JP3650533B2 - Print circuit board disassembly processing method and disassembly processing system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
Disclosed is a printed circuit board that removes mounted electronic components and various molded products from the printed circuit board for the purpose of recycling the printed circuit board incorporated in, for example, home appliances and information communication devices. The present invention relates to a processing method and a dismantling processing system.
[0002]
[Prior art]
In recent years, technological development for recycling waste has been actively promoted in various fields in order to conserve the global environment and save resources. In the electric field, technological development to recycle the waste of household electrical appliances that has been generated in large quantities every year has become a development issue that should be promoted rapidly. Among the components of home appliances, technological development for recycling printed circuit boards, which have both high content of valuable resources and high content of harmful substances such as lead, is a research theme that should be promoted particularly quickly. ing.
[0003]
Conventionally, when removing a mounting component from a printed circuit board of household electrical appliances as waste, means for melting the solder of the soldering portion of the mounting component on the printed circuit board and lifting the mounting component off the printed circuit board Alternatively, a means for scraping the mounting component from the printed circuit board with the metal blade by pressing the metal blade rotating while heating the printed circuit board in the tunnel furnace is employed.
[0004]
[Problems to be solved by the invention]
By the way, in recent years, printed circuit boards on which chip parts and the like are surface-mounted tend to increase, and surface-mounted electronic parts are generally mounted on both sides of the board at high density by utilizing the characteristics. However, none of the conventional mounting component removal means can efficiently disassemble the surface mounted printed circuit board mounted on both sides, and the surface mounted electronic components can be efficiently recycled in a good state. It is difficult to collect.
[0005]
In other words, the means for lifting the mounting component by melting the solder of the soldering part of the mounting component requires a large number of dedicated jigs for lifting the mounting component in the molten state of the solder, and the board size is also limited. It cannot be applied to dismantling a surface mount printed circuit board. Further, the means for scraping the mounted component with the rotating metal blades causes inconveniences such as the electronic component colliding with the collection guide body and causing the resin package of the electronic component to be damaged. Moreover, in the past, mounting components that can only be removed on one side by any removal means, and are mounted at high density over the entire surface including the vicinity of the board edge when removing the mounting component on one side. It is very difficult to remove all of these efficiently and efficiently.
[0006]
Accordingly, the present invention has been made in view of the above-described conventional problems, and can efficiently recover a double-sided surface-mounted printed circuit board while collecting electronic components in a good recyclable state. It is an object of the present invention to provide a circuit board disassembly processing method and a disassembly processing system capable of reliably realizing the disassembly processing method with a simple configuration.
[0007]
[Means for Solving the Problems]
  In order to achieve the above object, a method for disassembling a printed circuit board according to the present invention comprises:On both sidesElectronic componentsRespectivelyA step of chucking the surface-mounted printed circuit board in a vertical arrangement and inserting it into the heating area, and melting the solder of the soldered portion of the printed circuit board;A pair ofThe tip of the bladeTheLint circuit boardBothIn contact with the surfaceMove with chuck, frontElectronic componentsat the same timeAnd stripping with the bladeWhen chucking the end portion of the printed circuit board, the pair of blades are arranged at an obtuse angle with respect to the surface of the printed circuit board, and the leading ends of the both blades are positioned at the chucking position on the printed circuit board. It was made to abut in the vicinity.It is characterized by that.
[0008]
  In this method of disassembling a printed circuit board, in a state where the solder of the soldered portion of the printed circuit board is heated and melted, the printed circuit board isWith chuckWhile movingTheThe tip of the ladeBothSince the surface-mounted electronic component is peeled off in contact with the surface, the surface-mounted electronic component can be peeled off very smoothly and reliably. Also, since the electronic components are peeled off in a vertical state with the printed circuit board, the peeled electronic components are dropped and collected as they are and are not scattered in all directions as in the case of using conventional rotating metal blades. The parts can be recovered in a good state that can be recycled while preventing inconvenience such as breakage of the resin package.Further, even a printed circuit board surface-mounted on both sides can be peeled off simultaneously because the surface-mounted electronic components on both sides can be peeled off at the same time.
  Then, when chucking the end of the printed circuit board, the pair of blades are arranged at an obtuse angle with respect to the surface of the printed circuit board, and the leading ends of the both blades are chucked positions on the printed circuit board. Therefore, even if the surface mount printed circuit board is mounted with high density, all the electronic components including the electronic components at the end can be surely peeled off.
[0009]
  In the dismantling method of the above invention,TheCollect surface mount type electronic components that are peeled off and dropped from both sides of the lint circuit board in the component collection box.It is preferable to do so.
[0012]
A disassembly processing system for a printed circuit board according to the present invention includes a frame body that is moved up and down by a vertical movement mechanism, and a chuck that is provided on the frame body so as to reciprocate within a certain range in a horizontal direction. A chuck that holds the end of a vertically mounted surface-mounted printed circuit board with the chuck claw portion of the chuck that protrudes from the frame body toward the substrate supply area when it is positioned upward. A printed circuit board chucked by the chuck having a king mechanism and a blade disposed on the side of the movement path of the chuck and disposed on the frame body so as not to move in the movement direction of the chuck A stripping mechanism portion that comes into contact with the tip end portion of the blade at a position in the vicinity of the chuck claw portion, and the vertical motion The heating unit has a heating area for inserting the printed circuit board chucked by the chuck when the frame body is lowered by driving the part, and the heating area is maintained at an atmospheric temperature higher than the melting temperature of the solder And when the solder of the soldered portion of the printed circuit board inserted into the heating area is melted by the lowering of the frame body, the chuck moves in the backward direction while chucking the printed circuit board. The surface mount type electronic component of the moved printed circuit board is peeled off at the tip of the blade.
[0013]
In this printed circuit board disassembly processing system, the printed circuit board disassembly processing method according to the present invention is a simple one comprising only a chucking mechanism portion, a peeling mechanism portion, and a heating unit mounted on a vertically movable frame body. It can be realized faithfully with the configuration, and the same effect as the dismantling processing method can be obtained.
[0014]
In the dismantling processing system, the stripping mechanism is configured such that the pair of blades arranged on both sides of the chuck movement path are urged by an elastic body in a direction in which the front ends contact each other, and the rear ends are mutually connected. It is arranged so as to be spaced apart from each other in a plan view and arranged so as to be displaceable so as to allow the chuck pawls to pass by being displaced in the separating direction by chucks moving in the advancing direction. it can.
[0015]
As a result, a pair of blades are provided in a relative arrangement that is effective with respect to the chuck and does not hinder the operation of the chuck, and the electronic components on both sides of the printed circuit board mounted on both sides can be easily and simultaneously peeled off. it can.
[0016]
Further, in the above configuration, the pair of blades are attached to the frame body so that an angle formed in an approximately eight shape in plan view can be varied within an acute angle and an obtuse angle range by a guide mechanism in which the guide shaft and the guide hole are engaged. In addition, the end opposite to each tip is connected to a driving source via a connecting mechanism, and the driving source obtuses the angle between the blades when the chuck chucks the printed circuit board. And the chuck is driven so as to make the angle an acute angle immediately after the chuck starts moving in the retracting direction in which the printed circuit board is pulled out of the heating area.
[0017]
As a result, a pair of blades are effectively operated with a simple configuration on a surface-mounted printed circuit board mounted with high density, and all the electronic components on both sides including the electronic components at the end of the printed circuit board are mounted. It can be peeled off reliably.
[0018]
Furthermore, in the dismantling processing system, a substrate recovery box for recovering the blunt circuit board is disposed at a position below the chuck that has moved in the backward direction and stopped drawing the printed circuit board from the heating area, and the chuck The chuck claw portion may be controlled to open when stopped above the substrate collection box. As a result, the printed circuit board from which the electronic components have been removed can be collected at a predetermined position without any trouble in the course of a series of operations of the chuck.
[0019]
Further, the dismantling processing system includes a controller for sequence control, and the controller opens the chuck claw portion in a standby state in which the chuck claw portion of the chuck protrudes toward the substrate supply area side from the blade, thereby allowing the printed circuit board to be opened. The vertical movement mechanism is driven and controlled so as to lower the frame body until the end of the chuck is chucked by the chuck claw and the printed circuit board chucked by the chuck is inserted into the heating area, and then the printed circuit The substrate is heated for a predetermined time, and after the predetermined time has elapsed, the chuck is moved in the backward direction, and when all the electronic components mounted on the printed circuit board have been removed with a blade, the chuck is stopped and stopped. Open and close the chuck to release chucking of the printed circuit board Thereafter, the vertical movement mechanism is driven and controlled so that the frame body rises to an upper limit position facing the substrate supply area, and after the frame body reaches the upper limit position, the chuck is moved in the advance direction. The chuck claw portion may be in a standby state in which it protrudes to the substrate supply area side with respect to the blade, and the above process may be controlled to be repeated as one cycle.
