WO1999044402A1 - Procede de depot et appareil afferent - Google Patents

Procede de depot et appareil afferent Download PDF

Info

Publication number
WO1999044402A1
WO1999044402A1 PCT/GB1999/000556 GB9900556W WO9944402A1 WO 1999044402 A1 WO1999044402 A1 WO 1999044402A1 GB 9900556 W GB9900556 W GB 9900556W WO 9944402 A1 WO9944402 A1 WO 9944402A1
Authority
WO
WIPO (PCT)
Prior art keywords
deposition material
substrate
sheet
energy source
roll
Prior art date
Application number
PCT/GB1999/000556
Other languages
English (en)
Inventor
Peter John Wellesley Noble
Original Assignee
Moore, Royston
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moore, Royston filed Critical Moore, Royston
Priority to AU26316/99A priority Critical patent/AU2631699A/en
Publication of WO1999044402A1 publication Critical patent/WO1999044402A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • THIS INVENTION relates to a deposition method and apparatus therefor and more particularly to a method of depositing material on a substrate.
  • the present invention seeks to provide a deposition method and apparatus therefor which does not require the use of masks, screens or stencils and does not use any aspect of metal jetting technology.
  • one aspect of the present invention provides a method of depositing a deposition material on a substrate comprising the steps of : overlaying a sheet of said deposition material over the substrate; directing a concentrated energy source having a spot area onto a pre-selected area of the 2 sheet to deposit a pre-selected area of the deposition material from the sheet onto the substrate; and removing the remainder of the sheet.
  • Another aspect of the present invention provides an apparatus for moving the sheet of deposition material into contact with the substrate and moving the substrate at the same speed as the sheet past the concentrated energy source such that there is no relative movement between the substrate and the deposition material as the substrate and deposition material pass the concentrated energy source.
  • FIGURE 1 is a schematic side view of an apparatus embodying the present invention.
  • FIGURE 2 is a cross-section of a length of deposition material fixed to a carrier film for use with an embodiment of the present invention.
  • a deposition apparatus embodying the present invention comprises deposition means to deposit deposition material onto a substrate and a feeder (not shown) for carrying a substrate 1 such as an electrical or electronic circuit board into proximity with the deposition means.
  • the feeder is preferably a conveyor having a number of jigs or fastening means to which each substrate may be attached.
  • the conveyor is driven at a substantially constant speed.
  • a train of substrates secured to the conveyor move at a constant speed past the deposition means.
  • the deposition apparatus comprises two spaced apart rollers 2,3.
  • the first roller 2 is a source roller 2 and carries a rolled length 3 of the material to be deposited on the substrate.
  • the deposition material 4 to be deposited on the substrate 1 is held on a substantially transparent carrier film 5 either by its own adhesion or by an adhesive applied to the carrier film 5 or the deposition material to adhere the deposition material 4 to the carrier material 5.
  • the deposition material 4 is a solder, paste, adhesive, powder or whatever other material is required to be deposited on the substrate 1.
  • the deposition material is held together on the carrier by a binding agent such as a solder flux, paste or other material which forms a binding agent.
  • a binding agent such as a solder flux, paste or other material which forms a binding agent.
  • the deposition material 4 could comprise solder balls or powder held in place by the solder flux and a binding agent.
  • the deposition material 4 is adhered to the carrier film 5 by the adhesive as a uniform layer of constant thickness across the width of the carrier film 5.
  • the carrier film 5 has a thickness of the order of 10 to 50 microns and the deposition material 4 has a thickness of the order of 20 to 100 microns.
  • the film 3 is fed from the source roller 2 toward the feeder carrying the substrates 1 and around a first pressure roller 6 which, in use, is held against the substrate 1, the film 3 being sandwiched between the pressure roller 6 and the substrate 1 with the deposition material 4 contacting the substrate 1 and the carrier film 5 contacting the pressure roller 6.
  • a second pressure roller 7 is spaced apart from the first pressure roller 6 by a predetermined distance and the film 3 is fed from the first pressure roller 6 across the predetermined distance in contact with the substrate 1 and around the second pressure roller 7 which also pushes the film 3 against the substrate 1 4 such that the deposition material 4 makes contact with the substrate 1 and the carrier film 5 makes contact with the second pressure roller 7.
  • the film 3 is then fed from the second pressure roller 7 to a take-up roller 8 so that the film 3 which has passed from the source roller 2, under the first and second pressure rollers 6, 7 is stored on the take-up roller 8.
  • the source roller 2 and the take-up roller 8 are driven such that the speed of the film 3 between the first and second pressure rollers 6, 7 is synchronised to the speed of the substrate 1 passing under the first and second pressure rollers 6, 7 so that there is substantially no relative movement between the substrate 1 and the film 3 over the predetermined distance between the first and second pressure rollers 6, 7 when the deposition material 4 is in contact with the substrate 1.
  • a laser 9 or other concentrated energy source is located above the film 3 such that the laser beam of the laser 9 is focused by a focusing lens 10 located between the laser 9 and the film 3 onto the film 3 between the first and second pressure rollers 6, 7.
  • the area of the film 5 illuminated by the laser 9 is known as the spot area.
  • the focusing lens 10 is controllable so as to direct the focused laser beam 11 on any point along the width of the film 3.
