WO2000013841A1 - Dispositif permettant d'evacuer la matiere enlevee d'une surface a usiner par une source de rayonnement laser lors d'un usinage - Google Patents

Dispositif permettant d'evacuer la matiere enlevee d'une surface a usiner par une source de rayonnement laser lors d'un usinage Download PDF

Info

Publication number
WO2000013841A1
WO2000013841A1 PCT/DE1999/002451 DE9902451W WO0013841A1 WO 2000013841 A1 WO2000013841 A1 WO 2000013841A1 DE 9902451 W DE9902451 W DE 9902451W WO 0013841 A1 WO0013841 A1 WO 0013841A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser radiation
radiation source
opening
source according
bores
Prior art date
Application number
PCT/DE1999/002451
Other languages
German (de)
English (en)
Inventor
Heinrich Jürgensen
Original Assignee
Heidelberger Druckmaschinen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heidelberger Druckmaschinen Ag filed Critical Heidelberger Druckmaschinen Ag
Publication of WO2000013841A1 publication Critical patent/WO2000013841A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle

Definitions

  • the invention relates to an arrangement for removing material that is removed from a processing surface by a laser radiation source during material processing.
  • the material particles and gases which arise during the machining process on the machining surface are to be removed quickly and made harmless from the area of the laser radiation and from the machining surface.
  • GM describes such a laser radiation source for material processing.
  • offset printing plates can be imaged with this.
  • offset plates are made of aluminum with a roughened surface that is water-bearing in printing.
  • the offset plate is covered with an ink-carrying cover layer, which is removed in the course of the imaging at the points where no ink is to be transferred to the printing material.
  • One way of imaging is to remove the top layer by burning it away with laser beams.
  • the offset plate is clamped onto a drum, which is set in rotation and on which a modulatable laser radiation source is guided by means of a carriage.
  • the aim of the invention is to provide a laser radiation source, which can produce one or more machining tracks on the machining surface, in the vicinity of the machining spot with a device with the aid of which the material particles and gases which arise on the machining surface during the machining process can be moved quickly out of the area the laser radiation and from the processing surface and made harmless.
  • Fig. 1 is a laser gun belonging to a laser radiation source with an arrangement for removing the material released during the machining process and
  • FIG. 2 shows an embodiment of an arrangement for removing the material released during the machining process.
  • the laser cannon 23 shown in FIG. 1 serves to focus the laser radiation onto a processing surface 81.
  • the disruptive material particles and gases described above arise during processing.
  • an arrangement 82 is provided between the processing surface 81 and the radiation exit from the laser cannon 23, which is shown enlarged in FIG. 2.
  • Such a laser cannon is, as already mentioned at the outset, in the German patent application which runs in parallel and is filed simultaneously with the present application: "Process and arrangement for material processing by means of laser beams", sign of the applicant 98/1035, and in the parallel which runs simultaneously with the German utility model application submitted to this application: "Laser radiation source of high power density and high energy for material processing", sign of the applicant 98/1036 GM, described in detail, so that a detailed description of such a laser cannon can be dispensed with here.
  • FIG. 2 shows the mouthpiece 82 according to the invention in connection with the radiation exit of the laser radiation source.
  • Fig. 2 shows enlarged the mouthpiece 82, the main task of which is to avoid contamination of the objective lens 112 or at least delay it and to ensure by directional flow that as far as possible no clouds of gases and in the optical beam path between the objective lens 112 and the processing surface 81 / or form removed material that absorb part of the laser energy, settle on the processing surface and thus negatively affect the work result.
  • Mouthpiece 82 is preferably attached to the laser cannon with easily detachable connections 204 so that it can be easily removed and cleaned. that can and also enables simple cleaning and simple replacement of the objective lens, not shown in FIG. 2.
  • a cylindrical base body 205 there are a cylindrical bore 206 for adaptation to the objective lens and a preferably conical bore 207 as a passage for the beam, and a further preferably cylindrical bore, which represents the processing space 211.
  • the distance between the base body 205 and the processing surface 81 should not be too great.
  • a processing spot 24 there are processing points (not shown) for generating the individual processing tracks on the material to be processed.
  • suction channels 213 There are preferably 3 to 6 suction channels 213.
  • the base body there is another preferably circumferential supply air groove 214, which is connected to the processing space 211 via nozzle bores 215 and to the conical bore 207 via smaller bypass bores 216.
  • the base body is surrounded by a gas-tight ring 217, which contains a plurality of suction ports 221 in the region of the groove 212, to which suction hoses are connected, which are guided to a vacuum pump via a suction filter.
  • the ring contains at least one supply air connector 222, via which compressed air filtered by means of a supply air hose is supplied.
  • the supply air quantity can be adjusted so that it is just sufficient to flush the processing space sufficiently and that it generates a small air flow along the conical bore via the bypass bores, which largely prevents particles from penetrating into the conical bore.
  • Supply air hose, valve and filter are not shown in Fig. 2.
  • the nozzle bores 215 are directed onto the machining spot 24 in such a way that the clouds formed during the machining be blown out of gas, solid and molten material quickly out of the beam path so that they absorb as little laser energy as possible and cannot negatively influence the machining result.
  • the supply air can also be used to blow in oxidation-promoting or antioxidant or other gases, which have a positive effect on the machining process.
  • oxidation-promoting or antioxidant or other gases which have a positive effect on the machining process.
  • the filter in the suction line is attached to the mouthpiece so that it is easily accessible and ensures that the vacuum pump is kept clean. It is also possible to mount the filter directly in the suction groove 212.
  • the mouthpiece can be provided with additional bores through which a coolant is pumped, but this is not shown in the figures is.
  • the shape of the mouthpiece can also differ from the shape described and shown.
  • the bores do not have to be cylindrical or conical, as described, they can be varied in shape.
  • the nozzle bores and suction channels can take any shape and can also be arranged asymmetrically.
  • the nozzle bores can be arranged more in the upper part of the figure, while the suction channels are more in the lower part of the figure.
  • the shape of the mouthpiece can also be modified, in particular if the shape of the machining surface and the type of relative movement between the machining surface and the laser radiation source so require.
  • another, e.g. B. rectangular or polygonal shape can be used.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un dispositif permettant d'évacuer la matière qui a été enlevée d'une surface à usiner (81) par une source de rayonnement laser lors d'un usinage. Le dispositif est composé d'un corps cylindrique qui est placé entre la sortie de la source de rayonnement laser et la surface à usiner (81) et qui présente deux faces frontales dont l'une est tournée vers la surface à usiner et l'autre vers la source de rayonnement laser. Le corps cylindrique présente orifice (207) traversant les deux faces frontales et destiné au rayonnement laser, la face frontale au niveau de laquelle le rayonnement laser sort, est amené à proximité de la surface à usiner (81). Le côté du dispositif est doté d'au moins un autre orifice (213) qui se situe à proximité de la face frontale au niveau de laquelle le rayonnement laser sort. Cet orifice traversant (213) atteint l'orifice traversant (207) et est relié à une pompe à vide.
PCT/DE1999/002451 1998-09-08 1999-08-05 Dispositif permettant d'evacuer la matiere enlevee d'une surface a usiner par une source de rayonnement laser lors d'un usinage WO2000013841A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19840934.6 1998-09-08
DE19840934A DE19840934B4 (de) 1998-09-08 1998-09-08 Anordnung zum Entfernen von Material, das durch eine Laserstrahlungsquelle bei der Materialbearbeitung von einer Bearbeitungsfläche abgetragen wird