[0020]
As a result, manual operation by the worker is only required to turn on the operation switch after chucking the printed circuit board to the chuck by operating the chuck operation switch in the standby state. Can be done efficiently.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a partially cut plan view of a principal part showing a disassembled processing system for a printed circuit board that embodies a disassembled processing method for a printed circuit board according to an embodiment of the present invention, and FIG. It is. In these drawings, this printed circuit board disassembly processing system, when roughly classified, has a chucking mechanism section 1 that chucks the end of a double-sided surface-mounted printed circuit board 7 and moves in the horizontal direction. A peeling mechanism unit 2 that simultaneously peels off the surface-mounted electronic components on both sides of the surface-mounted printed circuit board 7 that is chucked by the chucking mechanism unit 1 and moved in the horizontal direction, and the chucking mechanism unit 1 and the peeling. The vertical movement mechanism unit 3 that moves up and down the frame body 8 on which the mechanism unit 2 is mounted, and the surface-mounted printed circuit board 7 that is chucked by the chucking mechanism unit 1 and inserted as the frame body 8 is lowered melts the solder. And a heating unit 4 for heating to a temperature.
[0022]
The frame body 8 has a top plate 9, a bottom plate 10, a back plate 11, and a right side plate 12, and has a box shape with the front side and the left side opened. The chucking mechanism unit 1 is attached to the support frame 14 in such an arrangement that the chuck 13 chucks the printed circuit board 7 in a vertically positioned state, and the support frame 14 is used for moving the chuck fixed to the right side plate 12. It is connected to the rod 18 of the air cylinder 17.
[0023]
Accordingly, the chuck 13 is horizontally moved in the left-right direction in the drawing by the discharge and suction drive of the chuck moving air cylinder 17. When the chuck 13 moves, a pair of sliders 23 provided above and below the support frame 14 slide on the corresponding guide shafts 24. As a result, the chuck 13 smoothly moves in the left-right direction while being supported by the pair of guide shafts 24. The upper and lower guide shafts 24 are supported at both ends by the right side plate 12, the upper surface plate 9 and the lower surface plate 10.
[0024]
The chuck 13 has a shape in which a plier tool is extended in a direction orthogonal to the opening / closing direction, and is opened / closed by using a plurality of (in this embodiment, six as shown in FIG. 2) pin cylinders 19 as a driving source. As shown in FIG. 1, the end of the front chuck body is fixed to the support frame body 14. The chuck body on the rear side of the chuck 13 integrally has a fixed chuck claw portion 20 at the center in the vertical direction of the tip, and variable chuck claw portions 21 are detachably attached to the upper and lower sides by screws 22. . The variable chuck claw portion 21 can be appropriately replaced in accordance with the type of the printed circuit board 7 to be chucked, and can accommodate various printed circuit boards 7 having different sizes. Note that the variable chuck claw portion 21 may be configured to be moved along the support shaft to a position suitable for the printed circuit board 7. On the other hand, an integrated chuck claw portion 25 is provided at the tip of the front chuck body.
[0025]
The stripping mechanism 2 includes a pair of blades 27 whose upper and lower lengths are longer than the chuck 13 and guide shafts 28 projecting from the upper and lower ends of the upper plate 9 and the lower plate 10 respectively. It is inserted through the hole 29 and supported so as to be freely rotatable, and as shown in FIG. The blades 27 are urged in directions close to each other by a tension spring 30 suspended between the upper and lower portions near the stripping blade portion 31 with respect to the guide shaft 28. Thereby, both the blades 27 are urged to rotate in the direction in which the stripping blade portions 31 are in contact with each other with the guide shafts 28 as fulcrums. Further, the upper and lower ends of both blades 27 opposite to the stripping blade portions 31 are connected to the rods 34 of the blade opening / closing air cylinders 33 via individual link mechanisms 32. The upper and lower blade opening / closing air cylinders 33 are fixed to the upper surface plate 9 and the lower surface plate 10, respectively. Details of the opening / closing operation of the blades 27 by driving the blade opening / closing air cylinder 33 will be described later.
[0026]
The vertical movement mechanism 3 includes a vertical air cylinder 37 as a driving source, a driving sprocket 39 attached to the tip of a rod 38 of the air cylinder 37, and a passive side provided on the upper plate 9 in the frame body 8. The sprocket 40 includes a chain 43 that is looped around the sprockets 39 and 40 from the fixed side fastening part 41 and is fastened to the movable side fastening part 42 of the top plate 9. FIG. 2 shows a state in which the frame body 8 is raised to the upper limit position. When the vertical movement air cylinder 37 is driven to discharge the rod 38, the chucking mechanism 1 and the peeling mechanism 2 are mounted. The chain 43 is rotated by rotating the sprockets 39, 40 in the direction of the arrow in FIG. The frame body 8 moves up and down while maintaining a stable posture without rattling by a pair of left and right linear bushes 44 provided on the back plate 11 sliding on a vertical guide shaft 47.
