WO2002022278A2 - Verfahren und vorrichtung zum aufbringen fluider stoffe - Google Patents
Verfahren und vorrichtung zum aufbringen fluider stoffe Download PDFInfo
- Publication number
- WO2002022278A2 WO2002022278A2 PCT/DE2001/003515 DE0103515W WO0222278A2 WO 2002022278 A2 WO2002022278 A2 WO 2002022278A2 DE 0103515 W DE0103515 W DE 0103515W WO 0222278 A2 WO0222278 A2 WO 0222278A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- fluid substance
- underside
- movement
- fluid
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
- B05D1/286—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers using a temporary backing to which the coating has been applied
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
- B05D1/42—Distributing applied liquids or other fluent materials by members moving relatively to surface by non-rotary members
Definitions
- the invention relates to a method and a device for applying a fluid substance to a body, in particular to the underside of a body intended for a subsequent joining process, in which the fluid substance is first applied to an intermediate carrier, the layer thickness of the fluid substance on the intermediate carrier is kept constant at a predetermined value with a scraper.
- the method is preferably suitable for use in microsystem and system technology.
- a further disadvantage is that uniform adhesive material transport through the screen is difficult to achieve during many printing cycles, and fluctuations in the physical properties of the adhesive material, in particular its viscosity, have an immediate influence on this.
- the application of adhesive material with the aid of dispensing technology primarily requires an amount of adhesive material that can only be achieved with great effort and reproducibly dispensed. This is usually done by positioning a dispensing tool, such as a dispensing needle. Furthermore, malfunctions can occur that unintentional, uncontrollable displacement of the applied adhesive material when the component is being applied lead to areas being provided with adhesive material where this leads to malfunctions for the subsequent processes.
- a further disadvantage is that the known methods are not suitable for chip-on-chip assembly.
- Adhesive material specified on flat components such as substrates, semiconductor chips or the like which has an adhesive bed and in which a screen element can be arranged in the area of the adhesive bed surface, the opening of which allows adhesive material to pass through, the adhesive bed and the screen element being matched to one another such that only a limited
- Amount of adhesive material before, during or after the placement process of the component for wetting its contact surface passes through the sieve element.
- a device for faster implementation of the coating of electronic components in which a diving head dips electronic components arranged on a holder into fields made of contact paste, which are conveyed to a diving point by a conveyor belt with an upper, flat surface , The fields are generated by means of a stripping device on the belt.
- the conveyor belt is preferably an endless belt made of stainless steel, which with a support plate on the
- Dive site is supported vertically to ensure the flatness of the field of contact paste.
- a scraper with respect to the direction of rotation of the tape in front of the dipping point and can be formed by a paste reservoir traveling along the tape, which metered in the paste by lifting and lowering a blade.
- a scraper blade can be arranged after the dipping point in order to catch the protruding paste and to lead it into a device which pumps the paste back into the reservoir through a filter.
- a disadvantage of the known screen printing and dispensing methods is that they cannot be integrated directly into the joining process. Furthermore, the achievable volumetric precision and the desired positioning accuracy are often not sufficient.
- the invention is therefore based on the object of specifying a method and a device of the type mentioned at the beginning with which simple
- a precisely defined volume of a fluid substance can be applied to the underside of a body in a jointing process prior to placement.
- the object is achieved by a method which the in
- Figure 1 is a schematic representation of the arrangement in section
- Figure 2 shows the associated top view
- the film 1 is clamped in a ring 2. With the help of the drive 3, the ring 2 is set with the film 1 in a uniform rotational movement. In front of the stripping device 4 there is a depot 5 with the fluid medium to be applied on the top of the film 1. The gap distance between the support on the base body 6 and the stripping device 4 is adjusted to the respectively required value with the height adjustment device 7. An electric motor with a friction wheel is preferably used for the drive 3. The film 1 moves through the gap at a constant speed, so that a defined layer of the fluid substance 8 is generated on the film, the thickness of which is very constant.
- the body 9 to be wetted is positioned on the film 1 above the contact surface 10 with the aid of the gripping tool 13.
- the gripping tool 13 with the body 9 to be wetted arrives in an area monitored by the light barrier 11. That from the
- the light barrier 11 emitted signal causes the drive 3 to stop and the film 1 to come to a standstill.
- the light barrier 11 is arranged on a fastening bracket 11. 1, which in turn is connected to the base body 6. While the film 1 is at a standstill, the body 9 is placed on the wetted film 1 and takes a defined one on its underside
- Fluid layer 8 on. Compliance with the exact layer thickness is ensured by the fact that Foil 1 is moved through a gap of adjustable size, a depot 5 of the fluid substance 8 being located on the foil 1 in front of the gap, which depot provides a sufficient amount for the fluid layer 8 to be applied.
- the film 1 with the flatly applied fluid material is moved with a rotary movement into a position in which a support surface 10 provided with depressions 10.1 is located under the film 1. In this position, the body 9 to be joined is positioned on the wetted film 1 above this contact surface 10 before the joining process.
