WO2000043436A1 - Résine de polycarbonate pour article formé, procédé de production thereof et enceinte ou support pour produit semi-conducteur réalisés dans cette résine - Google Patents

Résine de polycarbonate pour article formé, procédé de production thereof et enceinte ou support pour produit semi-conducteur réalisés dans cette résine Download PDF

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Publication number
WO2000043436A1
WO2000043436A1 PCT/JP2000/000231 JP0000231W WO0043436A1 WO 2000043436 A1 WO2000043436 A1 WO 2000043436A1 JP 0000231 W JP0000231 W JP 0000231W WO 0043436 A1 WO0043436 A1 WO 0043436A1
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WO
WIPO (PCT)
Prior art keywords
polycarbonate resin
eluted
resin
polycarbonate
weight
Prior art date
Application number
PCT/JP2000/000231
Other languages
English (en)
Japanese (ja)
Inventor
Shigeki Kuze
Kouichi Hara
Original Assignee
Idemitsu Petrochemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Petrochemical Co., Ltd. filed Critical Idemitsu Petrochemical Co., Ltd.
Publication of WO2000043436A1 publication Critical patent/WO2000043436A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/04—Aromatic polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/40—Post-polymerisation treatment

Definitions

  • the present invention relates to a molding polycarbonate resin, a method for producing the same, and a semiconductor product storage / transport tool using the same. More specifically, polycarbonate with a low content of volatiles, eluted chloride ions and sulfate ions, a production method for reducing the content of these impurities, and semiconductor products such as silicon wafers formed using the polycarbonate Or, it relates to a carrier that stores, cleans, dries, and transports disk products such as hard disks.
  • wafers are stored in cases (called “semiconductor product storage vehicles”) that store several tens of wafers. It is immersed in a washing tank containing ultrapure water, washed, taken out, dried, and moved and transported to the next circuit production process.
  • thermoplastic materials such as polypropylene and polycarbonate have been used for such carriers.However, in response to requests such as increasing the diameter of the wafer itself and increasing the number of sheets to be stored, stronger rigidity and higher resistance have been achieved.
  • Wafer surface contamination causes exfoliation and swelling of the photosensitive resin used in the subsequent circuit fabrication process, poor etching, etc., as well as partial variations in circuit resistance, circuit defects, and service life in the final product device. It is said to be a distant cause of the shortening of life. It is also said that hard disks have defects in storage layers and shorter lives.
  • the present invention relates to a molding polycarbonate resin which does not cause surface contamination of a silicon wafer or a hard disk, a method for producing the same, and a silicon resin molded using the molding polycarbonate resin.
  • the purpose is to provide storage and transportation tools for semiconductor products such as wafers or disk products such as hard disks.
  • the present inventors have intensively studied the above problems, and have used a storage and transport device made of polycarbonate resin in the washing and drying processes of semiconductor products such as silicon wafers or disk products such as hard disks.
  • the present inventors have investigated impurities that cause surface contamination of semiconductor products, and based on the findings, completed the present invention having the following contents.
  • a polycarbonate resin for molding that satisfies the following (1) to (3).
  • the weight of the volatile gas generated when the polycarbonate resin is heat-treated at 108 ° C for 30 minutes is 0.3 ppm or less
  • the weight of the sulfate ion eluted when the polycarbonate resin is eluted with pure water at 23 ° C for 1 minute is 50 ppb or less.
  • Polycarbonate powder is kneaded and extruded using a twin-screw extruder having a plurality of decompression vents, and the extruded strands have a chloride ion concentration and a sulfate ion concentration of 50 ppm by weight or less, respectively.
  • the first invention of the present invention is a low-impurity-containing polycarbonate represented by the following (1) to (3) ′.
