AU1770400A - Circular method for pickling copper and copper alloys - Google Patents
Circular method for pickling copper and copper alloysInfo
- Publication number
- AU1770400A AU1770400A AU17704/00A AU1770400A AU1770400A AU 1770400 A AU1770400 A AU 1770400A AU 17704/00 A AU17704/00 A AU 17704/00A AU 1770400 A AU1770400 A AU 1770400A AU 1770400 A AU1770400 A AU 1770400A
- Authority
- AU
- Australia
- Prior art keywords
- copper
- pickling
- circular method
- alloys
- copper alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/36—Regeneration of waste pickling liquors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19850530 | 1998-11-03 | ||
DE19850530A DE19850530A1 (de) | 1998-11-03 | 1998-11-03 | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
PCT/DE1999/003474 WO2000026440A2 (de) | 1998-11-03 | 1999-11-02 | Kreislaufverfahren zum beizen von kupfer und kupferlegierungen |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1770400A true AU1770400A (en) | 2000-05-22 |
Family
ID=7886457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU17704/00A Abandoned AU1770400A (en) | 1998-11-03 | 1999-11-02 | Circular method for pickling copper and copper alloys |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1770400A (de) |
DE (2) | DE19850530A1 (de) |
WO (1) | WO2000026440A2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10326767B4 (de) * | 2003-06-13 | 2006-02-02 | Atotech Deutschland Gmbh | Verfahren zur Regenerierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben |
DE102006012296A1 (de) * | 2006-03-15 | 2007-09-20 | Eilenburger Elektrolyse- Und Umwelttechnik Gmbh | Recycling-Ätzverfahren für die Feinstleiterplattentechnik |
DE102009004155A1 (de) * | 2009-01-09 | 2010-07-15 | Eilenburger Elektrolyse- Und Umwelttechnik Gmbh | Verfahren und Vorrichtung zum Regenerieren von Peroxodisulfat-Beizlösungen |
KR20130069419A (ko) * | 2011-12-15 | 2013-06-26 | 미쓰비시 마테리알 가부시키가이샤 | 구리 혹은 구리기 합금 표면의 산화 피막의 제거 방법 및 이 방법을 사용하여 회수한 구리 혹은 구리기 합금 |
US9982193B2 (en) * | 2012-03-30 | 2018-05-29 | Akzo Nobel Chemicals International B.V. | Preparation method and station for non-caking agent solutions |
EP3875643A3 (de) * | 2020-03-04 | 2021-12-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Verfahren zur verarbeitung eines ätzabfallmediums aus der leiterplatten- und/oder substratherstellung |
TWI823276B (zh) * | 2021-03-02 | 2023-11-21 | 奧地利商奧特斯奧地利科技與系統技術有限公司 | 一種處理來自電路板和/或基板製造的蝕刻廢棄物介質之方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2318559A (en) * | 1941-04-30 | 1943-05-04 | Monsanto Chemicals | Material for and process of pickling copper or its alloys |
US3761369A (en) * | 1971-10-18 | 1973-09-25 | Electrodies Inc | Process for the electrolytic reclamation of spent etching fluids |
US3864227A (en) * | 1973-06-20 | 1975-02-04 | Amax Inc | Method for the electrolytic refining of copper |
DE2850542C2 (de) * | 1978-11-22 | 1982-07-01 | Kernforschungsanlage Jülich GmbH, 5170 Jülich | Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen |
DD211129B1 (de) * | 1982-11-05 | 1986-12-17 | Hermann Matschiner | Kreislaufverfahren zum beizen von kupfer und kupferlegierungen |
US5035778A (en) * | 1989-05-12 | 1991-07-30 | International Business Machines Corporation | Regeneration of spent ferric chloride etchants |
DE4137022C2 (de) * | 1991-11-11 | 1993-11-25 | Eilenburger Chemie Werk Gmbh | Verfahren und Vorrichtung zur Regenerierung schwefelsaurer, kupferhaltiger Peroxodisulfat-Beizlösungen |
DE4310365C1 (de) * | 1993-03-30 | 1994-04-21 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zur Aufarbeitung von Ätzbädern |
DE4419683C2 (de) * | 1994-06-06 | 2000-05-04 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Bipolare Filterpressenzelle für anodische Oxidationen an Platin |
DE19506832A1 (de) * | 1995-02-28 | 1996-08-29 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
JP3458036B2 (ja) * | 1996-03-05 | 2003-10-20 | メック株式会社 | 銅および銅合金のマイクロエッチング剤 |
-
1998
- 1998-11-03 DE DE19850530A patent/DE19850530A1/de not_active Withdrawn
-
1999
- 1999-11-02 WO PCT/DE1999/003474 patent/WO2000026440A2/de active Application Filing
- 1999-11-02 AU AU17704/00A patent/AU1770400A/en not_active Abandoned
- 1999-11-02 DE DE19982268T patent/DE19982268D2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2000026440A2 (de) | 2000-05-11 |
DE19982268D2 (de) | 2001-10-04 |
DE19850530A1 (de) | 2000-05-25 |
WO2000026440A3 (de) | 2002-10-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |