WO1999003165A1 - Carte a puce et procede de mise en contact d'une antenne encastree dans une carte a puce - Google Patents

Carte a puce et procede de mise en contact d'une antenne encastree dans une carte a puce Download PDF

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Publication number
WO1999003165A1
WO1999003165A1 PCT/DE1998/001691 DE9801691W WO9903165A1 WO 1999003165 A1 WO1999003165 A1 WO 1999003165A1 DE 9801691 W DE9801691 W DE 9801691W WO 9903165 A1 WO9903165 A1 WO 9903165A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
contact
chip card
pin
chip
Prior art date
Application number
PCT/DE1998/001691
Other languages
German (de)
English (en)
Inventor
Erik Heinemann
Frank PÜSCHNER
Michael Huber
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1999003165A1 publication Critical patent/WO1999003165A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]

Definitions

  • the invention relates to a chip card with an antenna for contactless data transfer and a method of Kon ⁇ clocking of such an antenna.
  • Chip cards are card-shaped data carriers that have an integrated semiconductor chip for storing the data.
  • Contact-bearing chip cards have on their surface contact elements which are connected to connections of the integrated circuit and are used for external contacting thereof by a reading device.
  • contactless chip cards have at least one coil acting as an antenna, which is located in their card body and ensures inductive data transmission between the chip and the surroundings of the card.
  • the antenna is also connected to connections of the chip.
  • combination cards are also known, in which there are both contact surfaces for contact-based data transmission and an antenna for contactless data transmission.
  • the electrical connection between the chip and the contact areas on the one hand and the antenna on the other hand can be made via thin lead wires, the so-called bond wires.
  • a common on-site process for chip cards is the so-called implantation process, in which a chip module (consisting of a carrier element which has the external contact surfaces and the chip) is inserted into the cavity of a card body.
  • the electrical connections between the chip and the contact areas are already made via the chip module.
  • the problem is that establish electrical connection between the chip and the antenna.
  • the antenna is usually laminated into or overmolded by the card body, so that in order to establish the electrical connection, contact points of the antenna must first be exposed, for example by milling. Only then can the electrical connection be made to the chip module or to the chip by means of a bonding wire.
  • the invention has for its object to provide a chip card and a corresponding method in which an electrical connection between the chip and antenna is made in a simple manner.
  • a pin made of an electrically conductive material and driven by one of the contact surfaces is provided, one end of which is in contact with the contact surface and the other end of which is non-positively connected to the antenna, so that it is in contact with it.
  • an electrical connection between the contact surface and the antenna is established.
  • the electrical connection between the contact surface and the connections of the chip, on the other hand, is implemented via bond wires, as is common today.
  • FIG. 1 shows an exemplary embodiment of the chip card according to the invention
  • FIG. 2 shows an exemplary embodiment of the pin driven through the contact surface
  • Figure 3 is a plan view of the antenna
  • Figure 4 is a cross-sectional view of the contact area between the pin and antenna.
  • FIG. 1 shows a section of a chip card 1 with a card body 10 which has a cavity 11 into which a chip module 12 is inserted.
  • the chip module 12 has a chip 13 which is applied to a carrier element, which has an insulating layer 14 and a conductive layer
  • the chip 13 is electrically connected to the contact areas 3 via bond wires 15.
  • Chip 13 and bonding wires 15 are usually covered by a masking compound (not shown in FIG. 1), often a thermoset.
  • the chip module 12 is connected to the thermoplastic material of the card body 10 by gluing.
  • the chip card 1 has an antenna 2 inside its card body 10. The antenna 2 can be surrounded by the card body material, for example, by laminating the card body or by extrusion coating.
  • an electrically conductive pin 4 is perpendicular from above through the rightmost one of the contact areas 3 in the card body has been pushed in. Its length is such that it does not protrude beyond the contact surface 3 with its upper end after the formation of a force fit with the antenna 2 at its lower end, which has jagged formations 8 to support the force fit.
  • FIG. 2 shows a detailed view of a further exemplary embodiment of the invention.
  • the contact surface 3 through which the pin 4 has been driven is shown.
  • the adhesive 5 thus also provides good electrical contact between the pin 4 and the contact surface 3.
  • the pin 4 has barbs 6 which prevent the pin from hooking into the Effect the material of the card body 10.
  • only the adhesive 5 or only the barbs 6 can also be provided.
  • FIG. 3 shows a top view of the antenna 2, which can be implemented, for example, as a wound coil. It has a flat contact surface 7 at each of its two ends.
  • a pin 4 is placed on each of the contact surfaces 7 of the antenna 2 and has been driven by a contact surface 3 of the chip card 1.
  • two connections of antenna 2 must always be contacted.
  • only one pin 4 has been shown in FIG.
  • the contact surfaces 7 of the antenna 2 in FIG. 3 have larger dimensions than the diameter of the pins 4. This has the advantage that tolerances in the placement of the respective pin 4 are permitted.
  • Figure 4 shows a sectional view of a side view of the antenna 2 and the lower part of the pin 4.
  • the lower part 9 is designed so that it partially surrounds the round cross section of the antenna 2. In this way, a good electrical contact and a good adhesion between the pin 4 and the antenna 2 is made.
  • FIG. 4 shows the state in which the pin 4 has not yet been fully contacted with the antenna 2. After the pin 4 has been completely driven into the card 1, the two touch, and preferably the pin 4 partially penetrates the material of the antenna 2. Driving in or shooting through the chip card 1 with the pin 4, which is preferably made of aluminum, is not a problem, since the card body 10 is normally made of flexible thermoplastic material.
  • the antenna 2 can be printed, etched or coiled.