  • the weight of the volatile gas generated when the polycarbonate resin is heat-treated at 108 ° C for 30 minutes is 0.3 ppm or less, preferably 0.2 ppm or less,
  • the weight of the eluted chloride ion is 50 ppb or less, preferably 40 ppb or less.
  • the weight of the sulfate ion eluted when the polycarbonate resin is eluted with pure water at 23 ° C for 1 minute is 50 ppb or less, preferably 40 ppb or less.
  • the amount of volatile gas from the molding polycarbonate resin is half. It is measured under typical conditions in the drying process of conductor products, and is the weight of volatile gas generated when a resin burette sample is heat-treated at a temperature of 108 for 30 minutes. It is specified by the measured value.
  • the sample was heated at a heating temperature of 108 ° C for 30 minutes while flowing a stream of hemi-gas, and the volatile components were adsorbed on the adsorbent Tenax-TA at 130 ° C, and then the adsorbed volatile components were removed. Desorb for 2 minutes at ° C and measure by gas chromatography.
  • the volatile gas is presumed to be, for example, methylene chloride derived from a solvent used for producing polycarbonate by the interfacial polymerization method, and also gas due to contamination at the time of pellet production.
  • the generated weight of the volatile gas was 0.4 to 0.5 ppm. If the generated weight of this volatile gas exceeds 0.3 ppm, it is difficult to avoid contamination of semiconductor products or disc products.
  • chlorine eluted from the polycarbonate resin for molding is used.
  • the amounts of sulfate and sulfate ions were measured under typical conditions in the washing process of semiconductor products, and a sample of resin pellets was purified using a Millipore ultrapure water production system Mi11iQ system. Using water (specific resistance: 18 ⁇ or more), measure the weight of the eluted chloride and sulfate ions by ion chromatography.
  • a resin bottle sample is put into a polypropylene sample bottle that has been thoroughly washed with pure water for measurement, then 25 milliliters of pure water at 23 ° C is added, and after sealing, at 23 ° C Elution was performed for 1 minute.
  • the eluted water was subjected to ion chromatography (IC700, manufactured by Yokogawa Electric Corporation) to measure the weight of chloride ions and the weight of sulfate ions.
  • the chlorine ions and the sulfate ions are mainly derived from dissolved substances in strand cooling water at the time of pellet production.
  • Polycarbonate with a small amount of impurities as described above is significant as a material with further improved quality as a material for molding semiconductor product storage and transportation tools.
  • a second invention of the present invention relates to a method for producing a molding polycarbonate resin having a low impurity content according to the above [1], and comprising a plurality of decompressing vents for polycarbonate powder.
  • a twin-screw extruder kneading, extruding, and extruding the strand are performed using cooling water having a chloride ion concentration and a sulfate ion concentration of 50 ppm by weight or less, respectively. Is achieved. That is, it is effective to use a twin-screw extruder with two or more decompression vents as a pellet granulator as a method for reducing the volatile gas described in (1) of [1] above.
  • three or more decompression vents are provided.
  • Volatile gas separated in the kneader is removed from the decompression vent, but a decompression vent is provided at the center of the kneader and at the exit of the kneader near the die, and a third and fourth decompression vent is appropriately arranged. It is preferable to use a type that has a good mixer and has a twin-screw kneader because it has a large degassing effect of volatile gas.
  • the molding conditions of such a twin-screw kneader with a multi-vacuum vent differ depending on the properties of the raw material polycarbonate powder to be charged.For example, with a twin-screw kneader having a diameter of 7 mm ⁇ , the It is performed at 350 ° C and an extrusion speed of 250 kg hours. Further, if necessary, the amount of volatile gas can be reduced by once passing the raw material polycarbonate pellets through the kneader again through the kneader.