- the rotational movement of the film 1 is interrupted so that the film 1 with the fluid layer 8 is at a standstill. To facilitate the lifting of the body 9 with the now wetted
- An underside is advantageously generated below the film 1, so that the film 1 lies at least partially in depressions 10.1 of the contact surface 10.
- Body 9 is now lifted off with the gripping tool 13 and placed at its destination, at which the subsequent joining process is carried out.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10193819T DE10193819D2 (de) | 2000-09-15 | 2001-09-13 | Verfahren und Vorrichtung zum Aufbringen fluider Stoffe |
AU2002210353A AU2002210353A1 (en) | 2000-09-15 | 2001-09-13 | Method and device for applying fluid substances |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10046139.5 | 2000-09-15 | ||
DE10046139 | 2000-09-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002022278A2 true WO2002022278A2 (de) | 2002-03-21 |
WO2002022278A3 WO2002022278A3 (de) | 2002-08-08 |
Family
ID=7656650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/003515 WO2002022278A2 (de) | 2000-09-15 | 2001-09-13 | Verfahren und vorrichtung zum aufbringen fluider stoffe |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2002210353A1 (de) |
DE (2) | DE10193819D2 (de) |
WO (1) | WO2002022278A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005012396B3 (de) * | 2005-03-17 | 2006-06-14 | Datacon Technology Ag | Verfahren zum Montieren eines Chips, insbesondere Flipchips, auf einem Substrat |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3630802A (en) * | 1970-07-13 | 1971-12-28 | Theodore J Dettling | Method and apparatus for producing a coated substrate and a laminated product |
US3912833A (en) * | 1973-06-27 | 1975-10-14 | American Videonetics Corp | Film processing apparatus and method for information storage system |
US3937178A (en) * | 1972-10-30 | 1976-02-10 | Columbia Ribbon And Carbon Manufacturing Co., Inc. | Film inking system |
US3989569A (en) * | 1975-02-10 | 1976-11-02 | Columbia Ribbon And Carbon Manufacturing Co., Inc. | Continuous copying method |
US4888082A (en) * | 1986-10-31 | 1989-12-19 | Nordson Corporation | Apparatus for adhesive transfer |
DE4423204A1 (de) * | 1993-07-02 | 1995-03-02 | Electro Scient Ind Inc | Vorrichtung zum Beschichten von elektronischen Bauteilen |
DE19800683A1 (de) * | 1998-01-10 | 1999-07-15 | Inatec Innovative Auftragstech | Verfahren und Vorrichtung zum kontinuierlichen Auftragen eines Klebstoffes |
WO2000051748A1 (de) * | 1999-02-27 | 2000-09-08 | Hubert Knor | Vorrichtung und verfahren zum aufbringen von klebermaterial auf flächige bauteile sowie dessen verwendung |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1247293B (it) * | 1990-05-09 | 1994-12-12 | Int Rectifier Corp | Dispositivo transistore di potenza presentante una regione ultra-profonda, a maggior concentrazione |
-
2001
- 2001-09-13 AU AU2002210353A patent/AU2002210353A1/en not_active Abandoned
- 2001-09-13 WO PCT/DE2001/003515 patent/WO2002022278A2/de active Application Filing
- 2001-09-13 DE DE10193819T patent/DE10193819D2/de not_active Expired - Fee Related
- 2001-09-14 DE DE10145396A patent/DE10145396B4/de not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3630802A (en) * | 1970-07-13 | 1971-12-28 | Theodore J Dettling | Method and apparatus for producing a coated substrate and a laminated product |
US3937178A (en) * | 1972-10-30 | 1976-02-10 | Columbia Ribbon And Carbon Manufacturing Co., Inc. | Film inking system |
US3912833A (en) * | 1973-06-27 | 1975-10-14 | American Videonetics Corp | Film processing apparatus and method for information storage system |
US3989569A (en) * | 1975-02-10 | 1976-11-02 | Columbia Ribbon And Carbon Manufacturing Co., Inc. | Continuous copying method |
US4888082A (en) * | 1986-10-31 | 1989-12-19 | Nordson Corporation | Apparatus for adhesive transfer |
DE4423204A1 (de) * | 1993-07-02 | 1995-03-02 | Electro Scient Ind Inc | Vorrichtung zum Beschichten von elektronischen Bauteilen |
DE19800683A1 (de) * | 1998-01-10 | 1999-07-15 | Inatec Innovative Auftragstech | Verfahren und Vorrichtung zum kontinuierlichen Auftragen eines Klebstoffes |
WO2000051748A1 (de) * | 1999-02-27 | 2000-09-08 | Hubert Knor | Vorrichtung und verfahren zum aufbringen von klebermaterial auf flächige bauteile sowie dessen verwendung |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005012396B3 (de) * | 2005-03-17 | 2006-06-14 | Datacon Technology Ag | Verfahren zum Montieren eines Chips, insbesondere Flipchips, auf einem Substrat |
Also Published As
Publication number | Publication date |
---|---|
DE10145396A1 (de) | 2002-05-02 |
WO2002022278A3 (de) | 2002-08-08 |
AU2002210353A1 (en) | 2002-03-26 |
DE10193819D2 (de) | 2004-01-22 |
DE10145396B4 (de) | 2010-10-21 |
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