AU2001215526A1 - Method of processing printed board scrap and apparatus for the same - Google Patents

Method of processing printed board scrap and apparatus for the same

Info

Publication number
AU2001215526A1
AU2001215526A1 AU2001215526A AU1552601A AU2001215526A1 AU 2001215526 A1 AU2001215526 A1 AU 2001215526A1 AU 2001215526 A AU2001215526 A AU 2001215526A AU 1552601 A AU1552601 A AU 1552601A AU 2001215526 A1 AU2001215526 A1 AU 2001215526A1
Authority
AU
Australia
Prior art keywords
same
printed board
processing printed
board scrap
scrap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001215526A
Inventor
Keinosuke Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MAXGAIN CO Ltd
Original Assignee
MAXGAIN CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MAXGAIN CO Ltd filed Critical MAXGAIN CO Ltd
Publication of AU2001215526A1 publication Critical patent/AU2001215526A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Processing Of Solid Wastes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2001215526A 2000-11-27 2000-11-27 Method of processing printed board scrap and apparatus for the same Abandoned AU2001215526A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/008345 WO2002042016A1 (en) 2000-11-27 2000-11-27 Method of processing printed board scrap and apparatus for the same

Publications (1)

Publication Number Publication Date
AU2001215526A1 true AU2001215526A1 (en) 2002-06-03

Family

ID=11736718

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001215526A Abandoned AU2001215526A1 (en) 2000-11-27 2000-11-27 Method of processing printed board scrap and apparatus for the same

Country Status (2)

Country Link
AU (1) AU2001215526A1 (en)
WO (1) WO2002042016A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100883027B1 (en) 2007-09-06 2009-02-09 금오공과대학교 산학협력단 Apparatus for collecting waste solder paste
CN102284471B (en) * 2011-08-16 2014-10-01 西南科技大学 Method for automatically dismantling and recovering waste printed circuit board by using industrial exhaust heat
CN102319723A (en) * 2011-08-16 2012-01-18 西南科技大学 The discarded printed circuit boards electronic devices and components are dismantled reclaimer automatically
CN103480933B (en) * 2013-09-12 2016-03-23 伟翔环保科技发展(上海)有限公司 A kind of method utilizing high-pressure hot wind to be automatically separated discarded circuit board element
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5715592A (en) * 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
JPH10200255A (en) * 1997-01-06 1998-07-31 Matsushita Electric Ind Co Ltd Separating device for electronic part and solder from printed board, and separating method
JPH1134058A (en) * 1997-07-24 1999-02-09 Mitsubishi Electric Corp Waste disposal device
JP4374639B2 (en) * 1998-02-17 2009-12-02 パナソニック株式会社 Circuit board processing method and apparatus
JP3650533B2 (en) * 1998-11-16 2005-05-18 松下電器産業株式会社 Print circuit board disassembly processing method and disassembly processing system

Also Published As

Publication number Publication date
WO2002042016A1 (en) 2002-05-30

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