[0027]
In the heating unit 4, an air blowing casing 49 and an air receiving casing 50 both having substantially the same shape as the speaker are installed in the heating chamber 48 so as to face each other at a predetermined interval. A heating area 51 is set in the facing space. That is, in the heating area 51, hot air 54 is fed from the air duct 52 through the air casing 49, and the solder melting temperature is 183 ° C. or higher and the resin melting temperature is 240 ° C. or lower. For example, the temperature is maintained at 200 ° C.
[0028]
The wind receiving casing 50 communicates with a dust collector (not shown) through an exhaust duct 53, and solder fume and dust harmful to the human body generated by melting of the solder are sucked into the exhaust duct 53 and heated. 51 is quickly removed. The stripping mechanism 2 is configured such that portions of the blades 27 protruding leftward from the upper and lower plates 9 and 10 enter the heating area 51 when the frame body 8 is lowered to the lower limit position with respect to the heating unit 4. The positional relationship is set. A support net 57 for preventing deformation of the printed circuit board 7 due to the blowing of hot air 54 is attached to the opening of the wind receiving casing 50 so as to protrude to near the center of the heating area 51. On the upper wall portion of the heating chamber 48, an opening / closing lid 58 urged in a closing direction by a torsion spring (not shown) is provided. The opening / closing lid 58 is chucked when the frame body 8 is lowered. 13 is pressed and opened by the printed circuit board 7 chucked by 13, and insertion of the printed circuit board 7 into the heating area 51 is allowed. An opening / closing lid 59 that is controlled to open and close at a predetermined timing by a control unit (not shown) is provided on the bottom wall of the heating chamber 48. These open / close lids 58 and 59 prevent a decrease in the ambient temperature of the heating area 51.
[0029]
As shown in FIG. 2, the surface mounted electronic component peeled off from the printed circuit board 7 is collected at a position below the opening / closing lid 59 of the heating chamber 48, that is, below the stripping blade portion 31 of the blade 27. A parts collection box 60 is installed. Also, a board collection box 61 for collecting the printed circuit board 7 from which all the mounted components have been removed is installed at a position below the left half of the frame body 8.
[0030]
Next, the disassembly processing operation of the surface-mounted printed circuit board 7 by the disassembly processing system will be described with reference to FIGS. 3 (a) to 3 (g) are operation explanatory views showing the state of the one-cycle dismantling process viewed from the front in the order of steps, and are simplified and partially exaggerated for convenience of explanation for easy understanding. It is illustrated. Therefore, the dimensions and positional relationships of the mechanism units 1 to 3 in FIG. 3 do not match those in FIGS. 1 and 2. First, the outline of the dismantling process of the printed circuit board 7 will be described with reference to FIG.
[0031]
FIG. 3A shows a stand-by state of the dismantling processing system. The chuck 13 of the chucking mechanism unit 1 is moved in the advance direction (left direction in the figure) by the discharge driving of the chuck moving air cylinder 17, The chuck claw portion at the front end enters between the pair of blades 27 of the stripping mechanism portion 2 and is held at a position protruding from the stripping blade portion 31 of the blade 27 toward the substrate supply area 26. In this standby state, the worker turns on a chuck operation switch (not shown) including a push button switch or a foot switch on the operation panel. As a result, in the chucking mechanism portion 1, each pin cylinder 19 is driven to suck and the chuck 13 is opened, so that the worker can mount the surface mount type electronic components 62 on both sides at a high density as shown in FIG. The surface mounted printed circuit board 7 is chucked by manual operation on the chuck claws 20, 21, 25 in the chuck 13 in the open state. After that, when the operator turns on the operation switch, the frame body 8 on which the chucking mechanism unit 1 and the stripping mechanism unit 2 are mounted starts to descend as indicated by an arrow by driving the vertical movement mechanism unit 3. .
[0032]
FIG. 3C shows a state in which the frame 8 is lowered to the lower limit position, and the printed circuit board 7 chucked by the chuck 13 has a heating area 51 set between the casings 49 and 50 for blowing and receiving air. It is inserted in and is kept in this heating area 51 for a predetermined time. Meanwhile, the solder of the soldering portion of the printed circuit board 7 is melted. After that, the printed circuit board 7 is moved in the backward direction indicated by the arrow (rightward in the figure) when the chuck moving air cylinder 17 is driven by suction.
[0033]
FIG. 3D shows a process in the middle of moving the printed circuit board 7 to the right limit position. While the printed circuit board 7 is moved to the right by the chuck 13, each of the pair of blades 27 of the peeling mechanism unit 2 has the peeling blade part 31 by the urging force of the tension spring 30. It stops in the same position in the state pressed against one side and the other side. Therefore, the electronic component 62 surface-mounted on both surfaces of the printed circuit board 7 has the solder at the soldered portion completely melted, so that the peeling blade portion disposed facing the heating area 51 in the blade 27 It is surely peeled off by 31 and dropped into the parts collection box 60 and collected. The open / close lid 59 at the bottom of the heating chamber 48 is opened at the timing when the printed circuit board 7 starts moving to the right.
[0034]
FIG. 3E shows a state in which the chuck 13 has finished moving to the right limit position. At this point, all the electronic components 62 mounted on both sides of the printed circuit board 7 have been reliably peeled off. The printed circuit board 7 is opened when the chuck 13 has been moved to the right limit position, and is dropped and collected in the board collection box 61 as indicated by a two-dot chain line. After that, as shown in FIG. 6 (f), the frame body 8 is raised to the upper limit position by driving the vertical movement mechanism unit 3, and at this upper limit position, the chuck 13 is driven to discharge the chuck moving air cylinder 17. Is moved in the advancing direction indicated by the arrow. When the chuck 13 has been moved to the left limit position as shown in FIG. 3G, the chuck 13 enters between the pair of blades 27 of the peeling mechanism unit 2 and the tip chuck claw portion peels off the blade 27. It is held at a position protruding from the cutting blade portion 31 toward the substrate supply area 26 side. This is the standby state of FIG. 3A, and the process of one cycle of the disassembling process, that is, the disassembling process of the printed circuit board 7 per sheet is completed as described above.
[0035]
As described above, in the disassembling process of the printed circuit board 7, the printed circuit board 7 is moved in the backward direction by the chuck 13 in a state where the printed circuit board 7 is inserted into the heating area 51 by hot air and the solder of the soldering portion is melted. The peeling blade portions 31 of each of the pair of blades 27 are applied to both surfaces of the printed circuit board 7 in the heating area 51 to peel off the electronic component 62. Therefore, the electronic components 62 that are surface-mounted on both surfaces of the printed circuit board 7 can be peeled off simultaneously and reliably, and a series of disassembling processes in one cycle are repeated almost continuously. Therefore, the disassembly of the surface-mounted printed circuit board 7 mounted on both sides can be performed very efficiently.
[0036]
In addition, since the surface-mounted electronic components 62 are peeled off by the pair of blades 27 that remain in the same position with respect to the moved printed circuit board 7, all the surface-mounted electronic components 62 are peeled off at substantially the same position. In addition, since the printed circuit board 7 is chucked and held in a vertical arrangement, the electronic components 62 on both sides of the printed circuit board 7 can be dropped at substantially the same position at the same time, and can be recovered extremely efficiently. In addition, the peeled surface mount electronic component 62 does not scatter in four directions as in the case of using conventional rotating metal blades, so that it can be recycled while preventing inconvenience such as breakage of the resin package. Can be recovered.
[0037]
4A to 4E are plan views showing the relative relationship between the chuck 13 of the chucking mechanism unit 1 and the blade 27 of the stripping mechanism unit 2 in the order of steps in the process of disassembling one cycle, FIG. FIGS. 6A to 6D are plan views showing the operation of the peeling mechanism unit 2 in the cycle of the dismantling process in the order of steps, and FIGS. 6A to 6G are timing charts in the cycle of the dismantling process. is there. Next, detailed operations in each step of FIG. 3 will be described and supplemented in order with reference to FIGS. 4 to 6.
[0038]
First, FIG. 4 and FIG. 5 will be described. Each of (a) and (b) in these figures shows the process immediately before the standby state shown in FIG. 3 (a). In each figure (a), when the chuck 13 is separated in the retracting direction shown in FIGS. 1 and 2, the stripping mechanism 2 is configured such that the blade opening / closing air cylinder 33 sucks the rod 34 and the link mechanism 32. Are pulled in the backward direction (right direction in the figure), the pair of blades 27 come into contact with each other by the urging force of the tension spring 30 and the guide shafts 28 of the guide holes 29 It is held in an arrangement that makes contact with the edge of the inner end hole and forms an acute angle in plan view. On the other hand, the chuck 13 of the chucking mechanism unit 1 is moved in the advancing direction (left direction in the figure) by the discharge driving of the chuck moving air cylinder 17 and enters between a pair of blades 27 having an acute angle arrangement. After that, as shown in FIGS. 2B and 2B, both the blades 27 are pushed outward to move to a position where the chuck claw portion at the tip protrudes from the peeling blade 31 of the blade 27, and is in a standby state. It becomes.
