WO2000065648A1 - Vertikal integrierbare schaltung und verfahren zu ihrer herstellung - Google Patents
Vertikal integrierbare schaltung und verfahren zu ihrer herstellung Download PDFInfo
- Publication number
- WO2000065648A1 WO2000065648A1 PCT/EP2000/003575 EP0003575W WO0065648A1 WO 2000065648 A1 WO2000065648 A1 WO 2000065648A1 EP 0003575 W EP0003575 W EP 0003575W WO 0065648 A1 WO0065648 A1 WO 0065648A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrically conductive
- vertical integration
- contacts
- circuits
- substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- 230000010354 integration Effects 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 238000001465 metallisation Methods 0.000 claims description 29
- 238000009413 insulation Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 6
- 108090000623 proteins and genes Proteins 0.000 claims 1
- 238000005530 etching Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a vertically integrable circuit and a method for its production.
- Vertically integrable circuits are understood to be semiconductor circuits manufactured using planar technology, which are arranged vertically one above the other in several planes, as a result of which three-dimensional circuits are created.
- the individual components and circuit components on the different levels are electrically connected to one another by vertical contacts. This can be compared to two-dimensional circuits, i. H. Circuits only in one level, a higher packing density can be achieved.
- Vertical integration also offers advantages from safety-related aspects, since particularly sensitive circuit components can be arranged in levels or layers, which are surrounded on both sides by at least one further level or layer with active components.
- the vertical contacts deviate from known technologies, since the individual vertically integrable circuits are produced in known and easily controllable planar technology. Several methods have become known for producing the vertical contacts.
- a known method is based on depositing and recrystallizing polycrystalline silicon on a completely processed component layer. Additional components can be manufactured in the recrystallized layer.
- the disadvantage of this method is that, due to the high temperatures during recrystallization, the properties of the already finished active components on the lower level can change. Will continue Due to the serial processing of the vertically integrated overall circuit, a correspondingly extended lead time is required for the production.
- Another known method provides for the individual, vertically integrable circuits or levels of formwork to be produced separately on different substrates.
- the substrates with the individual circuit planes are then thinned, provided with front and rear contacts and connected vertically by means of a bonding process. It is a disadvantage of this method that materials are sometimes used for the production of the front and rear side contacts which cannot easily be used in known semiconductor manufacturing processes.
- DE 4433 845 AI discloses a method for producing a three-dimensional integrated circuit, in which two finished substrates or individual circuits are connected to one another. For the vertical electrical connection of the circuits contained on both substrates, after the connection of the two substrates, one of which has been thinned, further process steps are carried out in order to produce a metallization.
- the disadvantage of the known method is that completely processed substrates have to be made available and that additional process steps are required to produce the vertical electrical connection.
- FIG. 1 shows different process steps of a method for producing vertically integrable circuits
- Figure 2 shows an embodiment of an electrically conductive connection for the vertical integration of circuits.
- Figure 1 shows the sequence of process steps in the manufacture of vertically integrable circuits.
- FIG. 1 a shows a substrate 1, 2 in which an insulating layer 3 is hidden.
- the substrate 1, 2 can e.g. B. consist of silicon, the insulating layer 3 z. B. from silicon dioxide.
- SOI substrates Silicon On Insulator
- recesses 4 are made up to the insulating layer 3, e.g. B. by etching, the webs 5 in the substrate 1 surrounded.
- the webs 5 are dimensioned such that they can be completely oxidized in a subsequent process step.
- Recesses 4 and webs 5 are dimensioned so that their area is sufficient to accommodate contacts for vertical integration and to form insulation for these contacts.
- alignment marks (not shown) can also be etched, which will later be used to align the circuits or the substrate for vertical integration.
- Figure lb shows the SOI substrate 1, 2, 3 after further process steps.
- Different doped wells 6 and oxide layers 8 and 9 were produced.
- the doped wells 6 and field oxide 8 and gate oxide 9 later form the active components of the vertically integrable circuit. Their manufacture and mode of operation are known and therefore do not need to be described, especially since they are not important for understanding the present invention.
- In the place of the recesses 4 and webs 5 from Figure la is after the oxidation, for. B. a high temperature oxidation, an oxide that is part of the field oxide 8 and extends to the insulating layer 3. During the oxidation, it must be ensured that the field oxide is free of voids and that the surface is as planar as possible.
- Figure lc shows the substrate 1, 2, 3 after completion of the components, for. B. by introducing different doping materials 11 and 12 or by applying poly crystalline silicon 10.
- FIG. 1d shows the cutouts 13 and 14 made for a first metallization level, which can be produced, for example, by etching and are referred to as vias.
- the cutouts 14 serve to connect a component, here a transistor, the cutouts 13 are provided for later vertical integration.
- FIG. 1 shows the through metallization 15 and 16 introduced for the first metallization level, which fill the vias 13 and 14 from FIG. 1d.
- a metallization for connecting the through metallizations 15 and 16 is applied to the surface of the planing layer 7.
