WO1999040769A1 - Boitier - Google Patents

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Info

Publication number
WO1999040769A1
WO1999040769A1 PCT/DE1998/003167 DE9803167W WO9940769A1 WO 1999040769 A1 WO1999040769 A1 WO 1999040769A1 DE 9803167 W DE9803167 W DE 9803167W WO 9940769 A1 WO9940769 A1 WO 9940769A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
housing part
sealing profile
sealing
collecting area
Prior art date
Application number
PCT/DE1998/003167
Other languages
German (de)
English (en)
Inventor
Helmut Kahl
Bernd Tiburtius
Original Assignee
Helmut Kahl
Bernd Tiburtius
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US09/582,810 priority Critical patent/US6547252B1/en
Application filed by Helmut Kahl, Bernd Tiburtius filed Critical Helmut Kahl
Priority to HU0004680A priority patent/HUP0004680A3/hu
Priority to JP2000531047A priority patent/JP2002503043A/ja
Priority to AU17484/99A priority patent/AU734963B2/en
Priority to AT98962191T priority patent/ATE212177T1/de
Priority to DE59802680T priority patent/DE59802680D1/de
Priority to DE19882208T priority patent/DE19882208D2/de
Priority to EP98962191A priority patent/EP1055356B1/fr
Priority to KR1020007007080A priority patent/KR20010033570A/ko
Priority to DK98962191T priority patent/DK1055356T3/da
Priority to CA002304943A priority patent/CA2304943A1/fr
Publication of WO1999040769A1 publication Critical patent/WO1999040769A1/fr
Priority to NO20003998A priority patent/NO20003998L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/245—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with means for shaping the antenna pattern, e.g. in order to protect user against rf exposure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H04B1/3833—Hand-held transceivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B2001/3894—Waterproofing of transmission device

Definitions

  • the invention relates to a housing according to the preamble of claim 1.
  • Such a housing is known from DE 43 19 965 C2.
  • housings of this type have been primarily made of plastic for cost and weight reasons since the spread of mobile phones or cordless phones began.
  • the prefabricated, in particular injection molded, housing parts are coated with a conductive material in order to achieve an electromagnetic shielding effect, for example by spraying on conductive lacquer, vapor deposition with aluminum or electroplating.
  • a shield which also acts as a shield, is dispensed, and after the electronic function groups have been inserted, the housing parts are connected to one another, usually screwed together.
  • the shielding seal consists of an electrically conductive and elastic material and must be designed in its geometric dimensions and mechanical properties so that it adapts to surface tolerances and unevenness, so that even with the tolerances given in large-scale production, a very high quality of the shielding of the interior of the housing is guaranteed.
  • vanic, mechanically applied or sprayed-on coatings or other influences, such as pressure, radiation, heat, chemical solvents or wetting agents etc.
  • the production of the sealing profiles with a defined height with a relatively low tolerance becomes more critical the more miniaturized the system is. Achieving sufficient adhesion (shear strength) is becoming increasingly difficult in view of the addition of tolerances and interference in miniaturized systems.
  • the dispensing outlet member e.g. a hollow needle
  • the distance changes by 16% per 0.1 mm dimensional deviation of the housing part.
  • more dispensing material would have to be dispensed onto the surface in order to achieve a constant height of the housing part sealing profile subsystem.
  • the state of the art is therefore to operate the systems with a surplus of material, a surplus of material being set in particular at the start, end or connection or branching points.
  • Sealing profiles often have to be reworked in a labor-intensive and therefore costly manner.
  • the invention is therefore based on the object of specifying a housing of the type mentioned which can be manufactured more easily and cost-effectively if the tolerance requirements customary in large series are met.
  • the invention includes the technical teaching of providing a collecting area for a safety excess of the sealing material on the housing as an integrated component of the sealing system. This enables an increase in the permissible tolerances of the housing parts as well as the control of the dispensing heads and / or the elimination of any rework on the hardened sealing profile.
  • the invention provides particular cost advantages if the first and / or second housing part is a cast or injection-molded part, in particular made of plastic, with the usual large tolerances for these - especially if the recess in the first housing part serving as a catchment area is immediately cast or Injection molding is formed.
  • this catchment area can be arranged laterally offset both in alignment with the longitudinal extent of the sealing profile and in relation to it. It can be open on the side or closed all around (e.g. an open or closed hole).
  • the seal "caterpillar” preferably runs in certain applications and - 5 -
  • a bevel or edge is provided on the recess in order to achieve an improved engagement of the sealant strand with the recess during the application (possibly a kind of snagging) and to counteract any “slipping” of the starting point, which is the case with certain housings - Seal-material pairings or when the surface is contaminated.
  • the recess can be formed continuously with an opening provided for receiving a connecting means for connecting the first and second housing parts. This configuration can also be used advantageously for additional sealing in these areas.
  • the recess is arranged directly adjacent to an incompressible spacer protruding from the surface of the first housing part toward the second housing part. This is expediently formed from the housing material during the primary shaping of the housing part.
  • the currently most important practical version is the one with an EMI shielding and sealing profile, which has an electrically conductive sealant, and with housing parts made of plastic with an essentially full-surface conductive coating of the surface in contact with the sealing profile.
  • the invention is not restricted to such shielding housings, - 6 -
  • FIG. 1 shows a basic illustration for carrying out the invention
  • FIG. 1 a shows a detail from FIG. 1,
  • FIGS. 2a to 2f are schematic representations of different examples of housing sections with recesses in longitudinal section or in plan view
  • FIGS. 3a to 3i are schematic representations of three further embodiments, each in a top view and a cross-sectional representation of one
  • FIGS 4a and 4b are schematic representations of two further embodiments of the invention.
  • FIG. 1 schematically shows a lower housing part 1 and an upper housing part 2 of an obile telephone housing 3 made of injection-molded plastic, both of which are provided with an inner metallization layer 1a or 2a.
  • Screw holes 1b and 2b are formed in both housing parts 1, 2, the screw holes 1b being formed in the lower housing part for the partially self-tapping screwing in of self-tapping screws 4. - 7 -
  • the figure shows how an arm 5 of a coordinate-controlled handling device (not shown overall) guides an application needle 6 with a hose connection 6a for supplying a pressurized conductive seal starting material 7 in the direction of arrow A over the edge section of the lower housing part 1.
  • a strand of sealing and shielding material 8 is dispensed onto the edge section and adheres firmly there during hardening.
  • the upper part 2 is placed on the lower part 1, as symbolized by the arrow B, and screwed to the lower part 1, the strand solidified to form the sealing and shielding profile 8 adhering to Upper part 2 is elastically deformed and reliably seals the gap between the housing parts 1, 2 and shields it electromagnetically.
  • a recess 9 in the form of an elongated hole is incorporated, which can be seen more clearly in the enlarged representation of section A in FIG.
  • the elongated hole 9 defines the starting point and at the same time the end point when the shielding profile 8 is applied, at which an increased amount of material is dispensed from the application needle 5 in order to ensure a secure all-round seal and is partly received in the elongated hole.
  • FIGS. 2a to 2f show schematic representations of examples of housing sections of housing parts 11, 21, 31, 41 and 51 with recesses 19, 29, 39, 49 and 59 provided as catch areas in longitudinal section (FIGS. 2a and 2c to 2e) or in a top view (FIG. 2b as a top view of FIG. 2a).
  • FIG. 2b shows schematic representations of examples of housing sections of housing parts 11, 21, 31, 41 and 51 with recesses 19, 29, 39, 49 and 59 provided as catch areas in longitudinal section (FIGS. 2a and 2c to 2e) or in a top view (FIG. 2b as a top view of FIG. 2a).
  • Fig. 2a and 2b Assumption depending on the specific technological boundary conditions can be designed as a simple blind hole with a bottom parallel to the housing part surface (Fig. 2a and 2b) or as an opening with a circular cross-section, but inclined or curved in different directions (Fig. 2c or 2d) .
  • one or more elevations (s) on the housing surface can be assigned to it, such as the spacer 49a assigned to the collecting area 49 in FIG. 2e and the bevel 49b or the holding frame 59a assigned to a hemispherical depression 59 in the housing part 51.
  • FIGS. 3a to 3i schematically show three further exemplary embodiments, each in a top view (FIGS. 3a, 3d and 3g) and a cross-sectional view (FIGS. 3b, 3e and 3h) of a housing section 61, 71 and 81 and in the state with applied sealant double strand 68a / 68b, 78a / 78b or 88a / 88b (Fig. 3c, 3f and 3i).
  • the recesses 69, 79 and 89 here have an essentially rectangular cross section, the recess 89 having a completely open side surface and the recess 79 having an open side access, so that in the case of the corresponding housing parts 81 and 71, one from the open side swiveling into the intended course of the seal (or - 9 -
  • the bottom of the recess 79 in the region of its lateral opening and the bottom of the recess 89 are shown completely flat; In modified versions, however, it can also be designed to rise towards the open side in order to prevent the not yet cured sealant from running off if a sealant with a relatively low viscosity should be used.
  • the spacer shown in FIGS. 3a to 3i has a height of approximately 80% of the intended height of the sealing profile, in order to limit its compression accordingly when the housing is closed; however, the choice of this ratio depends on the specific application, in particular the elasticity and hardness of the sealing profile.
  • FIG. 4a and 4b schematically show two further embodiments of the collecting area in plan views.
  • FIG. 4a shows a storage surface 99 which is formed laterally on a housing part 91 in the vicinity of a spacer 99a and is somewhat lowered compared to the housing surface and which forms the starting point for the application of a sealing profile 98
  • FIG. 4b shows a similar embodiment where the storage surface 109 but is molded to the surface of the housing part 101 at the same level and additionally has a reservoir depression 109b.
  • the shielding effect over the course of the housing edge can be implemented in a wide variety of forms and in particular can also be provided at sealing profile branch points.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Catching Or Destruction (AREA)
  • Glass Compositions (AREA)
  • Dry Shavers And Clippers (AREA)

Abstract

L'invention concerne un boîtier (3), constituant en particulier un logement à protection électromagnétique pour composants électroniques. Ce boîtier comporte une première et une seconde partie de boîtier (1, 2) et un corps d'étanchéité (8) qui est placé, pour fermer de façon étanche l'intérieur du boîtier, entre la première et la seconde partie de boîtier. Ce corps d'étanchéité est constitué d'une matière d'étanchéité (7) appliquée à l'état initial pâteux sur la première partie de boîtier, ou bien qui est liquide à l'état initial et appliquée sous forme de mousse sur ladite première partie de boîtier, cette matière d'étanchéité durcissant tout en gardant son élasticité et en adhérant solidement à la première partie de boîtier. La première partie de boîtier comporte, dans la zone d'un point de départ, de terminaison ou de bifurcation du corps d'étanchéité présentant une section plus grande par rapport au reste dudit corps d'étanchéité, une zone de réception (9) de largeur limitée, en particulier un évidement, dans laquelle vient se loger une partie de la matière d'étanchéité appliquée à cet endroit.
PCT/DE1998/003167 1998-02-09 1998-10-24 Boitier WO1999040769A1 (fr)

Priority Applications (12)

Application Number Priority Date Filing Date Title
DE59802680T DE59802680D1 (de) 1998-02-09 1998-10-24 Gehäuse
HU0004680A HUP0004680A3 (en) 1998-02-09 1998-10-24 Housing
JP2000531047A JP2002503043A (ja) 1998-02-09 1998-10-24 ハウジング
AU17484/99A AU734963B2 (en) 1998-02-09 1998-10-24 Housing
AT98962191T ATE212177T1 (de) 1998-02-09 1998-10-24 Gehäuse
US09/582,810 US6547252B1 (en) 1998-02-09 1998-10-24 Housing having a recess for locating part of a sealing material
DE19882208T DE19882208D2 (de) 1998-02-09 1998-10-24 Gehäuse
DK98962191T DK1055356T3 (da) 1998-02-09 1998-10-24 Hus
KR1020007007080A KR20010033570A (ko) 1998-02-09 1998-10-24 하우징
EP98962191A EP1055356B1 (fr) 1998-02-09 1998-10-24 Boitier
CA002304943A CA2304943A1 (fr) 1998-02-09 1998-10-24 Boitier
NO20003998A NO20003998L (no) 1998-02-09 2000-08-08 Hus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19804861 1998-02-09
DE19804861.0 1998-02-09

Publications (1)

Publication Number Publication Date
WO1999040769A1 true WO1999040769A1 (fr) 1999-08-12

Family

ID=7856923

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/003167 WO1999040769A1 (fr) 1998-02-09 1998-10-24 Boitier

Country Status (14)

Country Link
US (1) US6547252B1 (fr)
EP (1) EP1055356B1 (fr)
JP (1) JP2002503043A (fr)
KR (1) KR20010033570A (fr)
CN (1) CN1284256A (fr)
AT (1) ATE212177T1 (fr)
AU (1) AU734963B2 (fr)
CA (1) CA2304943A1 (fr)
DE (3) DE29819434U1 (fr)
DK (1) DK1055356T3 (fr)
ES (1) ES2172256T3 (fr)
HU (1) HUP0004680A3 (fr)
NO (1) NO20003998L (fr)
WO (1) WO1999040769A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002037810A1 (fr) * 2000-10-30 2002-05-10 It Innovations Finland Oy Procede de fabrication de la partie de couverture d'un boitier pour telephones portables
EP1098388B1 (fr) * 1999-11-03 2005-02-23 Q-Free MagCom AS Appareil de communication radio portable comme téléphone mobile à écran de protection
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield

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WO2002021890A1 (fr) * 2000-09-07 2002-03-14 Emi-Tec Elektronische Materialien Gmbh Procede de production d'un boitier muni d'un blindage electromagnetique et outil de formage et systeme pour mettre ledit procede en oeuvre
US7012189B2 (en) * 2001-03-28 2006-03-14 Apple Computer, Inc. Computer enclosure
DE10232947A1 (de) 2002-07-19 2004-01-29 Siemens Ag Behältnis, insbesondere Gehäuse für ein Telefonmobilteil sowie Verfahren zur Herstellung eines Gehäuseteils
US20040262851A1 (en) * 2003-06-25 2004-12-30 Matt Tones Rebuildable composite seal
DE202004017988U1 (de) * 2004-11-19 2005-01-13 Knürr AG Befestigungssystem
JP4355652B2 (ja) * 2004-12-27 2009-11-04 埼玉日本電気株式会社 電子機器及びその防塵構造
CN101600330B (zh) * 2008-06-03 2012-04-18 上海贝尔股份有限公司 用于面板间电磁屏蔽的结构及其制造方法
US8687359B2 (en) 2008-10-13 2014-04-01 Apple Inc. Portable computer unified top case
US8203084B2 (en) * 2010-03-16 2012-06-19 Tyco Electronics Corporation Electrical connector assembly with EMI gasket
CN102378505A (zh) * 2010-08-09 2012-03-14 富泰华工业（深圳）有限公司 电子装置壳体及其制造方法
DE102013213233A1 (de) 2013-07-05 2015-01-08 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Herstellen eines Gehäuses mit einer Schirmung vor elektrischer und/oder magnetischer Strahlung und Gehäuse mit Schirmung vor elektrischer und/oder magnetischer Strahlung
CN103939794A (zh) * 2014-03-12 2014-07-23 嘉兴市朗特隆光电有限公司 一种密封方法及采用该方法的led投光灯
CN105407661A (zh) * 2014-08-01 2016-03-16 深圳富泰宏精密工业有限公司 电子装置壳体及应用该壳体的电子装置
DE102015212680B4 (de) 2015-07-07 2017-02-02 Robert Bosch Gmbh Vorrichtung zur Fixierung eines Fügepartners mit einem Fixierelement und einem Ausgleichselement sowie Verfahren zur Herstellung dieser Vorrichtung

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US5641438A (en) * 1995-01-24 1997-06-24 Bunyan; Michael H. Method for forming an EMI shielding gasket
WO1998006246A1 (fr) * 1996-08-01 1998-02-12 Helmut Kahl Procede pour produire une garniture d'etancheite a effet d'ecran electromagnetique

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US4931479B1 (en) * 1988-11-07 2000-10-10 Parker Intangibles Inc Foam in place conductive polyurethane foam
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
CA2129073C (fr) * 1993-09-10 2007-06-05 John P. Kalinoski Joints moulants iem
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US5641438A (en) * 1995-01-24 1997-06-24 Bunyan; Michael H. Method for forming an EMI shielding gasket
WO1998006246A1 (fr) * 1996-08-01 1998-02-12 Helmut Kahl Procede pour produire une garniture d'etancheite a effet d'ecran electromagnetique

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1098388B1 (fr) * 1999-11-03 2005-02-23 Q-Free MagCom AS Appareil de communication radio portable comme téléphone mobile à écran de protection
WO2002037810A1 (fr) * 2000-10-30 2002-05-10 It Innovations Finland Oy Procede de fabrication de la partie de couverture d'un boitier pour telephones portables
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield

Also Published As

Publication number Publication date
CA2304943A1 (fr) 1999-08-12
EP1055356A1 (fr) 2000-11-29
AU734963B2 (en) 2001-06-28
AU1748499A (en) 1999-08-23
KR20010033570A (ko) 2001-04-25
CN1284256A (zh) 2001-02-14
NO20003998L (no) 2000-10-06
ES2172256T3 (es) 2002-09-16
DE29819434U1 (de) 1999-02-18
HUP0004680A1 (hu) 2001-04-28
ATE212177T1 (de) 2002-02-15
US6547252B1 (en) 2003-04-15
JP2002503043A (ja) 2002-01-29
HUP0004680A3 (en) 2004-01-28
DE19882208D2 (de) 2000-08-10
EP1055356B1 (fr) 2002-01-16
NO20003998D0 (no) 2000-08-08
DK1055356T3 (da) 2002-04-02
DE59802680D1 (de) 2002-02-21

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