[0039]
At this time, as shown in FIG. 5 (b), the pair of blades 27 moves the chuck shaft 13 by moving each guide shaft 28 slightly outward from the inner end hole edge in the guide hole 29. Is allowed to pass. Therefore, since the pair of blades 27 is arranged at an acute angle, the pair of blades 27 can smoothly retreat to the outer side against the biasing force of the tension spring 30 and pass the chuck 13.
[0040]
When the operator turns on the chuck operation switch in the standby state, the chucking mechanism unit 1 is in a state where the pin cylinders 19 are simultaneously sucked and the chuck 13 is opened as shown in FIG. At this time, as shown by a solid line in FIG. 5 (c), the stripping mechanism unit 2 discharges the blade opening / closing air cylinder 33 at the same time as the chuck 13 is opened, and the rod 34 is moved to a predetermined stroke. By discharging only S, the pair of blades 27 receiving the pressing force of the rod 34 via the link mechanism 32 resists the urging force of the tension spring 30, and the guide shaft 28 moves in the guide hole 29 in the vicinity of the outer end thereof. As it is moved to the edge of the hole, it rotates and opens at an obtuse angle. At this time, as shown in FIG. 4C, each blade 27 is in an open state with each stripping blade portion 31 in contact with the outer surface of the chuck 13. When the worker chucks the printed circuit board 7 by manual operation on the chuck claws 20, 21, 25 in the opened chuck 13, the state shown in FIG.
[0041]
Subsequently, when the operator turns on the operation switch and the chuck 13 slightly moves the printed circuit board 7 in the backward direction, as shown in FIG. When the chuck 13 passes through the stripping blade portion 31, the stripping blade portion 31 comes into contact with the proximity position of the chuck 13 on the printed circuit board 7 by the biasing force of the tension spring 30. Thus, the pair of blades 27 can be surely peeled off without leaving the electronic component 62 closest to the end of the printed circuit board 7 on which the surface-mounted electronic components 62 are mounted with high density. At this time, as shown by a two-dot chain line in FIG. 5 (c), the pair of blades 27 is smooth only by moving the guide shaft 28 in the guide hole 29 from the vicinity of the outer end to the hole edge of the outer end. Can be displaced in directions close to each other.
[0042]
When the chuck 13 moves in the backward direction by a predetermined distance, in the peeling mechanism unit 2, as shown in FIG. 5D, the blade opening / closing air cylinder 33 is driven to suck, whereby the pair of blades 27 are linked. Pulled in the direction close to each other through the mechanism 32, an acute angle arrangement is obtained again. As a result, the stripping blade 31 of the blade 27 receives a small torque from the moving printed circuit board 7 and reliably strips the electronic component 62. That is, a relatively large torque is applied to the stripping blade portion 31 of the blade 27 only when the one or two electronic components 62 at the end of the printed circuit board 7 are stripped.
[0043]
Next, the timing chart of FIG. 6 will be described. In this dismantling processing system, a controller (not shown) performs sequence control based on a preset program. In the standby state of FIG. 3A, when an operator turns on the chuck operation switch at t1 of FIG. 6A, the chuck 13 is driven by the suction drive of each pin cylinder 19 as shown in FIG. Opened. Therefore, when the operator inserts the end of the surface-mounted printed circuit board 7 held in his hand between the open chuck claws of the chuck 13 and turns off the chuck operation switch, the chuck 13 is shown in FIG. And the end of the printed circuit board 7 is chucked.
[0044]
Next, when the worker turns on the operation switch at t2 in FIG. 8C, the vertical motion air cylinder 37 is driven to discharge and the frame body 8 starts to descend as shown in FIG. , T3, the frame body 8 reaches the lower limit position shown in FIG. When a detection signal is output from a proximity sensor (not shown) that detects the frame body 8 at the lower limit position, the controller holds the printed circuit board 7 in an atmosphere of about 200 ° C. for 30 seconds after the detection signal is input. It is made to hold | maintain at the heating area 51 maintained at temperature.
[0045]
As a result, the printed circuit board 7 is heated to a temperature not lower than 183 ° C. which is the melting temperature of the solder and not higher than 240 ° C. which is the melting temperature of the resin, so that the solder in the soldering portion is melted.
