WO2000026440A3 - Kreislaufverfahren zum beizen von kupfer und kupferlegierungen - Google Patents
Kreislaufverfahren zum beizen von kupfer und kupferlegierungen Download PDFInfo
- Publication number
- WO2000026440A3 WO2000026440A3 PCT/DE1999/003474 DE9903474W WO0026440A3 WO 2000026440 A3 WO2000026440 A3 WO 2000026440A3 DE 9903474 W DE9903474 W DE 9903474W WO 0026440 A3 WO0026440 A3 WO 0026440A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper
- pickling
- pickling solution
- alloys
- copper alloys
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/36—Regeneration of waste pickling liquors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19982268T DE19982268D2 (de) | 1998-11-03 | 1999-11-02 | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
AU17704/00A AU1770400A (en) | 1998-11-03 | 1999-11-02 | Circular method for pickling copper and copper alloys |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19850530.2 | 1998-11-03 | ||
DE19850530A DE19850530A1 (de) | 1998-11-03 | 1998-11-03 | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000026440A2 WO2000026440A2 (de) | 2000-05-11 |
WO2000026440A3 true WO2000026440A3 (de) | 2002-10-03 |
Family
ID=7886457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1999/003474 WO2000026440A2 (de) | 1998-11-03 | 1999-11-02 | Kreislaufverfahren zum beizen von kupfer und kupferlegierungen |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1770400A (de) |
DE (2) | DE19850530A1 (de) |
WO (1) | WO2000026440A2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10326767B4 (de) * | 2003-06-13 | 2006-02-02 | Atotech Deutschland Gmbh | Verfahren zur Regenerierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben |
DE102006012296A1 (de) * | 2006-03-15 | 2007-09-20 | Eilenburger Elektrolyse- Und Umwelttechnik Gmbh | Recycling-Ätzverfahren für die Feinstleiterplattentechnik |
DE102009004155A1 (de) * | 2009-01-09 | 2010-07-15 | Eilenburger Elektrolyse- Und Umwelttechnik Gmbh | Verfahren und Vorrichtung zum Regenerieren von Peroxodisulfat-Beizlösungen |
KR20130069419A (ko) * | 2011-12-15 | 2013-06-26 | 미쓰비시 마테리알 가부시키가이샤 | 구리 혹은 구리기 합금 표면의 산화 피막의 제거 방법 및 이 방법을 사용하여 회수한 구리 혹은 구리기 합금 |
WO2013144174A1 (en) * | 2012-03-30 | 2013-10-03 | Akzo Nobel Chemicals International B.V. | Preparation method and station for non-caking agent solutions |
EP3875643A3 (de) * | 2020-03-04 | 2021-12-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Verfahren zur verarbeitung eines ätzabfallmediums aus der leiterplatten- und/oder substratherstellung |
WO2022184688A1 (en) * | 2021-03-02 | 2022-09-09 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | A method of processing an etching waste medium from circuit board and/or substrate manufacture |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2318559A (en) * | 1941-04-30 | 1943-05-04 | Monsanto Chemicals | Material for and process of pickling copper or its alloys |
US3761369A (en) * | 1971-10-18 | 1973-09-25 | Electrodies Inc | Process for the electrolytic reclamation of spent etching fluids |
EP0396984A1 (de) * | 1989-05-12 | 1990-11-14 | International Business Machines Corporation | Regenerierung von verbrauchten Ferrichlorid-Ätzmitteln |
DE4419683A1 (de) * | 1994-06-06 | 1995-12-07 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Bipolare Filterpressenzelle für anodische Oxidationen am Platin |
DE19506832A1 (de) * | 1995-02-28 | 1996-08-29 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
EP0794269A1 (de) * | 1996-03-05 | 1997-09-10 | MEC CO., Ltd. | Zusammensetzung zum Mikroätzen von Kupfer und Kupferlegierungen |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3864227A (en) * | 1973-06-20 | 1975-02-04 | Amax Inc | Method for the electrolytic refining of copper |
DE2850542C2 (de) * | 1978-11-22 | 1982-07-01 | Kernforschungsanlage Jülich GmbH, 5170 Jülich | Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen |
DD211129B1 (de) * | 1982-11-05 | 1986-12-17 | Hermann Matschiner | Kreislaufverfahren zum beizen von kupfer und kupferlegierungen |
DE4137022C2 (de) * | 1991-11-11 | 1993-11-25 | Eilenburger Chemie Werk Gmbh | Verfahren und Vorrichtung zur Regenerierung schwefelsaurer, kupferhaltiger Peroxodisulfat-Beizlösungen |
DE4310365C1 (de) * | 1993-03-30 | 1994-04-21 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zur Aufarbeitung von Ätzbädern |
-
1998
- 1998-11-03 DE DE19850530A patent/DE19850530A1/de not_active Withdrawn
-
1999
- 1999-11-02 WO PCT/DE1999/003474 patent/WO2000026440A2/de active Application Filing
- 1999-11-02 AU AU17704/00A patent/AU1770400A/en not_active Abandoned
- 1999-11-02 DE DE19982268T patent/DE19982268D2/de not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2318559A (en) * | 1941-04-30 | 1943-05-04 | Monsanto Chemicals | Material for and process of pickling copper or its alloys |
US3761369A (en) * | 1971-10-18 | 1973-09-25 | Electrodies Inc | Process for the electrolytic reclamation of spent etching fluids |
EP0396984A1 (de) * | 1989-05-12 | 1990-11-14 | International Business Machines Corporation | Regenerierung von verbrauchten Ferrichlorid-Ätzmitteln |
DE4419683A1 (de) * | 1994-06-06 | 1995-12-07 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Bipolare Filterpressenzelle für anodische Oxidationen am Platin |
DE19506832A1 (de) * | 1995-02-28 | 1996-08-29 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
EP0794269A1 (de) * | 1996-03-05 | 1997-09-10 | MEC CO., Ltd. | Zusammensetzung zum Mikroätzen von Kupfer und Kupferlegierungen |
Non-Patent Citations (1)
Title |
---|
THIELE W: "PEROXODISULFAT-RECYCLING", MO METALLOBERFLACHE,DE,CARL HANSER VERLAG. MUNCHEN, vol. 50, no. 4, 1 April 1996 (1996-04-01), pages 272 - 276, XP000584299, ISSN: 0043-2792 * |
Also Published As
Publication number | Publication date |
---|---|
AU1770400A (en) | 2000-05-22 |
DE19982268D2 (de) | 2001-10-04 |
DE19850530A1 (de) | 2000-05-25 |
WO2000026440A2 (de) | 2000-05-11 |
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