WO2000026950A1 - Procede et dispositif pour l'implantation ionique - Google Patents
Procede et dispositif pour l'implantation ionique Download PDFInfo
- Publication number
- WO2000026950A1 WO2000026950A1 PCT/JP1999/006044 JP9906044W WO0026950A1 WO 2000026950 A1 WO2000026950 A1 WO 2000026950A1 JP 9906044 W JP9906044 W JP 9906044W WO 0026950 A1 WO0026950 A1 WO 0026950A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- support wheel
- swing
- ion
- mode
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 20
- 238000005468 ion implantation Methods 0.000 claims description 47
- 238000010884 ion-beam technique Methods 0.000 claims description 38
- 150000002500 ions Chemical class 0.000 claims description 19
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 235000012745 brilliant blue FCF Nutrition 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 70
- 239000004065 semiconductor Substances 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20221—Translation
- H01J2237/20228—Mechanical X-Y scanning
Definitions
- FIG. 2 is a configuration diagram showing a control system for operating the wafer support wheel shown in FIG.
- FIG. 1 is an exploded perspective view showing one embodiment of an ion implantation apparatus according to the present invention.
- the ion implantation apparatus 10 includes an ion beam generating section 12 for generating an ion beam, and an ion beam from the ion beam generating section 12 for processing a silicon wafer W.
- An ion implantation section 14 for irradiating the silicon wafer with the silicon wafer W and a loader section 16 for supplying a silicon wafer W to the ion implantation section 14 are provided.
- the storage unit 42A stores in advance a plurality of control swing speed modes that define a speed change when the swing shaft 26 swings between both end positions.
- the swing speed refers to the speed of the center of rotation of the wafer support wheel 20.
- the control swing speed mode will be described in detail.
- the storage unit 42A and the target value setting unit 42B store the basic oscillation speed mode of one of a plurality of basic oscillation speed modes at the selected switching position.
- Drive control means for rotating the second drive module 36 in accordance with the mode is configured.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99951165A EP1146549A4 (en) | 1998-10-30 | 1999-10-29 | METHOD AND DEVICE FOR ION IMPLANTATION |
US09/830,628 US6617594B1 (en) | 1998-10-30 | 1999-10-29 | Method and device for ion implanting |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10/310665 | 1998-10-30 | ||
JP10310665A JP3064269B2 (ja) | 1998-10-30 | 1998-10-30 | イオン注入装置及びイオン注入方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000026950A1 true WO2000026950A1 (fr) | 2000-05-11 |
Family
ID=18007992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/006044 WO2000026950A1 (fr) | 1998-10-30 | 1999-10-29 | Procede et dispositif pour l'implantation ionique |
Country Status (6)
Country | Link |
---|---|
US (1) | US6617594B1 (ja) |
EP (1) | EP1146549A4 (ja) |
JP (1) | JP3064269B2 (ja) |
KR (1) | KR100393859B1 (ja) |
TW (1) | TW457564B (ja) |
WO (1) | WO2000026950A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100685120B1 (ko) | 2005-12-28 | 2007-02-22 | 동부일렉트로닉스 주식회사 | 이온주입 스캔장치 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4867113B2 (ja) * | 2001-09-11 | 2012-02-01 | ソニー株式会社 | イオン注入方法およびイオン注入装置 |
JP3692999B2 (ja) * | 2001-10-26 | 2005-09-07 | 日新イオン機器株式会社 | イオン注入方法およびその装置 |
KR100699889B1 (ko) | 2005-12-29 | 2007-03-28 | 삼성전자주식회사 | 가변적인 이온주입 조건이 수반되는 반도체 소자의 제조방법 |
CN109256311B (zh) * | 2018-10-12 | 2020-10-16 | 苏州晋宇达实业股份有限公司 | 一种离子注入方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6288249A (ja) * | 1985-10-15 | 1987-04-22 | Nec Corp | イオン注入装置 |
JPH01124655U (ja) * | 1988-02-17 | 1989-08-24 | ||
JPH0291146U (ja) * | 1988-12-29 | 1990-07-19 | ||
JPH03257170A (ja) * | 1990-03-07 | 1991-11-15 | Nec Corp | 粒子線および光線の大面積照射方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5018176A (ja) | 1973-06-20 | 1975-02-26 | ||
JP2507302B2 (ja) * | 1984-09-19 | 1996-06-12 | アプライド マテリアルズ インコーポレーテッド | 半導体ウエハをイオンインプランテ−シヨンする装置及び方法 |
JP2717822B2 (ja) * | 1988-11-21 | 1998-02-25 | 住友イートンノバ株式会社 | イオン注入装置 |
JPH0787083B2 (ja) * | 1989-07-13 | 1995-09-20 | 日新電機株式会社 | イオン注入装置の制御方法 |
US5003183A (en) * | 1989-05-15 | 1991-03-26 | Nissin Electric Company, Limited | Ion implantation apparatus and method of controlling the same |
JPH0754688B2 (ja) * | 1990-04-16 | 1995-06-07 | 日新電機株式会社 | イオン注入装置およびイオン注入方法 |
US5525807A (en) * | 1995-06-02 | 1996-06-11 | Eaton Corporation | Ion implantation device |
JP3003088B2 (ja) * | 1994-06-10 | 2000-01-24 | 住友イートンノバ株式会社 | イオン注入装置 |
JPH08213339A (ja) | 1995-02-02 | 1996-08-20 | Hitachi Ltd | イオン注入方法およびその装置 |
JP3288554B2 (ja) * | 1995-05-29 | 2002-06-04 | 株式会社日立製作所 | イオン注入装置及びイオン注入方法 |
-
1998
- 1998-10-30 JP JP10310665A patent/JP3064269B2/ja not_active Expired - Fee Related
-
1999
- 1999-10-29 KR KR10-2001-7005122A patent/KR100393859B1/ko not_active IP Right Cessation
- 1999-10-29 TW TW088118855A patent/TW457564B/zh not_active IP Right Cessation
- 1999-10-29 EP EP99951165A patent/EP1146549A4/en not_active Withdrawn
- 1999-10-29 US US09/830,628 patent/US6617594B1/en not_active Expired - Lifetime
- 1999-10-29 WO PCT/JP1999/006044 patent/WO2000026950A1/ja not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6288249A (ja) * | 1985-10-15 | 1987-04-22 | Nec Corp | イオン注入装置 |
JPH01124655U (ja) * | 1988-02-17 | 1989-08-24 | ||
JPH0291146U (ja) * | 1988-12-29 | 1990-07-19 | ||
JPH03257170A (ja) * | 1990-03-07 | 1991-11-15 | Nec Corp | 粒子線および光線の大面積照射方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1146549A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100685120B1 (ko) | 2005-12-28 | 2007-02-22 | 동부일렉트로닉스 주식회사 | 이온주입 스캔장치 |
Also Published As
Publication number | Publication date |
---|---|
TW457564B (en) | 2001-10-01 |
KR100393859B1 (ko) | 2003-08-06 |
KR20010080317A (ko) | 2001-08-22 |
EP1146549A1 (en) | 2001-10-17 |
EP1146549A4 (en) | 2007-01-17 |
JP2000138179A (ja) | 2000-05-16 |
JP3064269B2 (ja) | 2000-07-12 |
US6617594B1 (en) | 2003-09-09 |
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