a feeding apparatus 30, a blowing duct 40, a vibrating apparatus 50, And a rubbing device 60 is provided.
  • the heating furnace 10 includes an infrared lamp (not shown) and an electric heater (not shown) in the furnace. These infrared lamps and electric heaters are used to raise the furnace temperature to a preheating temperature of about 150 ° C, and a main heating temperature of 30 (about TC (1.3 times the melting temperature of solder)). To be adjusted.
  • the transfer device 20 is configured such that a transfer chain 23 is stretched between a driving sprocket 21 and a driven sprocket 22, and a telescopic chuck 24 is provided around the outer periphery of the transfer chain 23. It has been attached. Then, the printed circuit board waste material W is grasped by the stretchable check 24 and transported into the heating furnace 10.
  • reference numeral 25 in the drawing denotes a motor for driving the drive sprocket 21, and reference numeral 26 denotes a speed reducer.
  • the feeding device 30 is connected to the conveying device 20 and has a belt conveyor (not shown) having a feeder (not shown) for aligning the sides of the printed substrate waste material W. .
  • the belt conveyor conveys and retracts the transfer device 20.
  • the printed circuit board waste material W can be sent directly under the hook 24, and the printed circuit board waste material W can be grasped by the stretchable check 24.
  • the blow duct 40 is provided in the heating furnace 10 and is provided with a hot air injection mechanism (not shown) such as a hot jet.
  • the hot air jet mechanism blows the printed circuit board waste material W to separate the surface-mounted components of the printed circuit board waste material W.
  • the vibrating device 50 is provided in the heating furnace 10 and has a sonic vibration mechanism (not shown). Then, the printed circuit board waste material W is vibrated by applying a vibration of 50 to 200 Hz to the printed circuit board waste material W by the sonic vibration mechanism, and the through-mount components of the printed circuit board waste material W are separated. I have.
  • the rubbing device 60 is provided in the heating furnace 10 and has a rotating brush 61.
  • the rotating brush 61 rubs both surfaces of the printed circuit board waste material W to separate the remaining mounted components of the printed circuit board waste material W.
  • a solder collecting means 70 (for example, a belt conveyor or the like) is provided below the transfer device 20, and is provided below the blower duct 40 and the vibration device 50.
  • a collecting means 80 (for example, a tray or the like) for surface-mounted components and penetrating mounted components is provided immediately in front of the collecting means 70, and a collecting means 90 (for example, a belt conveyor 9) for remaining mounted components is provided below the rubbing device 60. 1 and a tray 92), and a collecting means 100 (for example, a tray or the like) of a printed circuit board from which mounted components are separated below the transport device 20.
  • Each processing step can be performed continuously and in a short time, and the processing efficiency is extremely excellent.

Abstract

Le traitement de l'invention implique d'abord un chauffage des rebuts de cartes imprimées percées de façon à séparer et récupérer la soudure des rebuts de cartes imprimées. On souffle ensuite sur la carte imprimée pour séparer et recueillir les composants qui y sont montés en surface. En soumettant à des vibrations la carte, on sépare et recueille les composants montés dans les connexions par trous traversants dans la carte. Un lavage de la surface de la carte imprimée permet d'en séparer et de recueillir les composants montés résiduels. Il ne reste plus qu'à recueillir la carte imprimée débarrassée des composants qui y avaient été montés. Ce procédé permet ainsi de réutiliser la carte imprimée recueillie et une partie des composants recueillis. Etant donné qu'il n'y a aucun traitement chimique, il n'y a aucun risque de produire une pollution secondaire. En outre, le traitement n'abandonne que très peu de substance non recyclables. Enfin, étant donné que les diverses opérations peuvent s'effectuer en continu en un temps très bref, l'efficacité du processus est particulièrement intéressante.
PCT/JP2000/008345 2000-11-27 2000-11-27 Traitement des rebuts de cartes imprimées, et appareil à cet effet WO2002042016A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2000/008345 WO2002042016A1 (fr) 2000-11-27 2000-11-27 Traitement des rebuts de cartes imprimées, et appareil à cet effet
AU2001215526A AU2001215526A1 (en) 2000-11-27 2000-11-27 Method of processing printed board scrap and apparatus for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/008345 WO2002042016A1 (fr) 2000-11-27 2000-11-27 Traitement des rebuts de cartes imprimées, et appareil à cet effet

Publications (1)

Publication Number Publication Date
WO2002042016A1 true WO2002042016A1 (fr) 2002-05-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/008345 WO2002042016A1 (fr) 2000-11-27 2000-11-27 Traitement des rebuts de cartes imprimées, et appareil à cet effet

Country Status (2)

Country Link
AU (1) AU2001215526A1 (fr)
WO (1) WO2002042016A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100883027B1 (ko) 2007-09-06 2009-02-09 금오공과대학교 산학협력단 폐 솔더 페이스트 회수장치
CN102284471A (zh) * 2011-08-16 2011-12-21 西南科技大学 利用工业余热自动拆卸回收废弃印刷电路板的方法
CN102319723A (zh) * 2011-08-16 2012-01-18 西南科技大学 废弃印刷电路板电子元器件自动拆卸回收设备
CN103480933A (zh) * 2013-09-12 2014-01-01 伟翔环保科技发展(上海)有限公司 一种利用高压热风自动分离废弃线路板元件的方法
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5715592A (en) * 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
JPH10200255A (ja) * 1997-01-06 1998-07-31 Matsushita Electric Ind Co Ltd プリント基板からの電子部品および半田の分離装置および分離方法
JPH1134058A (ja) * 1997-07-24 1999-02-09 Mitsubishi Electric Corp 廃棄物処理装置
JPH11314084A (ja) * 1998-02-17 1999-11-16 Matsushita Electric Ind Co Ltd 回路基板の処理方法とその装置
JP2000151094A (ja) * 1998-11-16 2000-05-30 Matsushita Electric Ind Co Ltd プリント回路基板の解体処理方法および解体処理システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5715592A (en) * 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
JPH10200255A (ja) * 1997-01-06 1998-07-31 Matsushita Electric Ind Co Ltd プリント基板からの電子部品および半田の分離装置および分離方法
JPH1134058A (ja) * 1997-07-24 1999-02-09 Mitsubishi Electric Corp 廃棄物処理装置
JPH11314084A (ja) * 1998-02-17 1999-11-16 Matsushita Electric Ind Co Ltd 回路基板の処理方法とその装置
JP2000151094A (ja) * 1998-11-16 2000-05-30 Matsushita Electric Ind Co Ltd プリント回路基板の解体処理方法および解体処理システム

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100883027B1 (ko) 2007-09-06 2009-02-09 금오공과대학교 산학협력단 폐 솔더 페이스트 회수장치
CN102284471A (zh) * 2011-08-16 2011-12-21 西南科技大学 利用工业余热自动拆卸回收废弃印刷电路板的方法
CN102319723A (zh) * 2011-08-16 2012-01-18 西南科技大学 废弃印刷电路板电子元器件自动拆卸回收设备
CN102284471B (zh) * 2011-08-16 2014-10-01 西南科技大学 利用工业余热自动拆卸回收废弃印刷电路板的方法
CN103480933A (zh) * 2013-09-12 2014-01-01 伟翔环保科技发展(上海)有限公司 一种利用高压热风自动分离废弃线路板元件的方法
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
US11343950B2 (en) 2014-08-06 2022-05-24 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Also Published As

Publication number Publication date
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