Abstract

Carte à puce (1) comprenant une antenne encastrée (2) servant à la transmission de données sans contact, et des faces de contact (3) disposées à la surface de la carte à puce (1), pour une transmission de données par contact, caractérisée en ce qu'un contact électrique est établi entre l'une des faces de contact (3) et l'antenne (2) par une tige électroconductrice (4) qui est enfoncée, par la face de contact (3), dans la carte à puce (1), à un degré tel que l'une de ses extrémités vienne en contact avec la face de contact (3), et que son autre extrémité soit connectée par friction avec l'antenne (2).
PCT/DE1998/001691 1997-07-07 1998-06-19 Carte a puce et procede de mise en contact d'une antenne encastree dans une carte a puce WO1999003165A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19728993.2 1997-07-07
DE1997128993 DE19728993C1 (de) 1997-07-07 1997-07-07 Chipkarte und Verfahren zur Herstellung einer Chipkarte mit einer eingebetteten Antenne

Publications (1)

Publication Number Publication Date
WO1999003165A1 true WO1999003165A1 (fr) 1999-01-21

Family

ID=7834911

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/001691 WO1999003165A1 (fr) 1997-07-07 1998-06-19 Carte a puce et procede de mise en contact d'une antenne encastree dans une carte a puce

Country Status (2)

Country Link
DE (1) DE19728993C1 (fr)
WO (1) WO1999003165A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313015A (en) * 1991-12-31 1994-05-17 Schlegel Corporation Ground plane shield
EP0710924A1 (fr) * 1994-09-16 1996-05-08 Thomson-Csf Carte électronique avec voyant de bon fonctionnement
EP0713252A2 (fr) * 1994-11-16 1996-05-22 Nec Corporation Montage d'éléments de circuit
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
EP0756244A2 (fr) * 1995-07-26 1997-01-29 Giesecke & Devrient GmbH Unité électronique et procédé de fabrication de cette unité
WO1997005569A1 (fr) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Support de donnees comportant un module pourvu d'un composant et d'une bobine, et procede de fabrication dudit support de donnees

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6238396A (en) * 1995-08-01 1997-02-26 Austria Card Plastikkarten Und Ausweissysteme Gmbh Card-shaped data carrier for contactless applications with acomponent and a transmission system for the contactless applcations, method of producing such a card-shaped data carrier and module therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313015A (en) * 1991-12-31 1994-05-17 Schlegel Corporation Ground plane shield
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
EP0710924A1 (fr) * 1994-09-16 1996-05-08 Thomson-Csf Carte électronique avec voyant de bon fonctionnement
EP0713252A2 (fr) * 1994-11-16 1996-05-22 Nec Corporation Montage d'éléments de circuit
EP0756244A2 (fr) * 1995-07-26 1997-01-29 Giesecke & Devrient GmbH Unité électronique et procédé de fabrication de cette unité
WO1997005569A1 (fr) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Support de donnees comportant un module pourvu d'un composant et d'une bobine, et procede de fabrication dudit support de donnees

Also Published As

Publication number Publication date
DE19728993C1 (de) 1998-09-03

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