WO1999060272A1 - Dispositif et procede de pompage - Google Patents
Dispositif et procede de pompage Download PDFInfo
- Publication number
- WO1999060272A1 WO1999060272A1 PCT/JP1999/002645 JP9902645W WO9960272A1 WO 1999060272 A1 WO1999060272 A1 WO 1999060272A1 JP 9902645 W JP9902645 W JP 9902645W WO 9960272 A1 WO9960272 A1 WO 9960272A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- vacuum
- vacuum pump
- exhaust
- back pressure
- evacuation
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/02—Surge control
- F04D27/0261—Surge control by varying driving speed
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/06—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means
- F04B37/08—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/06—Control using electricity
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D19/00—Axial-flow pumps
- F04D19/02—Multi-stage pumps
- F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B2203/00—Motor parameters
- F04B2203/02—Motor parameters of rotating electric motors
- F04B2203/0209—Rotational speed
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Definitions
- the present invention relates to an evacuation apparatus and a method for evacuating a vacuum chamber (process chamber) of a semiconductor manufacturing apparatus, for example.
- FIG. 7 shows a vacuum exhaust path for exhausting a vacuum chamber 10 used in a semiconductor manufacturing process such as an etching apparatus or a chemical vapor deposition apparatus (CVD).
- a vacuum pump 14 is for raising the pressure of the process exhaust gas from the vacuum chamber 10 to the atmospheric pressure.
- an oil rotary pump is used, and a dry pump is currently mainly used.
- an ultra-high vacuum pump such as a turbo molecular pump may be further arranged upstream of the vacuum pump. Yes, and if it cannot be released to the atmosphere as it is due to the type of exhaust gas in the process, an exhaust gas treatment device will be installed in the exhaust pipe 16.
- the exhaust pipe 16 is designed to allow a large amount of gas to flow smoothly when the pump is started or introduced into the atmosphere, so that the back pressure of the vacuum pump 14 falls within the allowable range. For example, if 2 0 0 0 LZ min about the exhaust rate, the inner diameter was using of about 4 O mm c
- a vacuum chamber for a semiconductor manufacturing apparatus is arranged in a clean room, and an exhaust pipe may be laid in the clean room over a long distance to an external space. Therefore, if the exhaust pipe is thick, there is a problem that the space occupies a high cost and the arrangement is restricted due to interference with other components. On the other hand, if the exhaust pipe is made narrower, the back pressure of the vacuum pump will increase if a large amount of gas flows when the pump is started or introduced into the atmosphere, and as a result, it will be overloaded and operation will be disabled. There was a certain limit in reducing the diameter. Disclosure of the invention
- the present invention has been made in view of the above-described circumstances, and a vacuum exhaust device capable of performing a stable operation by avoiding an overload operation while saving space by reducing the diameter of an exhaust pipe of an exhaust system. And an exhaust method.
- the invention according to claim 1 includes a vacuum chamber, an exhaust pipe connecting the vacuum chamber to an atmospheric pressure opening, a variable-speed vacuum pump provided in the exhaust pipe, and a variable number of rotations of the vacuum pump.
- a vacuum evacuation device comprising a control unit for controlling.
- a back pressure is detected on the exhaust side of the vacuum pump.
- the invention according to claim 3 is characterized in that the number of revolutions of the vacuum pump is controlled so that the detection output of the back pressure sensor falls within a predetermined target range. is there.
- a booster pump is provided in the exhaust pipe in series with the vacuum pump, and the control unit lacks an exhaust capability of the vacuum pump based on an output of the back pressure sensor. 3.
- control unit controls the rotation speed of the vacuum pump in accordance with a rotation speed change pattern input in advance at the beginning of evacuation.
- the invention according to claim 7 is the vacuum exhaust device according to claim 1, wherein the conductance of the exhaust pipe is set to be smaller than the exhaust capacity of the vacuum pump.
- the space for piping can be reduced and the space such as an expensive clean room can be effectively used.
- c which can facilitate competition for the pipe and the device
- the invention according to claim 8 is an exhaust method for exhausting a vacuum chamber via an exhaust pipe by a vacuum pump having a variable number of revolutions, wherein a back pressure of the vacuum pump is detected, and the back pressure is detected based on the detected value.
- This is an evacuation method characterized by controlling the rotation speed of a vacuum pump.
- a booster pump is installed in series with the vacuum pump, and the control unit lacks an exhaust capability of the vacuum pump based on an output of the back pressure sensor.
- the booster pump is activated at a time.
- the rotation speed of the vacuum pump is controlled in accordance with a rotation speed change pattern input in advance. It is.
- the invention according to claim 11 is an exhaust method in which the vacuum chamber is evacuated by a variable-speed vacuum pump via an exhaust pipe, wherein the initial stage of the exhaust is in accordance with a rotational speed change pattern input in advance. And controlling the number of rotations of the vacuum pump.
- the invention according to claim 12 is characterized in that the rising speed of the rotation speed is set so as to suppress the initial peak of the back pressure caused by the exhaust to a predetermined value or less. This is an evacuation method.
- the invention according to claim 13 is the vacuum evacuation method according to claim 11, wherein the number of revolutions is set to increase stepwise.
- FIG. 1 is a schematic diagram showing an evacuation apparatus according to an embodiment of the present invention.
- FIG. 2 shows an operation method of the vacuum pump according to the first embodiment of the present invention.
- 9 is a graph showing a change over time in the number of revolutions in comparison with a conventional example.
- FIG. 3 is a graph showing the change over time in the back pressure and the rotation speed in the operation method of the vacuum pump according to the second embodiment of the present invention, as compared with a conventional example.
- FIG. 4 is a graph showing changes over time in back pressure and rotation speed in a method of operating a vacuum pump according to a third embodiment of the present invention, as compared with a conventional example.
- FIG. 5 is a view showing a vacuum evacuation apparatus according to another embodiment of the present invention.
- FIG. 6 is a graph showing a temporal change of the back pressure and the number of rotations in the operation method of the vacuum pump according to the embodiment of FIG.
- FIG. 7 is a diagram showing a conventional evacuation device. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 shows a vacuum exhaust system 30 for evacuating a vacuum chamber 10 used in a semiconductor manufacturing process such as an etching apparatus or a chemical vapor deposition apparatus (CVD).
- An exhaust pipe 34 is connected to the suction port 32 a of the vacuum pump 32, and an exhaust pipe 34 b to the discharge port 32 b of the vacuum pump 32.
- the vacuum pump 32 As the vacuum pump 32, a so-called dry pump that does not use a lubricant in a gas passage is used, and a motor 40 for driving the same is, for example, a rotation speed controller 4 using an inverter (frequency conversion circuit). DC motors, especially brushless DC motors, are used.
- the exhaust pipe 34 has a smaller diameter than the conventional exhaust pipe 16 shown in FIG. 7, for example, if the exhaust speed is about 200 LZ min, the inner diameter is 10 mm. Some are used. The inner diameter of the exhaust pipe 34 is determined so that the conductance becomes a predetermined value in consideration of the length of the pipe.
- a back pressure sensor 44 that constantly detects the pressure, that is, the back pressure of the vacuum pump 32, is provided, and an output signal from the back pressure sensor 44 is input to the rotation speed control unit 42 of the motor 40. It has become.
- the back pressure of the vacuum pump 32 is set to a predetermined value P.
- the rotation speed of the vacuum pump 32 is controlled so as to maintain the pressure. That is, when the detection value of the back pressure sensor 44 reaches P + ⁇ , the rotation speed control unit 42 reduces the rotation speed of the motor 40, and increases when the back pressure falls below ⁇ H. . As a result, the back pressure is almost ⁇ , as indicated by the broken line in FIG.
- the operation time is prolonged, but stable operation can be continued. After a predetermined time, the back pressure becomes ⁇ . It falls below and shifts to steady operation.
- the feedback control of the vacuum pump 32 is performed using the back pressure sensor 44.
- sequence control of a simpler configuration is performed will be described with reference to FIG.
- the regular installation of the back pressure sensor 44 in FIG. 1 is unnecessary.
- the time-dependent change in the number of revolutions when the vacuum pump 32 is started is input to the control unit 42 in advance. This is shown in FIG. Speed ⁇ ⁇ . Dashed line L with constant gentle slope reaching. And then the steady speed ⁇ . I try to maintain.
- the set value of the gradient may be selected in accordance with a change in conditions such as the capacity of the vacuum pump 32, the volume of the vacuum chamber 10, the conductance of the exhaust pipe 34, and the like.
- the rotation speed of the motor 40 is linearly increased, but may be increased stepwise as shown in FIG.
- FIG. 5 shows still another embodiment of the present invention.
- a booster pump 50 is installed upstream of a vacuum pump (main pump) 32 in an exhaust path.
- Each of the motors 40 and 46 for driving these pumps 32 and 50 is a brushless DC motor having a rotation speed control unit 42 using an inverter.
- a back-pressure sensor 44 is installed near the discharge port 3 2 b of the exhaust pipe 34 because a small diameter pipe is used for the exhaust pipe 34. The point that the number of rotations is controlled is the same as in the previous embodiment.
- control is performed by setting the target range of the back pressure between the lower limit value and the upper limit value P 2 so that stable exhaust is performed and the motors 40 and 46 are not overloaded. Do.
