WO2001016402A8 - Feuille de cuivre electrolytique avec feuille support et son procede de fabrication et lamine a gaine de cuivre utilisant la feuille de cuivre electrolytique - Google Patents

Feuille de cuivre electrolytique avec feuille support et son procede de fabrication et lamine a gaine de cuivre utilisant la feuille de cuivre electrolytique

Info

Publication number
WO2001016402A8
WO2001016402A8 PCT/JP2000/005363 JP0005363W WO0116402A8 WO 2001016402 A8 WO2001016402 A8 WO 2001016402A8 JP 0005363 W JP0005363 W JP 0005363W WO 0116402 A8 WO0116402 A8 WO 0116402A8
Authority
WO
WIPO (PCT)
Prior art keywords
foil
electrolytic copper
carrier foil
carrier
copper foil
Prior art date
Application number
PCT/JP2000/005363
Other languages
English (en)
French (fr)
Other versions
WO2001016402A1 (fr
Inventor
Takashi Kataoka
Yutaka Hirasawa
Takuya Yamamoto
Kenichiro Iwakiri
Tsutomu Higuchi
Akiko Sugimoto
Junshi Yoshioka
Shinichi Obata
Sakiko Tomonaga
Makoto Dobashi
Original Assignee
Mitsui Mining & Smelting Co
Takashi Kataoka
Yutaka Hirasawa
Takuya Yamamoto
Kenichiro Iwakiri
Tsutomu Higuchi
Akiko Sugimoto
Junshi Yoshioka
Shinichi Obata
Sakiko Tomonaga
Makoto Dobashi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co, Takashi Kataoka, Yutaka Hirasawa, Takuya Yamamoto, Kenichiro Iwakiri, Tsutomu Higuchi, Akiko Sugimoto, Junshi Yoshioka, Shinichi Obata, Sakiko Tomonaga, Makoto Dobashi filed Critical Mitsui Mining & Smelting Co
Priority to KR1020017004538A priority Critical patent/KR20010075616A/ko
Priority to EP00951931A priority patent/EP1152070A1/en
Publication of WO2001016402A1 publication Critical patent/WO2001016402A1/ja
Publication of WO2001016402A8 publication Critical patent/WO2001016402A8/ja
Priority to HK02104017.9A priority patent/HK1042325A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PCT/JP2000/005363 1999-08-31 2000-08-10 Feuille de cuivre electrolytique avec feuille support et son procede de fabrication et lamine a gaine de cuivre utilisant la feuille de cuivre electrolytique WO2001016402A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020017004538A KR20010075616A (ko) 1999-08-31 2000-08-10 캐리어 박 부착 전해 동박 및 그 전해 동박의 제조방법과그 전해 동박을 사용한 동 클래드 적층판
EP00951931A EP1152070A1 (en) 1999-08-31 2000-08-10 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
HK02104017.9A HK1042325A1 (zh) 1999-08-31 2002-05-30 附有載體箔的電解銅箔及其製作方法和使用該電解銅箔的敷銅層壓板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24433199A JP2001068804A (ja) 1999-08-31 1999-08-31 キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板
JP11/244331 1999-08-31

Publications (2)

Publication Number Publication Date
WO2001016402A1 WO2001016402A1 (fr) 2001-03-08
WO2001016402A8 true WO2001016402A8 (fr) 2001-08-16

Family

ID=17117129

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/005363 WO2001016402A1 (fr) 1999-08-31 2000-08-10 Feuille de cuivre electrolytique avec feuille support et son procede de fabrication et lamine a gaine de cuivre utilisant la feuille de cuivre electrolytique

Country Status (6)

Country Link
EP (1) EP1152070A1 (ja)
JP (1) JP2001068804A (ja)
KR (1) KR20010075616A (ja)
CN (1) CN1327489A (ja)
HK (1) HK1042325A1 (ja)
WO (1) WO2001016402A1 (ja)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7691487B2 (en) 2002-07-04 2010-04-06 Mitsui Mining & Smelting Co., Ltd. Electrodeposited copper foil with carrier foil
JP2005054240A (ja) 2003-08-05 2005-03-03 Fuji Photo Film Co Ltd 導電性フィルムおよびその作製方法
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
TW200804626A (en) 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
KR101281146B1 (ko) * 2008-09-05 2013-07-02 후루카와 덴끼고교 가부시키가이샤 캐리어 부착 극박 동박, 및 동장 적층판 또는 프린트 배선 기판
JP2009143234A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
JP2009143233A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
CN102216078B (zh) 2009-12-22 2015-03-25 Jx日矿日石金属株式会社 层积体的制造方法及层积体
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5285180B1 (ja) * 2012-11-08 2013-09-11 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5362898B1 (ja) * 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、プリント配線板並びに銅張積層板
JP6225573B2 (ja) * 2013-02-06 2017-11-08 東洋紡株式会社 積層フィルム
JP6056521B2 (ja) * 2013-02-06 2017-01-11 東洋紡株式会社 ガスバリアフィルム
CN103160867B (zh) * 2013-03-11 2016-04-06 福建清景铜箔有限公司 铜箔生产连体机及其锂离子电池用高粘结强度铜箔工艺
JP5399582B2 (ja) * 2013-05-30 2014-01-29 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
MY187285A (en) 2013-11-27 2021-09-19 Mitsui Mining & Smelting Co Ltd Copper foil provided with carrier foil, copper clad laminate and printed wiring board
TWI621381B (zh) * 2014-04-02 2018-04-11 Jx Nippon Mining & Metals Corp Laminated body with metal foil with carrier
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) * 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
US11453823B2 (en) * 2017-02-20 2022-09-27 InkTee Co., Ltd. Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite
CN108541144A (zh) * 2018-04-17 2018-09-14 广东工业大学 一种易剥离载体箔及其制备方法和应用
JP6812492B2 (ja) * 2019-04-26 2021-01-13 日本エレクトロプレイテイング・エンジニヤース株式会社 ナノ構造基板
US10697082B1 (en) * 2019-08-12 2020-06-30 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil
CN113445083A (zh) * 2021-07-30 2021-09-28 江西铜博科技有限公司 一种有效提升铜箔面均匀密度的铜箔生产设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235040B2 (ja) * 1987-04-30 1990-08-08 Fukuda Kinzoku Hakufun Kogyo Kk Fukugohakuoyobisonoseizohoho
JPH02113591A (ja) * 1988-10-22 1990-04-25 Matsushita Electric Works Ltd 印刷配線板の製造方法
JPH05102630A (ja) * 1991-10-03 1993-04-23 Hitachi Chem Co Ltd キヤリア付銅箔の製造方法及びそれを用いた銅張積層板

Also Published As

Publication number Publication date
HK1042325A1 (zh) 2002-08-09
EP1152070A1 (en) 2001-11-07
KR20010075616A (ko) 2001-08-09
JP2001068804A (ja) 2001-03-16
CN1327489A (zh) 2001-12-19
WO2001016402A1 (fr) 2001-03-08

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