- Aluminum is usually used for the metallizations.
- Figure lf shows the substrate 1, 3 after thinning.
- the illustrated use of a substrate with a hidden insulating layer 3 proves to be particularly advantageous, since this serves as an etching stop. In principle, however, is that Use of other substrates possible.
- an oxide deposition For handling the substrate during thinning and during subsequent processing, the processed surface 1 of the substrate can be applied to a handling waver, from which it is detached after complete processing. In this case, the substrate is thinned down to oxide 8. In both cases it can also be provided that the through-metallization 15 is carried out up to the end of the oxide 8, that is to say it is etched accordingly deep beforehand.
- FIG. 1g shows the processed substrate 1, 3, in which cutouts 17 from the rear side 3 have been etched at the locations of the contacts for vertical integration.
- the etching which can be carried out, for example, using wet chemistry, extends to the through-metallizations 15.
- FIG. 1h shows a final rear-side metallization 18 of the substrate 1, 3.
- the rear-side metallization 18 is carried out in such a way that the contacts 15, 18 required for vertical integration result, i. H. the rear side metallization 18 is interrupted at the locations of the through metallization 15, as shown in FIG. 1h.
- end layers can also be applied to the rear side metallization, as described above for the front side of the substrate.
- the oxide 8 was dimensioned at the location of the contact for vertical integration 15, 18 such that it completely encloses the contact for vertical integration 15, 18 for electrical insulation.
- circuits or substrates for the vertical integration produced by means of the method described above are then joined together, for example with the rear side metallizations 18, the adjustment being carried out by the adjustment marks mentioned above can be used.
- the connection of more than two substrates is made possible if the contacts for the vertical integration are also led onto the surface of the processed substrate 1. In this case, infrared techniques may have to be used for the adjustment, since the adjustment marks can be hidden by the vertical integration.
- backside metallizations or metallizations can be provided on the surfaces of the processed substrates, which melt or melt at low temperatures in order to provide a secure electrical connection.
- Placing the surfaces, on the front or back of the substrate, with contacts for vertical integration must also not be covered by the above-mentioned sealing layers, so that an electrical connection can be made.
- these points can either be excluded from the creation of the closing layers or these points are, for example, etched free after the closing layers have been created.
- the method according to the invention can also be used for processes based on other semiconductor materials.
- FIG. 2 shows an advantageous embodiment of a contact according to the invention for vertical integration.
- a further metallization 19 is provided within the insulating oxide 8.
- the metallization 19 is, for. B. designed annular and completely surrounds the metallization of the contact for the vertical integration 15.
- the ring-shaped metallization 19 is connected in an electrically conductive manner by means of the metallization applied to the surface in a later process step in such a way that it is connected to ground during operation. In this way it can be achieved that the signal flow through the vertical contact 15, 18 is shielded. Then an evaluation of the signal flow through the contact for the vertical integration is also not possible from one of the end faces of the substrate if the contact for the vertical integration is in the vicinity of one of the end faces of the substrate.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00925226A EP1183723A1 (de) | 1999-04-23 | 2000-04-19 | Vertikal integrierbare schaltung und verfahren zu ihrer herstellung |
JP2000614497A JP2002543588A (ja) | 1999-04-23 | 2000-04-19 | 垂直集積が可能な回路およびそれを形成する方法 |
AU44017/00A AU4401700A (en) | 1999-04-23 | 2000-04-19 | Circuit suitable for vertical integration and method of producing same |
US09/926,377 US7144757B1 (en) | 1999-04-23 | 2000-04-19 | Circuit suitable for vertical integration and method of producing same |
KR1020017013597A KR100614362B1 (ko) | 1999-04-23 | 2000-04-19 | 수직 집적형 회로 및 그의 제조방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19918671.5 | 1999-04-23 | ||
DE19918671A DE19918671B4 (de) | 1999-04-23 | 1999-04-23 | Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000065648A1 true WO2000065648A1 (de) | 2000-11-02 |
Family
ID=7905744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2000/003575 WO2000065648A1 (de) | 1999-04-23 | 2000-04-19 | Vertikal integrierbare schaltung und verfahren zu ihrer herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US7144757B1 (de) |