[0046]
When 30 seconds elapse from t3 and t4 comes, the controller causes the chuck moving air cylinder 17 to be sucked and driven to chuck the chuck 13 chucking the printed circuit board 7, as shown in FIG. Simultaneously with starting the movement in the backward direction, the opening / closing lid 59 on the bottom wall portion of the heating chamber 48 is opened as shown in FIG. As a result, the electronic component 62 that is simultaneously peeled off from both surfaces of the printed circuit board 7 by the pair of blades 27 falls into the component recovery box 60 and is recovered.
[0047]
As shown in FIG. 5E, the chuck moving air cylinder 17 moves the chuck 13 to the right limit position in the backward direction at time t5 when about 10 seconds have elapsed after starting suction driving at time t4. All the electronic components 62 of the printed circuit board 7 are peeled off. At this time t5, as shown in FIG. 6F, a substrate detection sensor (not shown) is turned on by detection of the printed circuit board 7 that has reached the right limit position, and a substrate detection signal is output to the controller. At the timing when the substrate detection signal is input, the controller opens and closes the chuck 13 by sucking and discharging each pin cylinder 19 as shown in FIG. 4B, and opens and closes as shown in FIG. Control is performed to close the lid 59. As a result, the printed circuit board 7 from which all the electronic components 62 have been peeled is dropped and collected in the board collection box 61, and the open / close lid 59 covers the heating chamber 48 so as to keep it warm.
[0048]
Further, at time t6 when the opening and closing of the chuck 13 is finished, the controller controls the air cylinder 37 for vertical movement to be sucked to raise the frame body 8 to the upper limit position as shown in FIG. Further, the controller confirms that the frame body 8 has been raised to the upper limit position at t7 by a detection signal from a sensor (not shown), and then, as shown in FIG. Then, the chuck 13 is moved in the advancing direction, and the standby state is set at t8. As described above, the worker only needs to perform the operation of turning on the operation switch after chucking the printed circuit board 7 to the chuck 13 by the operation of the chuck operation switch in the standby state. Dismantling can be performed very efficiently.
[0049]
【The invention's effect】
  As described above, according to the method for disassembling a printed circuit board according to the present invention, in a state where the solder of the soldered portion of the printed circuit board is heated and melted,With chuckWhile movingA pair ofAttach the blade tip to the printed circuit boardBothSince the surface-mounted electronic component is peeled off in contact with the surface, the surface-mounted electronic component can be peeled off extremely smoothly and reliably. Further, since the electronic components are peeled off with the printed circuit board in a vertical state, the peeled electronic components are dropped and collected as they are, and are not scattered in all directions as in the case of using conventional rotating metal blades. Therefore, the electronic component can be recovered in a good state that can be recycled while preventing the occurrence of inconvenience such as breakage of the resin package.Further, when chucking the end portion of the printed circuit board, the pair of blades are arranged at an obtuse angle with respect to the surface of the printed circuit board, and the respective tip portions of the both blades are chucked positions on the printed circuit board. Therefore, even if the surface mounted printed circuit board is mounted with high density, all electronic components including the electronic components at the end can be surely peeled off.
[0050]
Further, according to the printed circuit board disassembly processing system of the present invention, the printed circuit board disassembly processing method of the present invention includes a chucking mechanism section, a stripping mechanism section, a heating unit, and a heating mechanism mounted on a vertically movable frame body. Can be faithfully realized with a simple configuration that includes the above, and the same effects as those of the invention relating to the dismantling processing method can be obtained.
[Brief description of the drawings]
FIG. 1 is a partially cutaway plan view showing a printed circuit board disassembly processing system that embodies a printed circuit board disassembly processing method according to an embodiment of the present invention;
FIG. 2 is a partially cut front view of the dismantling processing system.
FIGS. 3A to 3G are operation explanatory views showing, in order of process, states viewed from the front of a one-cycle dismantling process in the dismantling processing system.
4A to 4E are plan views showing the relative relationship between a chuck of a chucking mechanism unit and a blade of a peeling mechanism unit in the order of steps in a one-cycle dismantling process of the dismantling processing system.
FIGS. 5A to 5D are plan views showing the operation of a peeling mechanism unit in the order of steps in a one-cycle dismantling process of the dismantling processing system; FIG.
FIGS. 6A to 6G are timing charts of one cycle of dismantling processing in the dismantling processing system same as above.