  • pelletizers are usually installed in the final step of the polycarbonate manufacturing process, and various additives (antioxidants, weathering agents, etc.) are also added as appropriate during granulation.
  • additives antioxidants, weathering agents, etc.
  • the present applicant has proposed a technique for further promoting the reduction of volatile gas by adding water by using the addition mechanism or the like (Japanese Patent Publication No. 5-276647). It can also function effectively for the above problems.
  • the generated weight of volatile gas is 0.4 to 0.5 ppm, and according to the method of the present invention, 10 minutes is required. It can be reduced to 1 or less.
  • the elution chloride ion and sulfur described in (2) and (3) of [1] above is effective to limit the quality of the extruded strand cooling water. That is, the hot strand exiting the dice of the twin-screw kneader passes through a water tank filled with cooling water, is cooled, and is supplied to a strand cutter.
  • This cooling water is regarded as a source of contamination of the above-mentioned elution chloride ion and sulfate ion, and pure water is used so that the elution amount under each predetermined condition is 50 ppb or less.
  • the purity level of such cooling water may be such that each ion concentration is not more than 50 ppm by weight, preferably not more than 40 ppm by weight.
  • this limit value is very industrially significant because it generally causes cost increase.
  • it is preferable to use clean pellet storage bags for example, Elcon clean inner bags manufactured by Showa Pax Co., Ltd.).
  • the third invention of the present invention is a molded article application invention using the molding polycarbonate resin having a low impurity content of the above [1], and is used for storing silicon wafers and hard disks. It can be suitably used for a carrier.
  • a typical silicon wafer storage and transport tool for these semiconductor products usually has a structure in which 1 to 25 wafers each having a diameter of 150 to 30 Omm are arranged and stored with a gap therebetween.
  • test methods used in the examples are as follows.
  • the obtained pellet is placed on a hard disk and left at 60 ° C and 80% RH (room temperature and humidity) for 96 hours. Check the corners and corrosion status visually.
  • Example 1 in addition to the raw material polycarbonate, 3 kg of pure water was added immediately before the second vent of the extruder, and the cylinder temperature was 280 ° C, the extrusion speed was 250 kg hours, and water and polycarbonate were used. A pellet was prepared and evaluated in the same manner except that the contact time with the net was 2.0 seconds, and kneading and extrusion were performed while removing gas. The evaluation results are shown in Tables 1, 2 and 3.
  • Example 2 The pellet sample prepared in Example 2 was again applied to a kneader under the same conditions to prepare a pellet, and thereafter, the same evaluation was performed. Table 1 shows the evaluation results. The results are shown in Tables 2 and 3.
  • Example 1 a twin-screw extruder with a triple vent was replaced with a single-screw extruder with a single vent (TMG65, Nippon Placon Co., Ltd.), and a pellet was created in the same manner and evaluated.
  • TMG65 twin-screw extruder with a triple vent
  • TMG65 single-screw extruder with a single vent
  • Example 2 was repeated in the same manner as in Example 2 except that the quality of the strand cooling water was changed as shown in Table 2.
  • the evaluation results are shown in Tables 1, 2 and 3.
  • Example 2 Trif. Twin screw extruder with water + water addition 0.0 3 0
  • Example 3 The sanfu of Example 2. Knead again 0. 0 1 7
  • Example 1 the effect of reducing the amount of volatile matter by the method of the present invention is one digit lower than that of Comparative Example 1 of the conventional example. Compared with Example 1, the effect of adding water was confirmed in Example 2 in which water was added, and in Example 3, the effect of reduction by repetition was confirmed.
  • Polycarbonate resin for molding that does not cause surface contamination etc. of silicon wafers and hard disks, its manufacturing method, and semiconductor products such as silicon wafers and hard disks molded using the molding polycarbonate resin Provide a storage and transportation device for disk products.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Polyesters Or Polycarbonates (AREA)

