WO2000054928A1 - Composition de flux de brasage tendre - Google Patents

Composition de flux de brasage tendre Download PDF

Info

Publication number
WO2000054928A1
WO2000054928A1 PCT/KR2000/000158 KR0000158W WO0054928A1 WO 2000054928 A1 WO2000054928 A1 WO 2000054928A1 KR 0000158 W KR0000158 W KR 0000158W WO 0054928 A1 WO0054928 A1 WO 0054928A1
Authority
WO
WIPO (PCT)
Prior art keywords
acid
weight
welding
soldering
flux composition
Prior art date
Application number
PCT/KR2000/000158
Other languages
English (en)
Korean (ko)
Inventor
Kwan-Young Chang
In Duk Park
Seung-Ho Won
Original Assignee
Morning Chemical Co. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morning Chemical Co. Ltd. filed Critical Morning Chemical Co. Ltd.
Priority to AU31970/00A priority Critical patent/AU3197000A/en
Publication of WO2000054928A1 publication Critical patent/WO2000054928A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3611—Phosphates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Definitions

  • This invention relates to a soldering flux composition. More particularly, this invention relates to a soldering flux composition making it easy to solder materials, which are conventionally hard to connect by soldering, such as stainless steels, coppers, zincs, tins and thick iron plates.
  • soldering such as stainless steels, coppers, zincs, tins and thick iron plates.
  • a stainless steel In general, a stainless steel is widely used in our daily lives and industrial fields. Due to its advantages of high strength, non-corrosiveness and ever-lasting shine, it is broadly employed as from domestic and architectural materials to industrial materials. In case of welding between stainless steel materials, usually argon welding or welding using oxygen and acetylene torch, and arc welding in some cases, is employed in order to obtain clean welded zones . For mechanical products containing heat exchangers, the interior thereof is typically made up of copper tubes having good heat conduction and the exterior thereof of stainless steel plates. In this case, argon welding is employed, but silver-lead welding can be also applied in order to improve the degree of sealing in welded zones .
  • composition for a low temperature welding flux depends on the type of welding agents and welding temperature (electrical soldering or brazing). However, the most common flux composition and the function of the ingredients for the typically used Pb-Sn or Ag-Sn welding agents are as follows:
  • Rosin At a high temperature, the active ingredient of rosin, i.e. abietic acid removes the oxides in junction zone, increases the degree of spreading and viscosity of a flux composition against a base metal, and helps block contacting with oxygen in the air.
  • rosin include gum rosin, tallrosin, woodrosin, hydrogen-added rosin, esdelgum.
  • Solvent This uniformly dissolves solid phase rosin and the rest liquid & solid phase ingredients, and then evaporates out during a welding operation.
  • solvent include butylcellosolve, 1, 3-butadiol, butyl calbytol, hexan calbytol.
  • Viscosity modifier This provides adequate flow resistance and stickiness to improve a welding efficiency.
  • examples of such viscosity modifier include castor wax, high fatty acid amid, hard castor oil.
  • Activator This promotes adhesion and fusion between welding agents and base metals with the action of halogen elements dissolved and produced at a high temperature. This usually exists as hydrochloride or bromide of aliphatic amine. Examples of such activator include ethylamine hydrochloride and dimethylamine bromide.
  • Acid This helps the function of abietic acid of rosin.
  • examples of such acid include fumaric acid, tin acid and phthalic acid.
  • Typical fluxes which are usually employed for welding between iron plates or zinc-coated steel plates, leave brown residues during a welding operation, and, in case of insufficient preheating, result in a quite low welding strength and welding quality.
  • cream-type soldering fluxes for electronic circuit board which fluxes contain a lower temperature welding agents than common welding fluxes.
  • prior arts in this area are as follows.
  • UK Patent Publication No. 2 278 370 discloses a flux composition comprising a non-oxidative acid such as SnCl 2 and HC1 and a viscosity modifier such as glycerol, polyethyleneglycol and sorbitol, but not including 2nCl 2 .
  • European Patent Publication No. 0 619 162 discloses a flux composition comprising a bis(2- oxazoline) compound, a dichiol compound, an organic carboxylic acid compounds and an activator. US Patent No.
  • 5,281,281 discloses a no-clean, low-residue, rosin-free soldering flux comprising a solvent consisting essentially of demineralized water present in an amount of at least about 95% by weight based on total weight of the soldering flux, and a fluxing agent selected from the group consisting of a C 2 -C 10 dicarboxylic acid, a onocarboxylic acid and a hydroxy acid.
  • US Patent Nc. 5,296,046 discloses a flux composition comprising a carrier solvent, an oxide removing agent such as 2-amino-isophthalic acid and 5-amino-isophthalic acid, and a compound that deliberates nitrogen upon heating.
  • 5-337686 discloses a soldering flux comprising 0.5-3% by weight of silicone compound