  • the laser 9 can be switched rapidly on or off or the beam 11 can be directed away from the film 3 to control which areas of the film 3 are illuminated by the laser beam 11.
  • 5 In operation- substrates 1 are delivered to the deposition apparatus by the feeder at a predetermined speed.
  • the film 3 is travelling at the same predetermined speed as the substrates 1 between the two pressure rollers 6, 7 so that over the distance between the two pressure rollers 6, 7 there is no relative movement between the film 3 and the substrate 1. Over the distance between the two pressure rollers 6, 7, the deposition material 4 on the film 3 is in contact with or in close proximity to the substrate 1.
  • a microprocessor or the like is operable to control the focusing lens 10 and the laser 9 such that the laser beam 11 can scan across the width of the film
  • the laser beam 11 melts, for example, the solder flux of the deposition material 4 such that the solder flux adheres to the substrate 1 thereby transferring the deposition material 4 to the substrate 1.
  • the deposition material 4 on the film 3 is removed from the film 5 and deposited onto the substrate 1.
  • the energy of the laser beam is controlled such that the removal of the deposition material from the carrier film 5 is by melting the adhesive and at least a part of the deposition material 4 such that the deposition material 4 attaches to the carrier film 5.
  • the step of melting the deposition material 4 6 releases the deposition material from the carrier film 5 and attaches the deposition material 4 to the substrate 1.
  • the combination of the movement of the substrate 1 under the laser beam 11 and the ability of the laser beam 11 to scan across the width of the substrate 1 allows the laser beam 11 to be directed to and therefore remove the deposition material 4 from any point of the film 3 in contact with the substrate 1.
  • This arrangement provides a particularly easily controllable method of depositing deposition material 4 from the film 3 onto the substrate 1 at preselected areas such as where solder pads, adhesive pads and any other structures to be deposited on the substrate 1 are required.
  • Examples of the deposition material 4 are the solder pastes used in surface mount technology, solder bumps used in silicon wafer bumping, conductive adhesives used in surface mount technology and pastes and inks used in hybrid assembly and similar applications.
  • the carrier film 5 is transparent such that little or no energy from the laser beam 11 is absorbed by the carrier film 5.
  • the deposition material 4 is substantially opaque and thus absorbs the laser energy. The laser energy melts the deposition material 4 which, in contact with the substrate 1, is transferred to the substrate 1, thereby removing the deposition material 4 from the carrier film 5.
  • the constant feeding of substrate 1 under the film 3 provides a deposition method which can be readily integrated into production lines. Additionally, the method and system of the invention do not require the use of masks or stencils of the like which require troublesome registration with the substrate 1 to ensure accurate positioning of the deposition material 4 on the substrate 1.
  • the pattern to be deposited may be derived from assembly data and delivered to the apparatus by electronic means or may be derived by using an optical scanner to create the data from the original substrate at an earlier point in the process.
  • the used film 3 running off from the second pressure roller 7 and onto the take-up roller 8 can be recycled for future use as it is quite clear that, in most applications, not all of the deposition material 4 carried on the film 3 will actually be deposited on the substrate 1. Only those pre-selected areas of deposition material 4 will be deposited.
  • Another option is to provide a continuous supply of film 3 in a never-ending loop such that used film 3 is passed under a deposition material applicator which fills areas where the deposition material has been removed with fresh deposition material so that the renewed film 3 can be fed around the source roller 2 and back under the first pressure roller 6.
  • the entire system of film control including driving the source roller 2, take-up roller 8, the pressure roller 6, 7 and the control of the pressures which the pressure rollers 6, 7 apply to the substrate 1 may be included in a single control unit such that the entire deposition apparatus can be manufactured and produced as a stand alone and replaceable unit.
  • the film 3 is provided as discrete sheets which can be manually or otherwise located over a substrate 1 such that the deposition material 4 is in contact with the substrate 1.
  • the laser beam 11 can then be directed over pre-selected areas 5 of the film 3 so as to deposit the deposition material on the substrate 1 in the pre-selected areas.
  • Such an embodiment requires the laser beam 11 to be controllable in two axes rather than just one since there is no relative movement of the substrate 1 with respect to the laser 9. It is, however, envisaged that a movable jig may be provided upon which the substrate 1 can be placed.
  • the laser beam 11 remains stationary and the movable jig controls movement of the substrate 1 in the two axes necessary to allow the laser beam to cover the entire area of the film 3 above the substrate 1.
  • the laser 9 could be replaced with some other form of energy means, such as a heat source, which is focused enough to position accurately the spot area on the film so that only the area of the carrier illuminated (or heated) by the spot area is deposited on the substrate 1.
  • some other form of energy means such as a heat source
  • the deposition material 4 may comprise a powder in micro-capsule form which, upon heating, deposits the contents of the capsules onto the substrate.
  • position or negative air pressure can be used to enhance the contact between the substrate 1 and the film 5 over the contact region between the pressure rollers 6, 7.