- Step 1 when starting the evacuation process, a large amount of evacuation is performed and the back pressure tends to rise as described above, so that only the main pump 32 is instructed to operate at the minimum speed and started. Yes (step 1). This allows o The back pressure increases until the back pressure reaches the initial peak value determined by the volume and initial pressure of the vacuum chamber 10 to be evacuated and the exhaust capacity at the minimum rotation speed of the main pump 32 (step 2). Here the back pressure starts to fall. Exhaust at the minimum speed until the back pressure drops below the lower limit P1 (Step 3).
- the rotational speed of the main pump 32 is increased at a predetermined pitch (steps 4 and 4 '), and when the back pressure exceeds the lower limit P! And enters the target range. Then, the main pump 32 is maintained at the rotation speed (steps 5 and 5 '). In this way, when the volume of the vacuum chamber 10 matches the exhaust capacity of the main pump 32, the back pressure is adjusted to around the lower limit value P, while controlling the rotation speed of the main pump 32. As a result, stable operation can be continued.
- the rotation speed of the main pump 32 may be increased. Command does not follow, or the back pressure does not rise. In this case, for example, it is detected that the back pressure is continuously lower than the lower limit value P by a timer or the like, and the booster pump 50 is instructed to operate at the rated speed and started.
- Step 6 As a result, when the exhaust load of the vacuum chamber 10 is relatively large and the exhaust capacity of the main pump 32 and the booster pump 50 is matched, the operation can be stably continued. (Step 7).
- the booster pump 50 performs on-off control in accordance with the back pressure.
- the booster pump 50 also employs a variable speed engine, and controls the back pressure around the lower limit by controlling it in the same manner as the main pump 32. You may drive while driving. Further, an operation may be performed to control the rotation speed of the main pump 32 while operating the booster pump 50 at a rated value. If the minimum rated speed of the main pump 32 is lower, it goes without saying that the initial stage control as shown in FIGS. 2 to 4 may be performed.
- the main pump 32 and the booster pump 50 are simultaneously operated to continue the meaningless exhaust operation.
- the situation can be prevented.
- the back pressure of the pump does not exceed the predetermined value, it is possible to suppress an increase in the pump temperature due to an excessive rise in the back pressure, and to stably operate the pump.
- the back pressure of the vacuum pump is controlled so as not to exceed a certain value, and a booster pump is added. By doing so, it is started and operated only when the exhaust load increases during the operation process, while maintaining energy saving. Stable exhaust operation can be performed. Therefore, even if the diameter of the exhaust pipe is reduced, overload operation can be avoided and stable operation can be achieved.In addition, the exhaust pipe having a diameter smaller than the exhaust capacity can be used. This also makes it possible to make effective use of space such as expensive clean rooms. Industrial applicability
- the present invention is useful as an evacuation apparatus and method for evacuating a vacuum chamber (process chamber) of a processing apparatus such as an etching apparatus and a chemical vapor deposition apparatus (CVD) used in a semiconductor manufacturing process.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Control Of Positive-Displacement Pumps (AREA)
- Drying Of Semiconductors (AREA)
- Non-Positive Displacement Air Blowers (AREA)
- Control Of Positive-Displacement Air Blowers (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99921197A EP1081380A4 (en) | 1998-05-20 | 1999-05-20 | APPARATUS AND METHOD FOR PUMPING |
US09/700,748 US6474949B1 (en) | 1998-05-20 | 1999-05-20 | Evacuating unit with reduced diameter exhaust duct |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10/155381 | 1998-05-20 | ||
JP15538198 | 1998-05-20 | ||
JP26171598A JP3929185B2 (ja) | 1998-05-20 | 1998-09-16 | 真空排気装置及び方法 |
JP10/261715 | 1998-09-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999060272A1 true WO1999060272A1 (fr) | 1999-11-25 |
Family
ID=26483399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/002645 WO1999060272A1 (fr) | 1998-05-20 | 1999-05-20 | Dispositif et procede de pompage |
Country Status (6)
Country | Link |
