AU1770400A - Circular method for pickling copper and copper alloys - Google Patents

Circular method for pickling copper and copper alloys

Info

Publication number
AU1770400A
AU1770400A AU17704/00A AU1770400A AU1770400A AU 1770400 A AU1770400 A AU 1770400A AU 17704/00 A AU17704/00 A AU 17704/00A AU 1770400 A AU1770400 A AU 1770400A AU 1770400 A AU1770400 A AU 1770400A
Authority
AU
Australia
Prior art keywords
copper
pickling
circular method
alloys
copper alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU17704/00A
Other languages
English (en)
Inventor
Werner Harnischmacher
Hermann Matschiner
Stefan Priggemeyer
Peter Rohrig
Wolfgang Thiele
Knut Wildner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EILENBURGER ELEKTROLYSE- und UMWELTTECHNIK GmbH
Original Assignee
EILENBURGER ELEKTROLYSE & UMWELTTECHNIK GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EILENBURGER ELEKTROLYSE & UMWELTTECHNIK GmbH filed Critical EILENBURGER ELEKTROLYSE & UMWELTTECHNIK GmbH
Publication of AU1770400A publication Critical patent/AU1770400A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/36—Regeneration of waste pickling liquors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/103—Other heavy metals copper or alloys of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
AU17704/00A 1998-11-03 1999-11-02 Circular method for pickling copper and copper alloys Abandoned AU1770400A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19850530 1998-11-03
DE19850530A DE19850530A1 (de) 1998-11-03 1998-11-03 Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen
PCT/DE1999/003474 WO2000026440A2 (de) 1998-11-03 1999-11-02 Kreislaufverfahren zum beizen von kupfer und kupferlegierungen

Publications (1)

Publication Number Publication Date
AU1770400A true AU1770400A (en) 2000-05-22

Family

ID=7886457

Family Applications (1)

Application Number Title Priority Date Filing Date
AU17704/00A Abandoned AU1770400A (en) 1998-11-03 1999-11-02 Circular method for pickling copper and copper alloys

Country Status (3)

Country Link
AU (1) AU1770400A (de)
DE (2) DE19850530A1 (de)
WO (1) WO2000026440A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10326767B4 (de) * 2003-06-13 2006-02-02 Atotech Deutschland Gmbh Verfahren zur Regenerierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben
DE102006012296A1 (de) * 2006-03-15 2007-09-20 Eilenburger Elektrolyse- Und Umwelttechnik Gmbh Recycling-Ätzverfahren für die Feinstleiterplattentechnik
DE102009004155A1 (de) * 2009-01-09 2010-07-15 Eilenburger Elektrolyse- Und Umwelttechnik Gmbh Verfahren und Vorrichtung zum Regenerieren von Peroxodisulfat-Beizlösungen
KR20130069419A (ko) * 2011-12-15 2013-06-26 미쓰비시 마테리알 가부시키가이샤 구리 혹은 구리기 합금 표면의 산화 피막의 제거 방법 및 이 방법을 사용하여 회수한 구리 혹은 구리기 합금
US9982193B2 (en) * 2012-03-30 2018-05-29 Akzo Nobel Chemicals International B.V. Preparation method and station for non-caking agent solutions
EP3875643A3 (de) * 2020-03-04 2021-12-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Verfahren zur verarbeitung eines ätzabfallmediums aus der leiterplatten- und/oder substratherstellung
TWI823276B (zh) * 2021-03-02 2023-11-21 奧地利商奧特斯奧地利科技與系統技術有限公司 一種處理來自電路板和／或基板製造的蝕刻廢棄物介質之方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2318559A (en) * 1941-04-30 1943-05-04 Monsanto Chemicals Material for and process of pickling copper or its alloys
US3761369A (en) * 1971-10-18 1973-09-25 Electrodies Inc Process for the electrolytic reclamation of spent etching fluids
US3864227A (en) * 1973-06-20 1975-02-04 Amax Inc Method for the electrolytic refining of copper
DE2850542C2 (de) * 1978-11-22 1982-07-01 Kernforschungsanlage Jülich GmbH, 5170 Jülich Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen
DD211129B1 (de) * 1982-11-05 1986-12-17 Hermann Matschiner Kreislaufverfahren zum beizen von kupfer und kupferlegierungen
US5035778A (en) * 1989-05-12 1991-07-30 International Business Machines Corporation Regeneration of spent ferric chloride etchants
DE4137022C2 (de) * 1991-11-11 1993-11-25 Eilenburger Chemie Werk Gmbh Verfahren und Vorrichtung zur Regenerierung schwefelsaurer, kupferhaltiger Peroxodisulfat-Beizlösungen
DE4310365C1 (de) * 1993-03-30 1994-04-21 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Aufarbeitung von Ätzbädern
DE4419683C2 (de) * 1994-06-06 2000-05-04 Eilenburger Elektrolyse & Umwelttechnik Gmbh Bipolare Filterpressenzelle für anodische Oxidationen an Platin
DE19506832A1 (de) * 1995-02-28 1996-08-29 Eilenburger Elektrolyse & Umwelttechnik Gmbh Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen
JP3458036B2 (ja) * 1996-03-05 2003-10-20 メック株式会社 銅および銅合金のマイクロエッチング剤

Also Published As

Publication number Publication date
WO2000026440A2 (de) 2000-05-11
DE19982268D2 (de) 2001-10-04
DE19850530A1 (de) 2000-05-25
WO2000026440A3 (de) 2002-10-03

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase