WO2002023596A1 - Appareil de traitement thermique - Google Patents

Appareil de traitement thermique Download PDF

Info

Publication number
WO2002023596A1
WO2002023596A1 PCT/JP2001/008068 JP0108068W WO0223596A1 WO 2002023596 A1 WO2002023596 A1 WO 2002023596A1 JP 0108068 W JP0108068 W JP 0108068W WO 0223596 A1 WO0223596 A1 WO 0223596A1
Authority
WO
WIPO (PCT)
Prior art keywords
leg part
rotation
process chamber
permanent magnet
floatation
Prior art date
Application number
PCT/JP2001/008068
Other languages
English (en)
Inventor
Takashi Shigeoka
Takeshi Sakuma
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2002023596A1 publication Critical patent/WO2002023596A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un appareil de traitement thermique qui soumet un objet à un traitement thermique. Cet objet à traiter est placé sur un étage de pose (38) situé sur une extrémité supérieure d'un pied cylindrique (40) à l'intérieur d'une chambre de traitement (32). Le pied est monté pivotant dans la chambre de traitement. Des aimants permanents de rotation (60) et un aimant permanent de flottation (70) sont affectés au pied (40). Des bobines électromagnétiques de rotation (62) sont associées à la chambre de traitement (32). Des électro-aimants de flottation (74) sont associés à la chambre de traitement (32) de manière à générer une force de flottation dans l'aimant permanent de flottation (70). Cela permet de prévenir la formation de particules, ce qui permet d'augmenter la vitesse de rotation de l'objet à traiter.
PCT/JP2001/008068 2000-09-18 2001-09-17 Appareil de traitement thermique WO2002023596A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000281371A JP2002093724A (ja) 2000-09-18 2000-09-18 熱処理装置
JP2000-281371 2000-09-18

Publications (1)

Publication Number Publication Date
WO2002023596A1 true WO2002023596A1 (fr) 2002-03-21

Family

ID=18766038

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/008068 WO2002023596A1 (fr) 2000-09-18 2001-09-17 Appareil de traitement thermique

Country Status (2)

Country Link
JP (1) JP2002093724A (fr)
WO (1) WO2002023596A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100164315A1 (en) * 2007-06-05 2010-07-01 Tokyo Electron Limited Processing apparatus
CN103515177A (zh) * 2012-06-20 2014-01-15 北京北方微电子基地设备工艺研究中心有限责任公司 反应腔室、基片加工设备及其温度控制方法
US9193119B2 (en) 2009-07-10 2015-11-24 Menicon Singapore Pte Ltd. Systems and methods for the production of contact lenses

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770146B2 (en) * 2001-02-02 2004-08-03 Mattson Technology, Inc. Method and system for rotating a semiconductor wafer in processing chambers
WO2002097867A1 (fr) * 2001-05-29 2002-12-05 Aixtron Ag Ensemble constitue d'un corps support et d'un porte-substrat monte sur ce dernier dans un coussinet gazeux et entraine en rotation
JP4733405B2 (ja) * 2005-02-22 2011-07-27 株式会社国際電気セミコンダクターサービス 熱処理装置及び熱処理方法
JP4611118B2 (ja) * 2005-05-31 2011-01-12 株式会社国際電気セミコンダクターサービス 熱処理装置及び熱処理方法
JP5533335B2 (ja) * 2009-07-22 2014-06-25 東京エレクトロン株式会社 処理装置及びその動作方法
JP5143180B2 (ja) * 2010-04-23 2013-02-13 株式会社国際電気セミコンダクターサービス 熱処理装置及び熱処理方法
JP5064595B1 (ja) * 2011-10-26 2012-10-31 シャープ株式会社 気相成長装置
JP2014110378A (ja) * 2012-12-04 2014-06-12 Tokyo Electron Ltd 成膜装置
JP6143572B2 (ja) * 2013-06-18 2017-06-07 株式会社Ｓｃｒｅｅｎホールディングス 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法
JP6142797B2 (ja) * 2013-12-27 2017-06-07 ウシオ電機株式会社 光照射装置
JP6507953B2 (ja) * 2015-09-08 2019-05-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
WO2019164701A1 (fr) * 2018-02-23 2019-08-29 Applied Materials, Inc. Réglage de l'épaisseur epi par chauffage par points d'impulsion ou de profil
CN112033325A (zh) * 2020-08-19 2020-12-04 孙路涵 一种高性能铝合金材料检测平台
WO2023195738A1 (fr) * 2022-04-05 2023-10-12 서울과학기술대학교 산학협력단 Dispositif de lévitation magnétique capable de réaliser un mouvement de rotation

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0917846A (ja) * 1995-06-30 1997-01-17 Nikon Corp 磁気浮上型ステージ
EP0821404A2 (fr) * 1996-07-24 1998-01-28 Applied Materials, Inc. Appareil avec broches de soulèvement et de support pour chambre de traitement
US5818137A (en) * 1995-10-26 1998-10-06 Satcon Technology, Inc. Integrated magnetic levitation and rotation system
US5871588A (en) * 1995-07-10 1999-02-16 Cvc, Inc. Programmable ultraclean electromagnetic substrate rotation apparatus and method for microelectronics manufacturing equipment
US5916366A (en) * 1996-10-08 1999-06-29 Dainippon Screen Mfg. Co., Ltd. Substrate spin treating apparatus
EP1071118A2 (fr) * 1999-07-19 2001-01-24 Ebara Corporation Dispositif de rotation de substrat

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0917846A (ja) * 1995-06-30 1997-01-17 Nikon Corp 磁気浮上型ステージ
US5871588A (en) * 1995-07-10 1999-02-16 Cvc, Inc. Programmable ultraclean electromagnetic substrate rotation apparatus and method for microelectronics manufacturing equipment
US5818137A (en) * 1995-10-26 1998-10-06 Satcon Technology, Inc. Integrated magnetic levitation and rotation system
EP0821404A2 (fr) * 1996-07-24 1998-01-28 Applied Materials, Inc. Appareil avec broches de soulèvement et de support pour chambre de traitement
US5916366A (en) * 1996-10-08 1999-06-29 Dainippon Screen Mfg. Co., Ltd. Substrate spin treating apparatus
EP1071118A2 (fr) * 1999-07-19 2001-01-24 Ebara Corporation Dispositif de rotation de substrat

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 05 30 May 1997 (1997-05-30) *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100164315A1 (en) * 2007-06-05 2010-07-01 Tokyo Electron Limited Processing apparatus
US8299671B2 (en) * 2007-06-05 2012-10-30 Tokyo Electron Limited Processing apparatus
US9193119B2 (en) 2009-07-10 2015-11-24 Menicon Singapore Pte Ltd. Systems and methods for the production of contact lenses
US9498900B2 (en) 2009-07-10 2016-11-22 Menicon Singapore Pte Ltd. Systems and methods for the production of contact lenses
CN103515177A (zh) * 2012-06-20 2014-01-15 北京北方微电子基地设备工艺研究中心有限责任公司 反应腔室、基片加工设备及其温度控制方法

Also Published As

Publication number Publication date
JP2002093724A (ja) 2002-03-29

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