---|---|
US (1) | US6474949B1 (ja) |
EP (1) | EP1081380A4 (ja) |
JP (1) | JP3929185B2 (ja) |
KR (1) | KR100576761B1 (ja) |
TW (1) | TW483988B (ja) |
WO (1) | WO1999060272A1 (ja) |
Cited By (1)
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US7153362B2 (en) * | 2002-04-30 | 2006-12-26 | Samsung Electronics Co., Ltd. | System and method for real time deposition process control based on resulting product detection |
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US8172546B2 (en) | 1998-11-23 | 2012-05-08 | Entegris, Inc. | System and method for correcting for pressure variations using a motor |
US20040094086A1 (en) * | 2001-03-29 | 2004-05-20 | Keiichi Shimaoka | Production device and production method for silicon-based structure |
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US6739840B2 (en) | 2002-05-22 | 2004-05-25 | Applied Materials Inc | Speed control of variable speed pump |
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KR20030011024A (ko) * | 2002-10-23 | 2003-02-06 | 린영태 | 정압 가변 속력 인버터 제어 부스터 펌프 시스템 |
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GB0229352D0 (en) * | 2002-12-17 | 2003-01-22 | Boc Group Plc | Vacuum pumping arrangement and method of operating same |
FR2854667B1 (fr) * | 2003-05-09 | 2006-07-28 | Cit Alcatel | Controle de pression dans la chambre de procedes par variation de vitesse de pompes, vanne de regulation et injection de gaz neutre |
JP4218756B2 (ja) * | 2003-10-17 | 2009-02-04 | 株式会社荏原製作所 | 真空排気装置 |
US8540493B2 (en) | 2003-12-08 | 2013-09-24 | Sta-Rite Industries, Llc | Pump control system and method |
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US8469675B2 (en) | 2004-08-26 | 2013-06-25 | Pentair Water Pool And Spa, Inc. | Priming protection |
US7845913B2 (en) | 2004-08-26 | 2010-12-07 | Pentair Water Pool And Spa, Inc. | Flow control |
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CN101155992B (zh) | 2004-11-23 | 2013-02-20 | 恩特格里公司 | 用于可变原位置分配系统的系统和方法 |
FR2878913B1 (fr) * | 2004-12-03 | 2007-01-19 | Cit Alcatel | Controle des pressions partielles de gaz pour optimisation de procede |
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US8753097B2 (en) | 2005-11-21 | 2014-06-17 | Entegris, Inc. | Method and system for high viscosity pump |
US8087429B2 (en) | 2005-11-21 | 2012-01-03 | Entegris, Inc. | System and method for a pump with reduced form factor |
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JP5322254B2 (ja) * | 2007-06-29 | 2013-10-23 | 東京エレクトロン株式会社 | 真空処理装置及び真空処理方法並びに記憶媒体 |
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US8436559B2 (en) | 2009-06-09 | 2013-05-07 | Sta-Rite Industries, Llc | System and method for motor drive control pad and drive terminals |
US9556874B2 (en) | 2009-06-09 | 2017-01-31 | Pentair Flow Technologies, Llc | Method of controlling a pump and motor |
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CN102220994A (zh) * | 2011-06-20 | 2011-10-19 | 昆山振昆纳米科技有限公司 | 真空室角阀 |
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1998
- 1998-09-16 JP JP26171598A patent/JP3929185B2/ja not_active Expired - Fee Related
-
1999
- 1999-05-20 US US09/700,748 patent/US6474949B1/en not_active Expired - Fee Related
- 1999-05-20 EP EP99921197A patent/EP1081380A4/en not_active Withdrawn
- 1999-05-20 KR KR1020007012893A patent/KR100576761B1/ko not_active IP Right Cessation
- 1999-05-20 WO PCT/JP1999/002645 patent/WO1999060272A1/ja active IP Right Grant
- 1999-05-20 TW TW088108233A patent/TW483988B/zh not_active IP Right Cessation
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JPH03152350A (ja) * | 1989-11-08 | 1991-06-28 | Hitachi Ltd | 空気調和機 |
JPH05195984A (ja) * | 1992-01-22 | 1993-08-06 | Nec Yamagata Ltd | ターボ型真空ポンプ |
JPH06311778A (ja) * | 1993-04-19 | 1994-11-04 | Toshiba Corp | 冷凍サイクル制御装置 |
JPH08319946A (ja) * | 1995-05-24 | 1996-12-03 | Japan Atom Energy Res Inst | 核融合装置の真空排気システム |
JPH09317641A (ja) * | 1996-05-30 | 1997-12-09 | Daikin Ind Ltd | 真空排気装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US7153362B2 (en) * | 2002-04-30 | 2006-12-26 | Samsung Electronics Co., Ltd. | System and method for real time deposition process control based on resulting product detection |
Also Published As
Publication number | Publication date |
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TW483988B (en) | 2002-04-21 |
EP1081380A1 (en) | 2001-03-07 |
KR20010025035A (ko) | 2001-03-26 |
JP2000038999A (ja) | 2000-02-08 |
EP1081380A4 (en) | 2006-08-02 |
JP3929185B2 (ja) | 2007-06-13 |
KR100576761B1 (ko) | 2006-05-03 |
US6474949B1 (en) | 2002-11-05 |
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