Abstract

La présente invention concerne une résine de polycarbonate à faible teneur en matières volatiles et en ions chlorés ou sulfatés hydrosolubles. Le procédé d'obtention de cette résine implique d'abord une phase de malaxage et d'extrusion utilisant une extrudeuse à deux vis pourvue d'une mise à l'atmosphère du type à pression réduite. Le procédé implique ensuite l'utilisation d'une eau de refroidissement se caractérisant par une qualité spécifiée pour une phase de refroidissement du ruban d'extrusion obtenu. L'invention concerne également une enceinte ou un support qui est réalisé dans cette résine et qui set destiné à un semi-conducteur ou un disque. L'invention concerne aussi une résine de polycarbonate destinée à un article formé, permettant d'éviter la formation de taches ou analogues sur la surface d'une plaquette de silicium ou d'un disque dur réalisé en cette matière, ainsi que le procédé de production de la résine. L'invention concerne enfin une enceinte ou un support fabriqués dans cette résine de polycarbonate, lesquels enceinte ou support sont destinés à un semi-conducteur (plaquette de silicium) ou un disque dur.
PCT/JP2000/000231 1999-01-21 2000-01-19 Résine de polycarbonate pour article formé, procédé de production thereof et enceinte ou support pour produit semi-conducteur réalisés dans cette résine WO2000043436A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1280099 1999-01-21
JP11/12800 1999-01-21

Publications (1)

Publication Number Publication Date
WO2000043436A1 true WO2000043436A1 (fr) 2000-07-27

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006334895A (ja) * 2005-06-01 2006-12-14 Ueno Technology:Kk 液晶ポリマーペレットまたは液晶ポリマー組成物ペレットの製造方法
WO2009060967A1 (fr) 2007-11-06 2009-05-14 Teijin Chemicals Ltd. Procédé pour produire une pastille de résine de polycarbonate et article moulé
CN104513389A (zh) * 2013-10-01 2015-04-15 三星Sdi株式会社 用于精密构件的容器及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61221225A (ja) * 1985-03-28 1986-10-01 Idemitsu Petrochem Co Ltd 成形用ポリカ−ボネ−ト樹脂の製造方法
DE3734681A1 (de) * 1986-10-14 1988-04-21 Sony Corp Optisches informationsaufzeichnungsmedium
EP0300485A2 (fr) * 1987-07-21 1989-01-25 Mitsubishi Gas Chemical Company, Inc. Procédé de préparation de matériau à mouler en résine de polycarbonate à basse teneur en particules
JPH0959368A (ja) * 1995-08-29 1997-03-04 Teijin Ltd ポリカーボネート樹脂の製造方法
JPH09157375A (ja) * 1995-12-13 1997-06-17 Teijin Ltd ポリカーボネート樹脂の製造方法
EP0870791A2 (fr) * 1997-04-11 1998-10-14 General Electric Company Réduction des impurités ionoques de résine de polycarbonate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61221225A (ja) * 1985-03-28 1986-10-01 Idemitsu Petrochem Co Ltd 成形用ポリカ−ボネ−ト樹脂の製造方法
DE3734681A1 (de) * 1986-10-14 1988-04-21 Sony Corp Optisches informationsaufzeichnungsmedium
EP0300485A2 (fr) * 1987-07-21 1989-01-25 Mitsubishi Gas Chemical Company, Inc. Procédé de préparation de matériau à mouler en résine de polycarbonate à basse teneur en particules
JPH0959368A (ja) * 1995-08-29 1997-03-04 Teijin Ltd ポリカーボネート樹脂の製造方法
JPH09157375A (ja) * 1995-12-13 1997-06-17 Teijin Ltd ポリカーボネート樹脂の製造方法
EP0870791A2 (fr) * 1997-04-11 1998-10-14 General Electric Company Réduction des impurités ionoques de résine de polycarbonate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006334895A (ja) * 2005-06-01 2006-12-14 Ueno Technology:Kk 液晶ポリマーペレットまたは液晶ポリマー組成物ペレットの製造方法
WO2009060967A1 (fr) 2007-11-06 2009-05-14 Teijin Chemicals Ltd. Procédé pour produire une pastille de résine de polycarbonate et article moulé
JP5119263B2 (ja) * 2007-11-06 2013-01-16 帝人化成株式会社 ポリカーボネート樹脂ペレットの製造方法
CN104513389A (zh) * 2013-10-01 2015-04-15 三星Sdi株式会社 用于精密构件的容器及其制备方法

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