EP (1) | EP1183723A1 (de) |
JP (1) | JP2002543588A (de) |
KR (1) | KR100614362B1 (de) |
AU (1) | AU4401700A (de) |
DE (1) | DE19918671B4 (de) |
WO (1) | WO2000065648A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19918671B4 (de) * | 1999-04-23 | 2006-03-02 | Giesecke & Devrient Gmbh | Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung |
JP2001127243A (ja) * | 1999-10-26 | 2001-05-11 | Sharp Corp | 積層半導体装置 |
DE10141571B8 (de) * | 2001-08-24 | 2005-05-25 | Schott Ag | Verfahren zum Zusammenbau eines Halbleiterbauelements und damit hergestellte integrierte Schaltungsanordnung, die für dreidimensionale, mehrschichtige Schaltungen geeignet ist |
WO2003019653A2 (de) | 2001-08-24 | 2003-03-06 | Schott Glas | Verfahren zum kontaktieren und gehäusen von integrierten schaltungen |
TW569416B (en) * | 2002-12-19 | 2004-01-01 | Via Tech Inc | High density multi-chip module structure and manufacturing method thereof |
JP4585561B2 (ja) * | 2007-09-04 | 2010-11-24 | 株式会社東芝 | 半導体装置の製造方法 |
US8525168B2 (en) * | 2011-07-11 | 2013-09-03 | International Business Machines Corporation | Integrated circuit (IC) test probe |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4939568A (en) * | 1986-03-20 | 1990-07-03 | Fujitsu Limited | Three-dimensional integrated circuit and manufacturing method thereof |
US5426072A (en) * | 1993-01-21 | 1995-06-20 | Hughes Aircraft Company | Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate |
US5627106A (en) * | 1994-05-06 | 1997-05-06 | United Microelectronics Corporation | Trench method for three dimensional chip connecting during IC fabrication |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3648131A (en) * | 1969-11-07 | 1972-03-07 | Ibm | Hourglass-shaped conductive connection through semiconductor structures |
JPS59132142A (ja) * | 1983-01-18 | 1984-07-30 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
US4893174A (en) * | 1985-07-08 | 1990-01-09 | Hitachi, Ltd. | High density integration of semiconductor circuit |
DE3850855T2 (de) * | 1987-11-13 | 1994-11-10 | Nissan Motor | Halbleitervorrichtung. |
US5229647A (en) * | 1991-03-27 | 1993-07-20 | Micron Technology, Inc. | High density data storage using stacked wafers |
US5591678A (en) * | 1993-01-19 | 1997-01-07 | He Holdings, Inc. | Process of manufacturing a microelectric device using a removable support substrate and etch-stop |
KR0156115B1 (ko) | 1994-06-16 | 1998-12-01 | 문정환 | 반도체 소자의 격리막 구조 및 형성방법 |
DE4433845A1 (de) * | 1994-09-22 | 1996-03-28 | Fraunhofer Ges Forschung | Verfahren zur Herstellung einer dreidimensionalen integrierten Schaltung |
JPH09509792A (ja) * | 1994-12-23 | 1997-09-30 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 支持ウェーハ上に接着した半導体物質の層中に半導体素子が形成した半導体装置の製造方法 |
US6355950B1 (en) * | 1998-09-23 | 2002-03-12 | Intel Corporation | Substrate interconnect for power distribution on integrated circuits |
DE19856573C1 (de) * | 1998-12-08 | 2000-05-18 | Fraunhofer Ges Forschung | Verfahren zur vertikalen Integration von aktiven Schaltungsebenen und unter Verwendung desselben erzeugte vertikale integrierte Schaltung |
DE19918671B4 (de) * | 1999-04-23 | 2006-03-02 | Giesecke & Devrient Gmbh | Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung |
US7603097B2 (en) * | 2004-12-30 | 2009-10-13 | Valeo Radar Systems, Inc. | Vehicle radar sensor assembly |
JP4939568B2 (ja) * | 2009-04-28 | 2012-05-30 | インターナショナル・ビジネス・マシーンズ・コーポレーション | データベース間でデータを同期するための方法、並びにそのコンピュータ・システム及びコンピュータ・プログラム |
-
1999
- 1999-04-23 DE DE19918671A patent/DE19918671B4/de not_active Expired - Fee Related
-
2000
- 2000-04-19 EP EP00925226A patent/EP1183723A1/de not_active Withdrawn
- 2000-04-19 US US09/926,377 patent/US7144757B1/en not_active Expired - Fee Related
- 2000-04-19 JP JP2000614497A patent/JP2002543588A/ja active Pending
- 2000-04-19 KR KR1020017013597A patent/KR100614362B1/ko not_active IP Right Cessation
- 2000-04-19 WO PCT/EP2000/003575 patent/WO2000065648A1/de active IP Right Grant
- 2000-04-19 AU AU44017/00A patent/AU4401700A/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4939568A (en) * | 1986-03-20 | 1990-07-03 | Fujitsu Limited | Three-dimensional integrated circuit and manufacturing method thereof |
US5426072A (en) * | 1993-01-21 | 1995-06-20 | Hughes Aircraft Company | Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate |
US5627106A (en) * | 1994-05-06 | 1997-05-06 | United Microelectronics Corporation | Trench method for three dimensional chip connecting during IC fabrication |
Also Published As
Publication number | Publication date |
---|---|
KR20020006040A (ko) | 2002-01-18 |
EP1183723A1 (de) | 2002-03-06 |
US7144757B1 (en) | 2006-12-05 |
DE19918671A1 (de) | 2000-11-02 |
DE19918671B4 (de) | 2006-03-02 |
JP2002543588A (ja) | 2002-12-17 |
AU4401700A (en) | 2000-11-10 |
KR100614362B1 (ko) | 2006-09-11 |
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