HK1042325A1 - 附有載體箔的電解銅箔及其製作方法和使用該電解銅箔的敷銅層壓板 - Google Patents

附有載體箔的電解銅箔及其製作方法和使用該電解銅箔的敷銅層壓板

Info

Publication number
HK1042325A1
HK1042325A1 HK02104017.9A HK02104017A HK1042325A1 HK 1042325 A1 HK1042325 A1 HK 1042325A1 HK 02104017 A HK02104017 A HK 02104017A HK 1042325 A1 HK1042325 A1 HK 1042325A1
Authority
HK
Hong Kong
Prior art keywords
foil
electrolytic copper
carrier
manufacturing
same
Prior art date
Application number
HK02104017.9A
Other languages
English (en)
Inventor
片岡卓
平澤裕
山本拓也
岩切健一郎
樋口勉
杉元晶子
吉岡淳志
小畠真一
朝長咲子
土橋誠
Original Assignee
三井金屬鉱業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三井金屬鉱業株式會社 filed Critical 三井金屬鉱業株式會社
Publication of HK1042325A1 publication Critical patent/HK1042325A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK02104017.9A 1999-08-31 2002-05-30 附有載體箔的電解銅箔及其製作方法和使用該電解銅箔的敷銅層壓板 HK1042325A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24433199A JP2001068804A (ja) 1999-08-31 1999-08-31 キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板
PCT/JP2000/005363 WO2001016402A1 (fr) 1999-08-31 2000-08-10 Feuille de cuivre electrolytique avec feuille support et son procede de fabrication et lamine a gaine de cuivre utilisant la feuille de cuivre electrolytique

Publications (1)

Publication Number Publication Date
HK1042325A1 true HK1042325A1 (zh) 2002-08-09

Family

ID=17117129

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02104017.9A HK1042325A1 (zh) 1999-08-31 2002-05-30 附有載體箔的電解銅箔及其製作方法和使用該電解銅箔的敷銅層壓板

Country Status (6)

Country Link
EP (1) EP1152070A1 (zh)
JP (1) JP2001068804A (zh)
KR (1) KR20010075616A (zh)
CN (1) CN1327489A (zh)
HK (1) HK1042325A1 (zh)
WO (1) WO2001016402A1 (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004005588A1 (ja) * 2002-07-04 2004-01-15 Mitsui Mining & Smelting Co.,Ltd. キャリア箔付電解銅箔
JP2005054240A (ja) 2003-08-05 2005-03-03 Fuji Photo Film Co Ltd 導電性フィルムおよびその作製方法
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
TW200804626A (en) 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
US8674229B2 (en) * 2008-09-05 2014-03-18 Furukawa Electric Co., Ltd. Ultra-thin copper foil with carrier and copper-clad laminate board or printed circuit board substrate
JP2009143234A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
JP2009143233A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
SG173615A1 (en) 2009-12-22 2011-09-29 Jx Nippon Mining & Metals Corp Method for producing laminate, and laminate
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5285180B1 (ja) * 2012-11-08 2013-09-11 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5362898B1 (ja) * 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、プリント配線板並びに銅張積層板
JP6056521B2 (ja) * 2013-02-06 2017-01-11 東洋紡株式会社 ガスバリアフィルム
JP6225573B2 (ja) * 2013-02-06 2017-11-08 東洋紡株式会社 積層フィルム
CN103160867B (zh) * 2013-03-11 2016-04-06 福建清景铜箔有限公司 铜箔生产连体机及其锂离子电池用高粘结强度铜箔工艺
JP5399582B2 (ja) * 2013-05-30 2014-01-29 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
KR102356179B1 (ko) 2013-11-27 2022-02-08 미쓰이금속광업주식회사 캐리어박이 부착된 구리박, 동장 적층판 및 프린트 배선판
TWI621381B (zh) * 2014-04-02 2018-04-11 Jx Nippon Mining & Metals Corp Laminated body with metal foil with carrier
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) * 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR102482171B1 (ko) * 2017-02-20 2022-12-30 (주)잉크테크 시드층을 포함하는 전사필름 제조방법, 시드층의 선택적 에칭을 이용한 회로기판 제조방법 및 에칭액 조성물
CN108541144A (zh) * 2018-04-17 2018-09-14 广东工业大学 一种易剥离载体箔及其制备方法和应用
JP6812492B2 (ja) * 2019-04-26 2021-01-13 日本エレクトロプレイテイング・エンジニヤース株式会社 ナノ構造基板
US10697082B1 (en) * 2019-08-12 2020-06-30 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil
CN113445083A (zh) * 2021-07-30 2021-09-28 江西铜博科技有限公司 一种有效提升铜箔面均匀密度的铜箔生产设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235040B2 (ja) * 1987-04-30 1990-08-08 Fukuda Kinzoku Hakufun Kogyo Kk Fukugohakuoyobisonoseizohoho
JPH02113591A (ja) * 1988-10-22 1990-04-25 Matsushita Electric Works Ltd 印刷配線板の製造方法
JPH05102630A (ja) * 1991-10-03 1993-04-23 Hitachi Chem Co Ltd キヤリア付銅箔の製造方法及びそれを用いた銅張積層板

Also Published As

Publication number Publication date
EP1152070A1 (en) 2001-11-07
JP2001068804A (ja) 2001-03-16
WO2001016402A1 (fr) 2001-03-08
WO2001016402A8 (fr) 2001-08-16
KR20010075616A (ko) 2001-08-09
CN1327489A (zh) 2001-12-19

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