Abstract

L'invention concerne un procédé de dépôt d'une matière de dépôt (4) sur un substrat (1), le procédé consistant: à recouvrir le substrat (1) d'une feuille (3), comprenant un film de support (5), de cette matière de dépôt (4); à orienter une source d'énergie (11) comportant une zone lumineuse sur une zone présélectionnée de la feuille (3) pour déposer la zone présélectionnée de la matière de dépôt (4) de la feuille (3) sur le substrat (1); puis à retirer le reste de la feuille (3).
PCT/GB1999/000556 1998-02-25 1999-02-24 Procede de depot et appareil afferent WO1999044402A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU26316/99A AU2631699A (en) 1998-02-25 1999-02-24 A deposition method and apparatus therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9803972.0A GB9803972D0 (en) 1998-02-25 1998-02-25 A deposition method and apparatus therefor
GB9803972.0 1998-02-25

Publications (1)

Publication Number Publication Date
WO1999044402A1 true WO1999044402A1 (fr) 1999-09-02

Family

ID=10827577

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1999/000556 WO1999044402A1 (fr) 1998-02-25 1999-02-24 Procede de depot et appareil afferent

Country Status (3)

Country Link
AU (1) AU2631699A (fr)
GB (1) GB9803972D0 (fr)
WO (1) WO1999044402A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008080893A1 (fr) * 2007-01-05 2008-07-10 Basf Se Procédé de fabrication de surfaces électriquement conductrices
WO2009153192A2 (fr) * 2008-06-18 2009-12-23 Basf Se Procédé de fabrication d'électrodes pour cellules solaires
WO2010127764A2 (fr) * 2009-05-05 2010-11-11 Universitaet Stuttgart Procédé de mise en contact d'un substrat semi-conducteur

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495232A (en) * 1981-04-22 1985-01-22 Irion & Vosseler Gmbh & Co. & Zahlerfabrik Stamping foils and methods
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
EP0316886A2 (fr) * 1987-11-16 1989-05-24 Fuji Kagakushi Kogyo Co., Ltd. Procédé de fabrication d'un circuit imprimé
EP0392151A2 (fr) * 1989-03-13 1990-10-17 Haller, Andreas Feuille d'estampage pour l'application de trajets conducteurs sur des supports rigides ou plastiques
US4970196A (en) * 1987-01-15 1990-11-13 The Johns Hopkins University Method and apparatus for the thin film deposition of materials with a high power pulsed laser
JPH02291194A (ja) * 1989-04-28 1990-11-30 Nec Corp 印刷配線パターンの製造方法
JPH035095A (ja) * 1989-06-02 1991-01-10 Matsushita Electric Works Ltd シート状半田及びその使用方法
JPH09172246A (ja) * 1995-12-19 1997-06-30 Ricoh Elemex Corp 熱転写リボンの再生方法
JPH1027521A (ja) * 1996-07-11 1998-01-27 Sumitomo Bakelite Co Ltd 導電性転写フィルム

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495232A (en) * 1981-04-22 1985-01-22 Irion & Vosseler Gmbh & Co. & Zahlerfabrik Stamping foils and methods
US4970196A (en) * 1987-01-15 1990-11-13 The Johns Hopkins University Method and apparatus for the thin film deposition of materials with a high power pulsed laser
EP0316886A2 (fr) * 1987-11-16 1989-05-24 Fuji Kagakushi Kogyo Co., Ltd. Procédé de fabrication d'un circuit imprimé
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
EP0392151A2 (fr) * 1989-03-13 1990-10-17 Haller, Andreas Feuille d'estampage pour l'application de trajets conducteurs sur des supports rigides ou plastiques
JPH02291194A (ja) * 1989-04-28 1990-11-30 Nec Corp 印刷配線パターンの製造方法
JPH035095A (ja) * 1989-06-02 1991-01-10 Matsushita Electric Works Ltd シート状半田及びその使用方法
JPH09172246A (ja) * 1995-12-19 1997-06-30 Ricoh Elemex Corp 熱転写リボンの再生方法
JPH1027521A (ja) * 1996-07-11 1998-01-27 Sumitomo Bakelite Co Ltd 導電性転写フィルム

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 15, no. 109 (M - 1093) 15 March 1991 (1991-03-15) *
PATENT ABSTRACTS OF JAPAN vol. 15, no. 70 (E - 1035) 19 February 1991 (1991-02-19) *
PATENT ABSTRACTS OF JAPAN vol. 97, no. 10 31 October 1997 (1997-10-31) *
PATENT ABSTRACTS OF JAPAN vol. 98, no. 5 30 April 1998 (1998-04-30) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008080893A1 (fr) * 2007-01-05 2008-07-10 Basf Se Procédé de fabrication de surfaces électriquement conductrices
WO2009153192A2 (fr) * 2008-06-18 2009-12-23 Basf Se Procédé de fabrication d'électrodes pour cellules solaires
WO2009153192A3 (fr) * 2008-06-18 2010-11-25 Basf Se Procédé de fabrication d'électrodes pour cellules solaires
US8247320B2 (en) 2008-06-18 2012-08-21 Basf Se Process for producing electrodes for solar cells
WO2010127764A2 (fr) * 2009-05-05 2010-11-11 Universitaet Stuttgart Procédé de mise en contact d'un substrat semi-conducteur
WO2010127764A3 (fr) * 2009-05-05 2011-04-21 Universitaet Stuttgart Procédé de mise en contact d'un substrat semi-conducteur

Also Published As

Publication number Publication date
AU2631699A (en) 1999-09-15
GB9803972D0 (en) 1998-04-22

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