WO2000064625A1 - Perles de soudure ameliorees et utilisations associees - Google Patents

Perles de soudure ameliorees et utilisations associees Download PDF

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Publication number
WO2000064625A1
WO2000064625A1 PCT/SE2000/000671 SE0000671W WO0064625A1 WO 2000064625 A1 WO2000064625 A1 WO 2000064625A1 SE 0000671 W SE0000671 W SE 0000671W WO 0064625 A1 WO0064625 A1 WO 0064625A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
solder balls
solder ball
ball
protective layer
Prior art date
Application number
PCT/SE2000/000671
Other languages
English (en)
Inventor
Lars-Anders Olofsson
Original Assignee
Telefonaktiebolaget Lm Ericsson (Publ)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget Lm Ericsson (Publ) filed Critical Telefonaktiebolaget Lm Ericsson (Publ)
Priority to AU46315/00A priority Critical patent/AU4631500A/en
Publication of WO2000064625A1 publication Critical patent/WO2000064625A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0435—Metal coated solder, e.g. for passivation of solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates generally to ball grid array modules and more specifically to a method of improving solder balls for such modules and for connecting such modules to other electronic devices.
  • a ball grid array module is known.
  • the known module utilizes solder balls comprised of a core having a relatively high melting temperature and a solder coating having a lower melting temperature.
  • the core may be metal, e.g. copper or solder having a higher melting temperature than the solder coating.
  • a drawback of solder balls with a copper core that is to function as a mechanical spacer, is that copper does not have the stress-relieving ability that is required for the soldered joints to stand temperature cycling.
  • Solder balls of solder having a high content of Pb would be suitable as spacers in that have the stress-relieving ability that is required.
  • solderability is poor due to the lead oxide formed on the surface of such solder balls.
  • This oxide is comprised of native oxide as well as oxide formed when the solder balls are heated in connection with being soldered to connecting pads on the ball grid array module by means of solder having a low melting temperature, applied in the form of a conventional soldering paste.
  • solderability of the solder balls results in that the solder balls are not centered perfectly on the connecting pads. Also, if the solderability of the solder balls is poor, the solder balls can to some extent float on the low melting temperature solder, resulting in that the top of the solder balls, facing away from the connecting pads will be at varying heights.
  • a solder ball 1 is shown "floating" uncentered on solder 2 on a substrate 3 of a ball grid array module (not shown), while a solder ball 4 is shown resting uncentered on the substrate 3 or actually on a connecting pad (not shown) on the substrate 3. As apparent from Fig. 1, the tops of the solder balls 2 and 4 are at different heights.
  • the object of the invention is to eliminate the above drawbacks of known solder balls.
  • solderability of solder ball of solder having a high melting temperature by first removing native oxide from the solder balls and then, before new oxide has been formed, despositing a protective metal layer on the solder balls that enables soldering of the solder balls to connecting pads.
  • Fig. 1 illustrates an embodiment of prior art solder balls soldered to a substrate
  • Fig. 2 illustrates a solder ball in accordance with the invention
  • Fig. 3 illustrates solder balls in accordance with the invention soldered to a substrate.
  • Fig. 2 illustrates a solder ball 7 in accordance with the invention.
  • the solder ball 7 comprises a core 8 of solder having a high melting temperature, preferably Pb90SnlO or Pb88Snl0Ag2.
  • solder balls are soldered to connecting pads (not shown) by means of a conventional soldering paste, due to the native oxide on such solder balls, the solderability will be poor, resulting in that the solder balls are not centered on the connecting pads or floats on the solder on the connecting pads as illustrated in Fig. 1.
  • native oxide is first removed from the core 8, e.g. by means of an acid, e.g. HC1, or a reducing agent.
  • a protective metal layer 9 is deposited on the core 8 freed of native oxide.
  • a metal is selected for the layer 9, that enables soldering of the solder ball 7 by a conventional soldering paste to a substrate.
  • the metal for the protective layer 9 is selected from a group consisting of Ag, Au, In, Pd, Pt and Sn.
  • solder balls 7 according to the invention as illustrated in Fig. 2 are soldered to connecting pads (not shown) on a substrate 10 of a ball grid array module by means of conventional soldering paste, due to the improved solderability of the solder balls 7, they will be centered on the soldering paste as illustrated in Fig. 3.
  • the protective layer 9, if of Sn or In will melt by the heat from the soldering paste that will solder against the oxide-free surface of the core 8. If of Au or Ag, the protective layer 9 will be dissolved in the soldering paste. If of Pt or Pd, the protective layer 9 will remain on the surface of the solder balls 7 and the soldering paste will solder against the protective layer 9.
  • solderability of the solder balls 7 to connecting pads on the printed circuit board will also be improved thanks to the protective metal layer 9 remaining on the surface of the solder balls 7 facing away from the ball grid array module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

. La présente invention concerne l'amélioration de l'aptitude au soudage d'une perle de soudure possédant une température de fusion élevée, utilisée comme moyens de connexion mécanique et électrique dans un module de réseau de perles en forme de grille. Cette amélioration est obtenue par enlèvement d'oxyde natif sur la perle de soudure (8), puis, afin d'empêcher la formation d'un nouvel oxyde, par dépôt d'un couche protectrice (9) d'un métal permettant de pratiquer une soudure de la perle au moyen d'une pâte de soudure classique.
PCT/SE2000/000671 1999-04-21 2000-04-07 Perles de soudure ameliorees et utilisations associees WO2000064625A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU46315/00A AU4631500A (en) 1999-04-21 2000-04-07 Improved solder balls and use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9901427-6 1999-04-21
SE9901427A SE515028C2 (sv) 1999-04-21 1999-04-21 Förbättrade lodkulor samt användning av dylika

Publications (1)

Publication Number Publication Date
WO2000064625A1 true WO2000064625A1 (fr) 2000-11-02

Family

ID=20415300

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2000/000671 WO2000064625A1 (fr) 1999-04-21 2000-04-07 Perles de soudure ameliorees et utilisations associees

Country Status (4)

Country Link
AU (1) AU4631500A (fr)
SE (1) SE515028C2 (fr)
TW (1) TW410367B (fr)
WO (1) WO2000064625A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3216553A4 (fr) * 2014-11-05 2018-04-25 Senju Metal Industry Co., Ltd Matériau de soudure, pâte de soudure, soudure en mousse, joint de soudure, et procédé pour contrôler un matériau de soudure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5340411A (en) * 1993-10-12 1994-08-23 Hughes Aircraft Company Surface treatment method for fatigue-resistant solder
EP0747954A2 (fr) * 1995-06-07 1996-12-11 International Business Machines Corporation Boule de brasure comprenant une couverture métallique à bas point de fusion
WO1997001866A1 (fr) * 1995-06-29 1997-01-16 Minnesota Mining And Manufacturing Company Boitier a structure en reseau de billes mettant en oeuvre des spheres recouvertes de soudure
WO1998012738A1 (fr) * 1996-09-20 1998-03-26 Lsi Logic Corporation Procede de fixation de globule de soudure sans flux

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5340411A (en) * 1993-10-12 1994-08-23 Hughes Aircraft Company Surface treatment method for fatigue-resistant solder
EP0747954A2 (fr) * 1995-06-07 1996-12-11 International Business Machines Corporation Boule de brasure comprenant une couverture métallique à bas point de fusion
WO1997001866A1 (fr) * 1995-06-29 1997-01-16 Minnesota Mining And Manufacturing Company Boitier a structure en reseau de billes mettant en oeuvre des spheres recouvertes de soudure
WO1998012738A1 (fr) * 1996-09-20 1998-03-26 Lsi Logic Corporation Procede de fixation de globule de soudure sans flux

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3216553A4 (fr) * 2014-11-05 2018-04-25 Senju Metal Industry Co., Ltd Matériau de soudure, pâte de soudure, soudure en mousse, joint de soudure, et procédé pour contrôler un matériau de soudure
US10717157B2 (en) 2014-11-05 2020-07-21 Senju Metal Industry Co., Ltd. Solder material, solder paste, solder preform, solder joint and method of managing the solder material

Also Published As

Publication number Publication date
TW410367B (en) 2000-11-01
SE9901427L (sv) 2000-10-22
AU4631500A (en) 2000-11-10
SE515028C2 (sv) 2001-05-28
SE9901427D0 (sv) 1999-04-21

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