[Explanation of symbols]
1 Chucking mechanism
2 Stripping mechanism
3 Vertical movement mechanism
4 Heating unit
7 Printed circuit board
8 frame body
13 Chuck
20, 21, 25 Chuck claw
26 Substrate supply area
27 blade
28 Guide shaft
29 Guide hole
30 Tension spring (elastic body)
31 Stripping blade (tip)
32 Link mechanism (link mechanism)
51 Heating area
60 Parts collection box
61 Substrate collection box
62 Surface-mount electronic components

Claims (7)

Insert the end of the printed circuit board electronic components on both surfaces are surface-mounted, respectively in a vertical arrangement on the chucking to heating area comprising the steps of melting the solder of the soldered portions of a printed circuit board,
And a step of stripping the leading end portion of the pair of blades is moved by the chuck being in contact with the both surfaces of the print circuit board, the pre-Symbol electronic component simultaneously with the blade,
When chucking the end of the printed circuit board, a pair of blades are arranged at an obtuse angle with respect to the surface of the printed circuit board, and the tip of each of the blades is in the vicinity of the chucking position on the printed circuit board. A method for disassembling a printed circuit board, wherein the printed circuit board is disassembled. Disassembly processing method of the printed circuit board according to claim 1 which is adapted to recover the surface mount electronic device to fall stripped from both sides of the print circuit board in the component collecting box within. A frame body that is moved up and down by a vertical movement mechanism,
A chuck provided on the frame body so as to reciprocate within a certain range in the horizontal direction; when the frame body is positioned upward, the chuck moves toward the advancing direction and moves from the frame body to the substrate supply area side; A chucking mechanism that chucks and holds the end of a vertically mounted surface-mount printed circuit board with the chuck claws of the chuck that protrudes;
The chuck claw portion in the printed circuit board chucked by the chuck, which has a blade disposed on the side of the chuck movement path and disposed on the frame body in a state in which the chuck body cannot move in the movement direction of the chuck. A stripping mechanism that comes into contact with the tip of the blade at a position near
A heating area for inserting a printed circuit board chucked by the chuck when the frame body is lowered by driving of the vertical movement mechanism portion is held at an atmospheric temperature equal to or higher than the melting temperature of the solder. A heating unit,
When the solder of the soldering portion of the printed circuit board inserted into the heating area is melted by the lowering of the frame body, the chuck moves in the backward direction while chucking the printed circuit board, and is moved. A disassembled processing system for a printed circuit board, wherein the surface-mounted electronic component of the printed circuit board is peeled off at the tip of the blade. The stripping mechanism portion is a pair of blades arranged on both sides of the movement path of the chuck, and is urged by an elastic body in a direction in which the tip portions come into contact with each other, and the rear end portions are separated from each other in approximately eight characters in plan view. 4. The disassembled printed circuit board according to claim 3 , wherein the printed circuit board is displaceable so as to be displaced in a direction away from each other by a chuck moving in an advancing direction and to allow passage of the chuck claw portion. Processing system. The pair of blades are attached to the frame body so that the angle formed in an approximately eight shape in plan view can be varied within an acute angle and an obtuse angle range by a guide mechanism in which the guide shaft and the guide hole engage with each other, and each tip The end opposite to the part is connected to the drive source through a connection mechanism,
The drive source drives the chuck to chuck the printed circuit board so that the angle between the blades is an obtuse angle, and immediately after the chuck starts moving in the backward direction to pull out the printed circuit board from the heating area. The printed circuit board disassembly processing system according to claim 4 , wherein the system is driven so that the angle is an acute angle. A substrate recovery box for recovering the blunt circuit board is disposed at a position below the chuck that has moved in the backward direction and pulled out the printed circuit board from the heating area and stopped.
The printed circuit board disassembly processing system according to any one of claims 3 to 5 , wherein the chuck is controlled to open a chuck claw when stopped above the substrate collection box. It has a controller for sequence control, this controller
In the standby state where the chuck claw portion of the chuck protrudes to the board supply area side from the blade, the chuck claw portion is opened and the end portion of the printed circuit board is chucked by the chuck claw portion,
The vertical movement mechanism is driven and controlled to lower the frame body until the printed circuit board chucked by the chuck is inserted into the heating area, and then the printed circuit board is heated for a predetermined time,
After the predetermined time has elapsed, the chuck is moved in the backward direction, and when all the electronic components mounted on the printed circuit board have been removed with a blade, the chuck is stopped,
After opening and closing the stopped chuck and releasing the chucking of the printed circuit board, the vertical movement mechanism unit is driven and controlled so that the frame body rises to an upper limit position facing the board supply area,
After the frame body reaches the upper limit position, the chuck is moved in the advancing direction, and the chuck claw portion is in a standby state in which it protrudes more toward the substrate supply area than the blade,
The blind circuit board disassembly processing system according to any one of claims 3 to 6 , wherein the control is performed so as to repeat the above steps as one cycle.

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