Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/02—Feeding of components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/02—Feeding of components
  • H05K13/022—Feeding of components with orientation of the elements
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/04—Mounting of components, e.g. of leadless components
  • H05K13/0417—Feeding with belts or tapes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/08—Monitoring manufacture of assemblages
  • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
  • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/08—Monitoring manufacture of assemblages
  • H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability

Definitions

• the invention relates to a method for armament control on automatic placement machines.
• the individual components are removed from a feed device by means of an assembly head and then positioned in a predetermined position on the substrate.
• substrates for example circuit boards or ceramic substrates
• SMD Surface Mounted Device
• a camera takes a picture of the surface of the component to be assembled in the feed device before the placement head exits the feed device takes.
• the term surface also includes connections of the component which can be recognized from above.
• a downstream image evaluation unit compares the image with a previously stored pattern of the component and the component is only fitted if the image matches the pattern. This check is carried out automatically by the camera and the image evaluation unit. It is not dependent on the operator and evaluates the component directly and not an intermediate carrier such as a coil former.
• the position of the component in the feed device can also be determined by comparing the image with the pattern.
• the placement head can already be brought into a favorable position for picking up before the component is picked up.
• This method is also particularly suitable for components that are located in pockets that are too large, so that their position is initially only vaguely known.
• the stored pattern contains lettering such as company names, company logos or type designations, which are identified with the help of the image evaluation unit on the image of the component for armament control.
• coded identifiers bar codes, matrix codes
• markings function or position markings
• connection which can be recognized from above, these are also included in the pattern in accordance with claim 6 in order to identify the correct armor or the correct position of the components with the aid of them.
• the placement head mounted on the camera, which is used in addition for the detection of He ⁇ substrate marks for position detection of the substrate.
• FIG. 1 shows a schematic top view of an automatic placement machine with feeding devices and FIG. 2 shows a schematic top view of a component.
• FIG. 1 shows an automatic placement machine 1 for loading a substrate 2 (for example a printed circuit board or a ceramic substrate).
• a substrate 2 for example a printed circuit board or a ceramic substrate.
• the components 3 are removed from a feed device 5 with the aid of an assembly head 4.
• the placement head 4 is moved over the substrate 2 with the aid of an x-y portal system 6, 7.
• a control device 8 ensures that the component 3 is placed on a predetermined position on the substrate 2.
• the placement head 4 has, for example, suction pipettes, not shown, which suck the component 3 under vacuum and release it when it is set down.
• a transport system 9 is shown, on which the substrate 2 is transported through the automatic placement machine and to further, not shown, automatic processing machines (for example for loading further components).
• the feed devices 5 are shown as belts which have pockets in which the component 3 is transported and provided. However, other feed units such as flat magazines are also known for which the method according to the invention can also be used.
• a comb arranged on the placement head 4 is ra 11 is provided, which takes within its field of view 12 is an illustration of the device 3 in the feeding device 5 on ⁇ .
• An image evaluation unit (not shown) connected downstream of the camera 11, which, for example, can be assigned to the camera 11 or integrated in the control device 8, evaluates the image. For this purpose, the image is compared with a pattern of the component 3 which was previously stored in the image evaluation unit and which describes certain characteristics of the component 3.
• FIG. 2 further features of the surface 14 of the component 3.
• These features may include: lettering such as company names or company logos 15, type designations 16 of the component 3, coded identifiers 17, such as barcodes or matrix codes, or other markings 18 applied, for example, by means of a laser description.
• the position of the connections 13 on the component 3 can, as far as can be seen from above, be stored in the pattern and used for evaluation.
• the position of the component 3 in the feed device 5 can also be seen if, for example, an angle between the image of the lettering 15 and the pattern of the lettering 15 is recognized.
• This position in particular the rotational position, can then already be taken into account by the placement head 4 before the component 3 is picked up, so that the component moves to the pick-up position safely.
• Cameras 11, which are attached to the placement head 4 and additionally have substrate marking markers, are particularly suitable for the method.
• the method according to the invention thereby ensures automatic armament control on automatic placement machines 1, which is suitable for different supply devices 5.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Operations Research (AREA)
• Supply And Installment Of Electrical Components (AREA)
• Manipulator (AREA)
• Automatic Assembly (AREA)
• Telephone Function (AREA)

Priority Applications (5)

Applications Claiming Priority (2)

Publications (1)

Family

ID=7882660

Family Applications (1)

Country Status (8)

Cited By (4)

Families Citing this family (58)

Citations (2)

Family Cites Families (10)

• 1999
  • 1999-05-03 US US09/303,642 patent/US6801652B1/en not_active Expired - Fee Related
  • 1999-09-02 CN CNB998115525A patent/CN1206900C/zh not_active Expired - Lifetime
  • 1999-09-02 KR KR1020017003974A patent/KR20010075434A/ko active Search and Examination
  • 1999-09-02 EP EP99953699A patent/EP1118258B1/de not_active Expired - Lifetime
  • 1999-09-02 DE DE59904479T patent/DE59904479D1/de not_active Expired - Lifetime
  • 1999-09-02 JP JP2000573144A patent/JP2003504833A/ja active Pending
  • 1999-09-02 WO PCT/DE1999/002786 patent/WO2000019794A1/de not_active Application Discontinuation
  • 1999-09-02 AT AT99953699T patent/ATE233987T1/de not_active IP Right Cessation

Patent Citations (2)

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