SE9901427L - Förbättrade lodkulor samt användning av dylika - Google Patents

Förbättrade lodkulor samt användning av dylika

Info

Publication number
SE9901427L
SE9901427L SE9901427A SE9901427A SE9901427L SE 9901427 L SE9901427 L SE 9901427L SE 9901427 A SE9901427 A SE 9901427A SE 9901427 A SE9901427 A SE 9901427A SE 9901427 L SE9901427 L SE 9901427L
Authority
SE
Sweden
Prior art keywords
solder ball
solder
ball
soldering balls
improved soldering
Prior art date
Application number
SE9901427A
Other languages
English (en)
Other versions
SE9901427D0 (sv
SE515028C2 (sv
Inventor
Lars-Anders Olofsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9901427A priority Critical patent/SE515028C2/sv
Publication of SE9901427D0 publication Critical patent/SE9901427D0/sv
Priority to TW088108738A priority patent/TW410367B/zh
Priority to PCT/SE2000/000671 priority patent/WO2000064625A1/en
Priority to AU46315/00A priority patent/AU4631500A/en
Publication of SE9901427L publication Critical patent/SE9901427L/sv
Publication of SE515028C2 publication Critical patent/SE515028C2/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0435—Metal coated solder, e.g. for passivation of solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE9901427A 1999-04-21 1999-04-21 Förbättrade lodkulor samt användning av dylika SE515028C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9901427A SE515028C2 (sv) 1999-04-21 1999-04-21 Förbättrade lodkulor samt användning av dylika
TW088108738A TW410367B (en) 1999-04-21 1999-05-27 Improved solder balls and use thereof
PCT/SE2000/000671 WO2000064625A1 (en) 1999-04-21 2000-04-07 Improved solder balls and use thereof
AU46315/00A AU4631500A (en) 1999-04-21 2000-04-07 Improved solder balls and use thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9901427A SE515028C2 (sv) 1999-04-21 1999-04-21 Förbättrade lodkulor samt användning av dylika

Publications (3)

Publication Number Publication Date
SE9901427D0 SE9901427D0 (sv) 1999-04-21
SE9901427L true SE9901427L (sv) 2000-10-22
SE515028C2 SE515028C2 (sv) 2001-05-28

Family

ID=20415300

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9901427A SE515028C2 (sv) 1999-04-21 1999-04-21 Förbättrade lodkulor samt användning av dylika

Country Status (4)

Country Link
AU (1) AU4631500A (sv)
SE (1) SE515028C2 (sv)
TW (1) TW410367B (sv)
WO (1) WO2000064625A1 (sv)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016071971A1 (ja) * 2014-11-05 2016-05-12 千住金属工業株式会社 はんだ材料、はんだペースト、フォームはんだ、はんだ継手、およびはんだ材料の管理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5340411A (en) * 1993-10-12 1994-08-23 Hughes Aircraft Company Surface treatment method for fatigue-resistant solder
EP0747954A3 (en) * 1995-06-07 1997-05-07 Ibm Solder ball comprising a metal cover with low melting point
WO1997001866A1 (en) * 1995-06-29 1997-01-16 Minnesota Mining And Manufacturing Company Ball grid array package utilizing solder coated spheres
US5899737A (en) * 1996-09-20 1999-05-04 Lsi Logic Corporation Fluxless solder ball attachment process

Also Published As

Publication number Publication date
TW410367B (en) 2000-11-01
AU4631500A (en) 2000-11-10
SE9901427D0 (sv) 1999-04-21
SE515028C2 (sv) 2001-05-28
WO2000064625A1 (en) 2000-11-02

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Legal Events

Date Code Title Description
NUG Patent has lapsed