  • Japan Patent Publication No. 5-318176 discloses a rosin based cream-type solder such as maleic acid and benzoic acid.
  • Japan Patent Publication No. 6-15483 discloses a flux composition which does not leave residues and presents non-corrosiveness in the soldered parts for a long time, comprising benzimidazole, imidazolthiol compound and triazole compound.
  • Japan Patent Publication No. 6-155078 discloses a rosin-type flux in which alkyl amine or allophatic amine complex salt of boron trifluoride is added as an activator.
  • Korea Patent Publication No. 81-49 discloses a flux composition comprising a neutral estel derived from polyhedric alcohol instead of the essential ingredient i.e. rosin, an organic monocarboxylic acid and an activator.
  • the object of the present invention lies in providing a multifunctional flux composition which makes soldering the metals as described above easier by using a simple electrical soldering iron and low temperature soldering agents such as Pb- Sn or Ag-Sn alloy.
  • the soldering flux composition in accordance with the present invention comprises 20-60% by weight of phosphate compound containing 50-60% by concentration of phosphoric acid, 10-30% by weight of organic acid, 1-20% by weight of VIII transition element, and 5-30% by weight of viscosity modifier.
  • the present invention provides an increased productivity and a new method of manufacturing thanks to an unnecessary preheating base metals and an easiness of soldering between thick plates, thick and thin plates, or plates different in type and nature.
  • the conventional manufacturing methods using argon, arc or high temperature flame welding may be replaced by the composition according to the present invention, leading to an economically efficient production and, eventually, the generalization of high quality-products.
  • the composition according to the present invention may be applied broadly in our daily lives and industrial fields where welding flames cannot be employed, as well as in the fields of electricity & electronics, thin tube processing and thin plate welding.
  • silver-tin (5-70: 95-30) can be employed as a welding agent. That is, since the multifunctional flux according to the present invention has an ability to lower the melting point of welding agents, silver-Sn welding agent, of which melting point is higher than that of Pb- Sn welding agent, can be employed at a low temperature
  • % means “% by weight” in the following examples .
  • a flux composition was prepared by uniformly mixing at about 50 °C 50% of potassium phosphate containing 50% by concentration of phosphoric acid, 10% of nickel carbonate, 20% of octyl acid and 20% of acetic acid.
  • a flux composition was prepared by the same method as described in Example 1, except that 60% of potassium phosphate containing 60% by concentration of phosphoric acid, 10% of nickel chloride, 20% of malonic acid and 10% of isopropyl alcohol were used.
  • a flux composition was prepared by the same method as described in Example 1, except that 40% of sodium phosphate containing 50% by concentration of phosphoric acid, 20% of palladium chloride, 20% of acetic acid and 20% of paraffin oil were used.
  • Example 4 A flux composition was prepared by the same method as described in Example 1, except that 20% of calcium phosphate containing 60% by concentration of phosphoric acid, 20% of palladium acetate, 30% of formic acid and 30% of castor wax were used.
  • a flux composition was prepared by the same method as described in Example 1, except that 50% of ammonium phosphate containing 60% by concentration of phosphoric acid, 20% of nickel hydroxide, 10% of octyl acid and 20% of high fatty acid were used.
  • a flux composition was prepared by the same method as described in Example 1, except that 50% of calcium phosphate containing 50 % by concentration of phosphoric acid, 10% of palladium acetate, 10% of malonic acid and 30% of oxidized titanium were used.
  • the flux compositions according to Examples 1-3 are liquid type compositions, whereas the compositions according to Examples 4- 6 are cream- or paste type compositions .
  • soldering by using the flux composition in accordance with the Examples generates no residues and smokes , provides an excellent soldering quality even in the wet condition and complete adhesion of the soldered parts, and prevents corrosion at the time of the soldering in manufacturing print circuit assembly and needs no further processing after soldering.
  • the flux composition according to the present invention may be broadly applicable and presents superior features to other flux compositions.
  • the cream- and paste- type flux compositions in accordance with the present invention produce clear waste matters during a soldering process to make the test for the soldered parts easy, and improve the vibration resistance of the soldered parts. Also, such flexible clean waste matters provide a resistance against high temperature and oxidation.
  • soldering agents made up of alloys having a low melting point such as Sn-Pb alloy(70-20: 30-80) or Sn-Ag alloy(95-30: 5-70)
  • Sn-Pb alloy(70-20: 30-80) or Sn-Ag alloy(95-30: 5-70) cause a relatively low cost and are used in a soldering operation using an electrical soldering iron, they have been readily employed as soldering means.
  • the use of such soldering agents is limited to, for example, very thin and small galvanized iron plates, iron plates or copper plates soldering applications, and thus such soldering agents cannot be employed for soldering, for example, stainless steel plates, thick iron plates or zinc plates .
  • the present invention provides a new type of flux composition which makes it possible soldering at a low temperature between the same or different types of stainless steels, copper alloys, iron alloys and tin alloys .
  • soldering by using the flux composition in accordance with the present invention is not one operating by simply melting lead to connect, but one by generating a fusion alloy with very strong soldered parts due to the flux between base metals and soldering agents.
  • soldering stainless steel plates on thick iron plates having a thickness of layer than 2cm it is possible by using the multifunctional flux composition according to the present invention without pre-heating to complete the soldering operation in an instant without generating stress in base metals and heat loss.
  • the flux composition according to the present invention comprises 20-60% by weight of phosphate compound containing 50-60% by concentration of phosphoric acid, 10-30% by weight of organic acid, 1-20% by weight of VIII transition element and 5-30% by weight of viscosity modifier.
  • Preferred phosphate compound as a major ingredient in the composition according to the present invention includes ammonium phosphate, potassium phosphate, sodium phosphate and calcium phosphate, but is not limited to said compounds.
  • the phosphate compound in the flux contains 50-60% by concentration of phosphoric acid. This amount is defined on the basis that when mixed with other ingredients in the flux, the phosphoric acid is highly active upon heating, removes impurities and oxides existing on the surface of base metals and creates reaction conditions, whereas it does not exert high oxidation power at the ambient temperature. Meanwhile, a preferred amount of the phosphate compound is 20-60% by weight.
  • the phosphate compound shows a decrease in its oxidation power and activity, whereas if the amount is more than 60% by weight, it shows an excess in its oxidation power and activity, probably leading to fragility in the soldered parts.
  • the organic acid as used in the present invention has a strong tendency to make coordinate covalent bonds with iron, copper or stainless steel in the mixed state with other ingredients of the flux when heating, leading to activate the surface of such metals .
  • Such organic acid is at least one member selected from the group consisting of malonic acid, octyl acid, acetic acid and formic acid.
  • the amount of the organic acid is preferably 10-30% by weight. If the amount is less than 10% by weight or more than 30% by weight, soldering agents get tangled or fused in a circular form during a soldering operation to inhibit a soldering adhesion.
  • Preferred VIII transition element includes nickel compounds (for example, nickel carbonate, nickel chloride or nickel oxide) or palladium compounds (for example, palladium chloride or palladium acetate), and the amount of such element in the flux composition is preferably 1-20% by weight.
  • the VIII transition element plays an important role as a catalyst or a intermediate layer to enhance a bond strength between metals which are hard to connect each other. Thus, if the amount gets out of the range of the preferred one, it results in a poor connection between the soldered metals or a tangle due to an excessive soldering adhesion.
  • the viscosity modifier is used in an amount of 5-30% by weight. It provides the desired degree of viscosity and adhesion of the flux composition according to the present invention, and may be prepared in liquid-, cream- or paste- type by changing its mixing ratio in the flux.
  • the viscosity modifier is, for example, paraffin oil, castor wax, polyvinylalcohol(PVA) resin, high fatty acid amid, oxidized manganese, oxidized titanium, acetone, and/or isopropyl alcohol. If the viscosity modifier is employed in out of the said amount, the flow condition of the flux composition is poor, soldered parts may have residues or be weak, and durability of such soldered parts may decrease.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne une composition de flux, notamment une composition de flux de brasage comprenant 20 à 60 % en poids d'un composé de phosphate contenant 50 à 60 % en concentration d'acide phosphorique, 10 à 30 % en poids d'acide organique, 1 à 20 % en poids d'élément de transition VIII, et 5 à 30 % en poids d'un modificateur de viscosité. On peut utiliser cette composition, selon la présente invention, généralement dans la vie de tous les jours et dans des domaines de l'industrie où on ne peut pas avoir recours aux flammes soudantes, notamment en électronique et en électricité, dans des domaines de soudure de feuillard et de traitement de tubes fins.
PCT/KR2000/000158 1999-03-05 2000-03-02 Composition de flux de brasage tendre WO2000054928A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU31970/00A AU3197000A (en) 1999-03-05 2000-03-02 Soldering flux composition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR19990007377 1999-03-05
KR1999/7377 1999-03-05
KR1999/13168 1999-04-14
KR1019990013168A KR20000062088A (ko) 1999-03-05 1999-04-14 납땜 플럭스 조성물