Publications (1)

Publication Number Publication Date
WO2000013841A1 true WO2000013841A1 (fr) 2000-03-16

Family

ID=7880187

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/002451 WO2000013841A1 (fr) 1998-09-08 1999-08-05 Dispositif permettant d'evacuer la matiere enlevee d'une surface a usiner par une source de rayonnement laser lors d'un usinage

Country Status (2)

Country Link
DE (1) DE19840934B4 (fr)
WO (1) WO2000013841A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1149660A1 (fr) * 2000-04-03 2001-10-31 Rexam Beverage Packaging AB Procédé et dispositif de protection contre la poussière dans une machine d'usinage au laser
DE10310797B4 (de) * 2003-03-12 2005-11-03 Siemens Ag Vorrichtung zur Bearbeitung von Substraten, insbesondere von elektrischen Schaltungssubstraten, mit Laser
JP4993886B2 (ja) * 2005-09-07 2012-08-08 株式会社ディスコ レーザー加工装置
JP4840110B2 (ja) 2006-03-09 2011-12-21 日産自動車株式会社 レーザ溶接装置およびレーザ溶接方法
FR2963749B1 (fr) * 2010-08-10 2013-04-12 Snecma Tete de soudage pour laser yag a double soufflage
CN102581493A (zh) * 2012-02-28 2012-07-18 武汉金运激光股份有限公司 一种带有高度可调式抽风装置的激光切割头
CN106271054A (zh) * 2015-05-30 2017-01-04 中国科学院宁波材料技术与工程研究所 提高扫描振镜系统加工能力的辅助装置及提高方法
CN106271064A (zh) * 2015-05-30 2017-01-04 中国科学院宁波材料技术与工程研究所 提高激光加工能力的辅助装置及提高方法
WO2021004641A1 (fr) * 2019-07-11 2021-01-14 Toyota Motor Europe Appareil et procédé d'élimination de projections pendant la découpe au laser d'électrodes de batterie

