WO2001073840A1 - Dispositif de transfert de substrats - Google Patents
Dispositif de transfert de substrats Download PDFInfo
- Publication number
- WO2001073840A1 WO2001073840A1 PCT/JP2001/002450 JP0102450W WO0173840A1 WO 2001073840 A1 WO2001073840 A1 WO 2001073840A1 JP 0102450 W JP0102450 W JP 0102450W WO 0173840 A1 WO0173840 A1 WO 0173840A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- chamber
- load lock
- processing
- lock chamber
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Definitions
- the present invention relates to a substrate transfer apparatus, and more particularly to a substrate transfer apparatus that can improve the degree of integration of devices without increasing a footprint.
- the substrate transfer apparatus 300 has a robot arm 306 that performs a swiveling motion and an expanding / contracting motion in order to transfer a substrate 400, which is an object to be processed.
- Room 301 is provided.
- the transfer chamber 301 has four ports 302, 303, 304, 305 to which a substrate processing chamber or the like can be connected.
- load lock chambers 312, 313 for holding cassettes 314, 315 for stocking the substrate 400 in a vertically movable and rotatable manner are provided with gate valves 310, 31. 1 is provided.
- the transfer chamber 301 has a substantially hexagonal shape in order to provide the load lock chambers 312 and 313, and the ports 302, 303, and 304 and 305 are provided, and load lock chambers 3 12 and 313 are provided on the other two sides.
- the front side of the load lock chambers 312 and 313 is generally a transportation work path, the front side of the load lock chambers 312 and 313 needs to be provided in a straight line. As a result, the load lock chambers 312, 313 adopt a bent shape as shown in the figure.
- a processing station 600 different from the substrate processing chamber 500 is provided at the port 305.
- the processing station 400 includes, for example, an alignment device (aligner) for preliminarily determining the crystal orientation of the substrate 400 to be carried into the substrate processing chamber 500, and the substrate processing chamber 500.
- a cooling device (cooler) for cooling the processed substrate 400 is mounted.
- FIG. 4 shows a case where the substrate processing chamber 500 is provided only in the port 302 for convenience of explanation, the substrate processing chamber is actually provided in the ports 303 and 304 as well. It is assumed that 500 is provided.
- the substrate transport apparatus 300 having the above configuration, when the processing station 600 is provided, the footprint FP indicated by the two-dot chain line in FIG. 4 (when the apparatus is installed on a plane, There is a problem that the projected total installation area increases. In addition, one port is occupied by providing the processing station 600.
- a mouth pot arm that performs a turning motion and a telescopic motion to transfer a substrate
- the mouth pot A transfer chamber having an arm and capable of arranging a plurality of substrate processing chambers circumferentially, and the robot arm making the substrate transferred to the substrate processing chamber stand by, or processing in the substrate processing chamber
- a substrate transfer device including a first load lock chamber and a second load lock chamber for receiving the substrate, wherein the transfer chamber includes the first load lock chamber and the second load lock chamber.
- the connecting portions of the first load lock chamber and the second load lock chamber with the transfer chamber are aligned and straight, so that the first port lock chamber and the first lock chamber can be connected regardless of the size of the transfer chamber.
- the second load lock chamber can be shared with other devices.
- the substrate transfer apparatus according to claim 2 the substrate transfer apparatus according to claim 1, wherein a port pot arm is provided on the first load lock and the second load lock chamber side of the transfer chamber.
- a processing station for performing processing on the substrate is provided at a position that does not interfere with the turning motion and the stretching motion.
- connection between the first load lock chamber and the second load lock chamber with the transfer chamber becomes linear, so that the first load lock chamber and the second load port lock regardless of the size of the transfer chamber.
- the room can be shared with other devices.
- the substrate transfer apparatus according to the second aspect, wherein two sets of alignment devices are provided as the processing stations.
- the substrate transfer apparatus of the second aspect two sets of cooling devices are provided as the processing stations. With this configuration, the number of substrates for post-processing cooling can be increased, so that the throughput of the substrate transfer device can be improved.
- the substrate transfer apparatus according to the second aspect, wherein the processing station includes a positioning device and a cooling device.
- the processing station includes a positioning device and a cooling device.
- the substrate transfer device in the substrate transfer device according to claim 6, the substrate transfer device according to claim 2 is provided.
- a table for temporarily placing a substrate and a table for placing a dummy substrate are provided as the processing stations.
- the provision of the board on which the board is temporarily placed enables temporary storage of the board if the board cannot be returned to the load lock chamber during transport.
- by providing a table on which the dummy substrate is placed it is possible to check the processing conditions in the substrate processing chamber in advance and temporarily place the dummy substrate used when cleaning the processing chamber. Workability can be improved.
- a substrate transfer apparatus comprising: a load lock chamber disposed at a position facing a work passage for transferring a substrate; And a plurality of substrate processing chambers disposed on the outer periphery of the transfer chamber, and a plurality of substrate processing chambers disposed in the transfer chamber, wherein the substrate is transferred between the load lock chamber and the substrate processing chamber.
- a loading / unloading port arm, and a joint surface between the load lock chamber and the transfer chamber has a linear joint parallel to the work passage, and the load lock is connected via the joint. The rooms are connected.
- connection between the load lock chamber and the transfer chamber becomes a linear joint parallel to the work passage, and the load lock chamber can be shared with other devices regardless of the size of the transfer chamber. It becomes possible to plan.
- the substrate transfer apparatus according to claim 8 based on the present invention, the substrate transfer apparatus according to claim 7, wherein the transfer chamber side at a position avoiding the movement range of the rod arm, A processing station for performing processing on the substrate is provided.
- FIG. 1 is a plan view showing the structure of the substrate transfer device according to the first embodiment based on the present invention.
- FIG. 2 is a plan view showing the structure of the substrate transfer device according to the second embodiment based on the present invention.
- FIG. 3 is a plan view showing a structure of a substrate transfer device according to another embodiment of the present invention.
- FIG. 4 is a cross-sectional view showing the structure of a conventional substrate transfer device. BEST MODE FOR CARRYING OUT THE INVENTION
- a substrate transfer apparatus 100 has a robot arm 106 that performs a turning motion and a telescopic motion in order to transport a substrate 400 to be processed. And a transfer chamber 101 in which a plurality of substrate processing chambers 500 can be arranged.
- the transfer chamber 101 has four ports 102, 103, 104, and 105 to which a substrate processing chamber or the like can be connected.
- the load lock chambers 10 for holding cassettes 114 and 115 for stocking the substrates 400 so that they can be raised and lowered and rotatable. 9, 110 are provided with gate valves 107, 108 interposed therebetween.
- the junction 100 F of the transfer chamber 101 with the first door lock chamber 109 and the second load lock chamber 110 is aligned.
- the joint 100F is arranged in parallel with the working passageway 700 while being provided in a straight line.
- the passageway 700 is provided, it is necessary that the front sides of the first load lock chamber 109 and the second load lock chamber 110 be provided linearly. As a result, the first load lock chamber 109 and the second load lock chamber 110 in the present embodiment can adopt a substantially square shape as illustrated.
- the substrate is located at a position where the robot arm 106 provided in the transfer chamber 101 located on the side opposite to the work passage does not interfere with the turning movement and the expansion and contraction movement.
- Processing stations 120 and 121 for performing processing at 400 are provided. Specific examples of the processing stations 120 and 121 include a combination of a positioning device (aligner) and a positioning device, a combination of a cooling device (cooler) and a cooling device, and a positioning device and a cooling device. And the like.
- Providing a base on which the substrate is temporarily placed allows the substrate to be temporarily stored when the substrate cannot be returned to the load lock chamber during transportation of the substrate for some reason.
- by providing a table on which the dummy substrate is placed it is possible to check the processing conditions in the substrate processing chamber in advance, and to temporarily place the dummy substrate used when cleaning the processing chamber. Workability can be improved.
- the substrate processing chamber 500 is provided only in the port 102 is illustrated, but actually, the ports 103, 104, and 105 are also provided in the port. It is assumed that a substrate processing chamber 500 is provided.
- the processing stations 120, 121 are provided at positions that do not interfere with the swiveling motion and the telescopic motion of the robot arm 106, so that the processing stations 120, 210 can be provided without increasing the number of ports. 1 2 1 can be provided. As a result, it is possible to improve the degree of integration of the substrate transfer device while suppressing the expansion of the footprint FP even when compared with the conventional device.
- a positioning device, a cooling device, etc. as a processing station, it is possible to increase the number of substrates to be pre-aligned and increase the number of substrates for cooling after processing. Thus, it is possible to improve the throughput of the substrate transfer device.
- substrate transfer device 200 of the present embodiment differs from substrate transfer device 100 of Embodiment 1 described above.
- substrate transfer device 200 is for 5 treatments.
- the transfer chamber 201 becomes large, and the ports 202, 203, 204, 205, and 206 are provided.
- Other configurations are the same as those of the substrate transfer device 100.
- the same operation and effect as those of the substrate transfer device 100 can be obtained, and the transfer chambers 101 of the first load lock chamber 109 and the second load lock chamber 110 can be obtained.
- the first load lock chamber 109 and the second load lock chamber 110 are connected to the substrate transfer device 100 and the substrate transfer device 2 irrespective of the size of the transfer chamber 201 because the connection portion is linear. It becomes possible to use a common one for 0 and 0.
- the substrate transfer device in each of the above embodiments can be applied to a device for setting the transfer chamber and the load lock chamber to a vacuum state or an atmospheric pressure state, and other apparatuses used under any atmosphere. Therefore, it is considered that the embodiments disclosed this time are illustrative in all aspects and not restrictive.
- the technical scope of the present invention is not defined by the above description, but is defined by the appended claims, and is intended to include any modifications within the scope and meaning equivalent to the claims.
- the connection between the first load lock chamber and the second load lock chamber with the transfer chamber is linear, so that the first load lock chamber and the second load lock chamber are connected regardless of the size of the transfer chamber.
- the lock chamber and the second load lock chamber can be shared with other devices.
- a position that does not interfere with the swiveling motion and the telescopic motion of the robot arm By providing a processing station in the first place, it is possible to provide a processing station without increasing the number of ports for arranging the substrate processing chamber, thereby improving the degree of integration of the substrate transfer device while suppressing an increase in footprint. Can be achieved.
- a substrate transfer device that can improve the degree of integration of the device while suppressing the expansion of the footprint, and can share the load port chamber.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020017015254A KR20020019044A (ko) | 2000-03-29 | 2001-03-26 | 기판 반송 장치 |
EP01915813A EP1189275A1 (en) | 2000-03-29 | 2001-03-26 | Substrate transfer device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-91444 | 2000-03-29 | ||
JP2000091444 | 2000-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001073840A1 true WO2001073840A1 (fr) | 2001-10-04 |
Family
ID=18606903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/002450 WO2001073840A1 (fr) | 2000-03-29 | 2001-03-26 | Dispositif de transfert de substrats |
Country Status (5)
Country | Link |
---|---|
US (1) | US20020157691A1 (ja) |
EP (1) | EP1189275A1 (ja) |
KR (1) | KR20020019044A (ja) |
CN (1) | CN1365519A (ja) |
WO (1) | WO2001073840A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8991461B2 (en) | 2012-10-18 | 2015-03-31 | Samsung Display Co., Ltd. | Film lamination apparatus and method of manufacturing organic light-emitting display apparatus using the film lamination apparatus |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6896513B2 (en) | 2002-09-12 | 2005-05-24 | Applied Materials, Inc. | Large area substrate processing system |
US20070031684A1 (en) | 2005-08-03 | 2007-02-08 | Anderson Jeffrey T | Thermally conductive grease |
US7720655B2 (en) * | 2005-12-20 | 2010-05-18 | Applied Materials, Inc. | Extended mainframe designs for semiconductor device manufacturing equipment |
DE112009001863A5 (de) * | 2008-08-01 | 2011-11-24 | Ulvac, Inc. | Einlernverfahren für einen Überführungsroboter |
US20170125269A1 (en) * | 2015-10-29 | 2017-05-04 | Aixtron Se | Transfer module for a multi-module apparatus |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0265252A (ja) * | 1988-08-31 | 1990-03-05 | Nec Kyushu Ltd | 半導体製造装置 |
JPH03136345A (ja) * | 1989-10-23 | 1991-06-11 | Fuji Electric Co Ltd | 半導体ウエーハ処理装置 |
JPH0569162U (ja) * | 1992-02-28 | 1993-09-17 | セイコー電子工業株式会社 | バッファ付クラスタ形薄膜処理装置 |
US5248886A (en) * | 1991-03-01 | 1993-09-28 | Tokyo Electron Limited | Processing system |
US5407350A (en) * | 1992-02-13 | 1995-04-18 | Tokyo Electron Limited | Heat-treatment apparatus |
JPH08288294A (ja) * | 1991-06-28 | 1996-11-01 | Sony Corp | 電気的接続部形成方法、複数のチェンバーを有する処理装 置及び半導体装置の製造方法 |
US6013112A (en) * | 1996-09-09 | 2000-01-11 | Tokyo Electron Limited | Relay apparatus for relaying object to be treated |
-
2001
- 2001-03-26 CN CN01800657A patent/CN1365519A/zh active Pending
- 2001-03-26 WO PCT/JP2001/002450 patent/WO2001073840A1/ja not_active Application Discontinuation
- 2001-03-26 US US09/959,849 patent/US20020157691A1/en not_active Abandoned
- 2001-03-26 KR KR1020017015254A patent/KR20020019044A/ko not_active Application Discontinuation
- 2001-03-26 EP EP01915813A patent/EP1189275A1/en not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0265252A (ja) * | 1988-08-31 | 1990-03-05 | Nec Kyushu Ltd | 半導体製造装置 |
JPH03136345A (ja) * | 1989-10-23 | 1991-06-11 | Fuji Electric Co Ltd | 半導体ウエーハ処理装置 |
US5248886A (en) * | 1991-03-01 | 1993-09-28 | Tokyo Electron Limited | Processing system |
JPH08288294A (ja) * | 1991-06-28 | 1996-11-01 | Sony Corp | 電気的接続部形成方法、複数のチェンバーを有する処理装 置及び半導体装置の製造方法 |
US5407350A (en) * | 1992-02-13 | 1995-04-18 | Tokyo Electron Limited | Heat-treatment apparatus |
JPH0569162U (ja) * | 1992-02-28 | 1993-09-17 | セイコー電子工業株式会社 | バッファ付クラスタ形薄膜処理装置 |
US6013112A (en) * | 1996-09-09 | 2000-01-11 | Tokyo Electron Limited | Relay apparatus for relaying object to be treated |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8991461B2 (en) | 2012-10-18 | 2015-03-31 | Samsung Display Co., Ltd. | Film lamination apparatus and method of manufacturing organic light-emitting display apparatus using the film lamination apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP1189275A8 (en) | 2002-09-11 |
CN1365519A (zh) | 2002-08-21 |
EP1189275A1 (en) | 2002-03-20 |
KR20020019044A (ko) | 2002-03-09 |
US20020157691A1 (en) | 2002-10-31 |
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