Publications (1)

Publication Number Publication Date
WO2000054928A1 true WO2000054928A1 (fr) 2000-09-21

Family

ID=26634779

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2000/000158 WO2000054928A1 (fr) 1999-03-05 2000-03-02 Composition de flux de brasage tendre

Country Status (3)

Country Link
KR (2) KR20000062088A (fr)
AU (1) AU3197000A (fr)
WO (1) WO2000054928A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1419842A2 (fr) * 2002-11-14 2004-05-19 Dcn Procédé de soudage d'éléments en aciers inoxydables ou en alliage base nickel type alliage 625
US7393463B2 (en) 2005-09-16 2008-07-01 Gm Global Technology Operations, Inc. High temperature magnetorheological fluid compositions and devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963162A (en) * 1973-08-13 1976-06-15 Senju Metal Industry Co. Ltd. Method of soldering stainless steel pipes by using soft solders
JPS5877791A (ja) * 1981-10-31 1983-05-11 Toppan Printing Co Ltd 半田付け用フラツクス組成物
US4419146A (en) * 1981-07-15 1983-12-06 International Standard Electric Corporation Solder flux compositions
JPH06182586A (ja) * 1992-12-22 1994-07-05 Toyota Motor Corp クリームはんだ用フラックス

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963162A (en) * 1973-08-13 1976-06-15 Senju Metal Industry Co. Ltd. Method of soldering stainless steel pipes by using soft solders
US4419146A (en) * 1981-07-15 1983-12-06 International Standard Electric Corporation Solder flux compositions
JPS5877791A (ja) * 1981-10-31 1983-05-11 Toppan Printing Co Ltd 半田付け用フラツクス組成物
JPH06182586A (ja) * 1992-12-22 1994-07-05 Toyota Motor Corp クリームはんだ用フラックス

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1419842A2 (fr) * 2002-11-14 2004-05-19 Dcn Procédé de soudage d'éléments en aciers inoxydables ou en alliage base nickel type alliage 625
EP1419842A3 (fr) * 2002-11-14 2005-11-30 Dcn Procédé de soudage d'éléments en aciers inoxydables ou en alliage base nickel type alliage 625
US7393463B2 (en) 2005-09-16 2008-07-01 Gm Global Technology Operations, Inc. High temperature magnetorheological fluid compositions and devices

Also Published As

Publication number Publication date
KR20000062088A (ko) 2000-10-25
AU3197000A (en) 2000-10-04
KR100440234B1 (ko) 2004-07-15
KR20010089333A (ko) 2001-10-06

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