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3866398A (en) * 1973-12-20 1975-02-18 Texas Instruments Inc In-situ gas-phase reaction for removal of laser-scribe debris
US4942284A (en) * 1988-02-24 1990-07-17 Lectra Systemes Laser cutting apparatus provided with a gas evacuation device
DE3923829A1 (de) * 1989-07-19 1991-01-31 Fraunhofer Ges Forschung Absauganlage
EP0732169A1 (fr) * 1995-03-16 1996-09-18 HAAS-LASER GmbH Dispositif pour la protection de l'optique de travail d'un appareil d'usinage laser contre les salissures

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027137A (en) * 1975-09-17 1977-05-31 International Business Machines Corporation Laser drilling nozzle

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3866398A (en) * 1973-12-20 1975-02-18 Texas Instruments Inc In-situ gas-phase reaction for removal of laser-scribe debris
US4942284A (en) * 1988-02-24 1990-07-17 Lectra Systemes Laser cutting apparatus provided with a gas evacuation device
DE3923829A1 (de) * 1989-07-19 1991-01-31 Fraunhofer Ges Forschung Absauganlage
EP0732169A1 (fr) * 1995-03-16 1996-09-18 HAAS-LASER GmbH Dispositif pour la protection de l'optique de travail d'un appareil d'usinage laser contre les salissures

Also Published As

Publication number Publication date
DE19840934B4 (de) 2005-03-24
DE19840934A1 (de) 2000-03-09

Similar Documents

Publication Publication Date Title
DE10305258A1 (de) Verfahren und Vorrichtung zum Schutz von optischen Elementen
DE3008176C2 (de) Gravieren von Druckzylindern
DE4418845C5 (de) Verfahren und Vorrichtung zur Materialbearbeitung mit Hilfe eines Laserstrahls
DE102006040784B4 (de) Laserstrahlbearbeitungsmaschine
EP2062679B1 (fr) Tête d'usinage d'une machine d'usinage au laser avec en approvisionnement en gaz et un dispositif de compensation destiné à compenser des forces transmises par le gaz
EP0607506A1 (fr) Procédé et dispositif pour nettoyer des cylindres de machines à imprimer
DE3411126A1 (de) Vorrichtung zur bearbeitung von werkstuecken durch einen energiestrahl hoher leistungsdichte, insbesondere einem laserstrahl eines co(pfeil abwaerts)2(pfeil abwaerts)-lasers
WO2000013841A1 (fr) Dispositif permettant d'evacuer la matiere enlevee d'une surface a usiner par une source de rayonnement laser lors d'un usinage
EP1727674B1 (fr) Systeme d'aspiration pour un dispositif servant a structurer une surface d'une piece a usiner au moyen d'un rayonnement
DE102006047794A1 (de) Laseranordnung zur Bearbeitung der Oberfläche eines Werkstücks
DE60110275T2 (de) Lasermarkierung
EP0671261A1 (fr) Procédé et dispositif de fabrication d'un écran sérigraphique
EP0590164B1 (fr) Procédé et dispositif pour fabriquer des matrices d'impression par stencil
DE112008002165T5 (de) Verfahren und System zur Laserbearbeitung einer Primärfläche eines Werkstücks unter Verwendung einer beispielsweise aus Korund hergestellten Maskenvorrichtung
DE60017700T2 (de) Bildgebungsverfahren
EP0598926B1 (fr) Procédé et appareil pour la fabrication de plaques d'impression flexographiques
DE2726078A1 (de) Verfahren und vorrichtung zum entfernen von schlacke o.dgl. von geschmolzenem metall
DE10141755A1 (de) Trocknungssystem zur Strahlungstrocknung
EP0551834A1 (fr) Dispositif à chambre fermée pour dispositif d'encrage court dans une rotative d'impression
EP4043218A1 (fr) Machine à imprimer dotée d'un dispositif de transport de support à imprimer et d'une caméra
DE10016534C2 (de) Verfahren und Vorrichtung zum Staubschutz in einer Laserbearbeitungsvorrichtung
DE3630127A1 (de) Vorrichtung zum schneiden von werkstuecken mittels eines energiereichen strahles
DE10013454A1 (de) Vorrichtung zum Herstellen einer Druckform
DE60110474T2 (de) Vorrichtung zur Lasermarkierung von Erkennungszeichen auf einer Lichtempfindlichen Bahn
EP1162067B1 (fr) Procédé et dispositif pour enlever une feuille imprimée d'un cylindre

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase