WO1998030878A1 - Gehäuse für halbleiter-sensoranordnung und verfahren zu dessen herstellung - Google Patents
Gehäuse für halbleiter-sensoranordnung und verfahren zu dessen herstellung Download PDFInfo
- Publication number
- WO1998030878A1 WO1998030878A1 PCT/DE1997/002845 DE9702845W WO9830878A1 WO 1998030878 A1 WO1998030878 A1 WO 1998030878A1 DE 9702845 W DE9702845 W DE 9702845W WO 9830878 A1 WO9830878 A1 WO 9830878A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- housing
- base body
- cover
- opening
- housing according
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/007—For controlling stiffness, e.g. ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0163—Reinforcing a cap, e.g. with ribs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Definitions
- the present invention relates to a housing for a semiconductor sensor arrangement, in which a sensor and evaluation logic are integrated in a semiconductor body and arranged in a housing base body, the housing being closed by a membrane.
- the invention also relates to a method for producing such a housing.
- semiconductor sensors must be protected against process and environmental influences. However, it is necessary that a semiconductor sensor remains accessible to the medium to be measured. In the case of a semiconductor pressure sensor arrangement, for example, the actual semiconductor pressure sensor must be able to be coupled to the pressure to be measured. In other words, a changing pressure must be able to act on the surface of the semiconductor sensor. The same also applies, for example, to temperature sensors, moisture sensors, etc. It is important to ensure that the housing protecting the semiconductor sensor introduces as little delay as possible in the measurement.
- the semiconductor body of the actual semiconductor sensor is accommodated on a circuit board in an inner housing provided with a membrane, which together with evaluation logic in one parent housing is provided.
- the access of the measuring medium, ie mostly air or gas, to the inner housing is via a silicone membrane of the higher-level housing.
- US Pat. No. 4,732,042 describes a semiconductor pressure sensor arrangement in which the semiconductor body is cast in a housing in silicone rubber, which is provided with a membrane on one side.
- the underside of the semiconductor body is freely accessible through a hole in the housing, so that there is a risk of mechanical damage here.
- this semiconductor sensor arrangement has no evaluation electronics integrated in the semiconductor body.
- EP-A-0 286 867 describes a semiconductor pressure sensor arrangement in which a semiconductor body is fastened on a conductor strip and is covered by a soft plastic. This soft plastic is inserted into a housing with an opening so that the pressure is transferred to the semiconductor body via the soft plastic. Damage to the semiconductor body is also possible here, since the soft plastic plastic does not always offer reliable protection against strong mechanical influences.
- the sensor and evaluation electronics are therefore integrated in a semiconductor body.
- this semiconductor body is not provided in an inner housing and additionally in a superordinate housing. Rather, only a housing is used, the cover of which is designed with the membrane and / or the labyrinth in such a way that it can also withstand greater mechanical loads.
- the cover as a membrane can have, for example, a metal foil which has through openings in a cover base body made of plastic interrupts and is only exposed in these through openings.
- the entire surface of the metal foil is not exposed here, but rather a large part is extrusion-coated with the plastic, so that in the case of a pressure sensor, the pressure is only transmitted via the through-openings to the metal foil acting as a membrane.
- the membrane can also be attached to an annular projection within the edge of the lid base body having an opening. This makes it possible to hang the membrane “round”, which improves the response behavior of the semiconductor sensor arrangement due to its then advantageous natural vibration.
- the opening is expediently provided in the middle of the cover body so that the medium to be measured is also acted upon in the middle of the membrane.
- the membrane it is also possible to provide a labyrinth on the inner surface of the base body.
- a membrane and a labyrinth can also be used together.
- the labyrinth can comprise, for example, a spiral groove which leads from an outer opening located at the edge of the base body to an inner opening in the middle of the base body and is covered with a metal foil on the inside of the base body.
- a sealing medium for example in the form of a liquid drop, can advantageously be introduced into the labyrinth.
- An oil drop can be used as a liquid drop. When pressure changes, this liquid drop moves back and forth in the meandering labyrinth without resistance and reliably seals the labyrinth between the outer opening and the inner opening.
- the labyrinth can also be formed by a spiral web which is embedded between the cover body and a film and is guided between an outer opening located at the edge of the cover body and an inner opening in the middle of the film.
- a spiral web which is embedded between the cover body and a film and is guided between an outer opening located at the edge of the cover body and an inner opening in the middle of the film.
- the cover can also consist of an injection molded part, into which at least one through opening is introduced in such a way that a straight passage into the interior of the housing is prevented, so that this through opening also forms a "labyrinth".
- the through opening represents a “labyrinth” that prevents mechanical damage to the semiconductor body.
- the semiconductor sensor arrangement according to the invention can be produced in a simple manner: the basic housing body and the cover can be guided to a work station on separate belts and connected to one another there. Likewise, the lid base body and, for example, a metal foil can also be conveyed on separate belts and connected to one another at the work station to form the lid.
- FIG. 1 shows a section through an inventive housing for a semiconductor sensor arrangement
- Fig. 2 shows a section through a lid after a first
- Embodiment of the invention shows a section through a cover according to a second exemplary embodiment of the invention.
- Fig. 4 shows a section through a lid according to a third
- Figure 5 is a perspective view of the lid according to the third embodiment. 6 shows a section through a cover according to a fourth exemplary embodiment of the invention; Fig. 7 shows a detail A of the cover of Fig. 6;
- Fig. 8 is a schematic representation of the cover of Fig. 6 from below;
- FIG. 9 shows a section through a housing according to a fifth exemplary embodiment of the invention.
- FIG. 10 shows a schematic illustration to explain the manufacture of the housing according to the invention.
- FIG. 11 shows a section through a housing according to a sixth exemplary embodiment of the invention
- 12 shows a plan view of a cover according to a seventh exemplary embodiment of the invention
- FIG. 13 and 14 sections through the lid of Fig. 12;
- Fig. 17 is a perspective view of the lid according to the eighth embodiment of the invention.
- the cover 3 can contain a membrane 5, which is exposed through a through opening 6, so that the pressure on the semiconductor body 2 can act on a pressure sensor via this membrane 5.
- the cover 3 consists of a cover base body 4 made of plastic, in which a metal foil of the membrane 5 is embedded, which is injected into the plastic of the cover base body 4.
- a plurality of through openings 6 are provided in the cover base body 4, so that the metal foil of the membrane 5 is exposed in these through openings 6 and pressure can be transmitted into the interior of the housing.
- the lid shown in FIG. 2 is, for example, placed on its edge 7 on an edge 8 of the basic housing body 1 and glued to it after the semiconductor body 2 has been contacted in a suitable manner.
- Fig. 3 shows a second embodiment of the invention, in which a film 5 made of plastic, such as silicone, or metal is fixed on the raised edge 7 of the base body 4.
- the lid base body 4 made of plastic has a through opening 6 in its center, so that the membrane 5 is acted upon in its center by the pressure acting from the outside, which has a favorable influence on its response behavior.
- FIG. 4 shows a variant of the embodiment of FIG. 3 in a third exemplary embodiment of the invention: here the membrane 5 is suspended from a circular elevation 28 on the underside of the base body 4, so that the square or rectangular suspension according to the exemplary embodiment of FIG Fig. 3 in a round suspension can be changed, which is favorable for the response behavior of the membrane 5.
- FIG. 5 shows the cover of FIG. 4 in perspective, the round shape of the membrane 5 being clearly visible.
- the through opening 6 is shown in FIG. 5 to clarify the illustration, although it is covered by the membrane 5 per se.
- the membrane 5 is designed to be corrugated, which has proven to be expedient for pressure transmission.
- FIG. 6 shows a fourth exemplary embodiment of the invention, in which a spiral-shaped labyrinth 9 is incorporated into a base body 4, which leads from an outer opening 10 to an inner opening 11, as is indicated schematically in FIG. 8.
- 7 shows a detail of this labyrinth 9 in the lid base body 4.
- the labyrinth 9 can, for example, be introduced into the cover base body 4 by providing it with a corresponding groove during casting and then "closing" it with a foil 12, for example made of metal. This film 12 is shown “reinforced” in Fig. 6.
- the labyrinth 9 effects a damping in the pressure transmission, since a certain time passes until a pressure change acting on the outer opening 10 reaches the inner opening 11 via the labyrinth 9.
- a liquid drop 13, made of oil, for example, as shown schematically in FIG. 8, can be introduced into the labyrinth in order to serve as a further seal between the outer opening 10 and the inner opening 11.
- FIG. 9 shows a housing according to a fifth exemplary embodiment of the invention, in which, similarly to the fourth exemplary embodiment of FIGS. 6 to 8, the labyrinth 9 is provided in the cover base body 4 and with an inner cover made of the film 12 or a thin one Copper part is complete.
- This inner cover can be connected to the cover body 4 by means of an adhesive adhesive.
- the cover body 4 is glued to the edge 8 of the basic housing body 1.
- External electrical connections 14 are only indicated schematically in FIG. 9.
- FIG. 9 shows the outer opening 10 in the middle of the lid base body 4, while the inner opening 11 is provided on the edge of the lid base body 4. It is therefore not absolutely necessary to provide the inner opening 10 in the middle of the cover base body 4, although this has proven to be expedient in itself so that the pressure action on the semiconductor body 2 can take place “in the middle”.
- a cover base body 4 with a labyrinth 9 is delivered on a first tape 15 and is gripped by a suction tester (not shown). It may be expedient not to accommodate the outer opening 10 in the middle (as shown), so that the Suction tester can reliably grip the cover body 4.
- the base cover body 4 is then glued with a film 12, which is delivered on a second belt 16 and pulled off a base 17.
- the connection of the cover base body 4 to the film 12 is indicated schematically by a bracket with an arrow 18.
- the base cover body 4 and the film 12 fastened thereon are then glued by means of a tampon adhesive application to the outer edge 8 of a basic housing body 1, which is fed on a third band 19.
- the housing according to the invention can be easily assembled using three straps.
- Fig. 11 shows a sixth embodiment of the invention, in which the cover body 4 consists of a thin metal or plastic plate to which a spiral web 20 is glued, which in turn is provided on its underside with a film 12 made of metal or plastic.
- the web 20 thus forms a meandering labyrinth 9 between the outer opening 10 and the inner opening 11.
- the web 20 can advantageously be produced as an injection molded part.
- a liquid drop 13 can be introduced for sealing.
- the cover 3 consists of an injection-molded part, which has three cores for the three outer openings 10
- FIGS. 13 and 14 there is no straight passage from the outer opening 10 to the inner opening 11, so that here too there is a labyrinth. This ensures reliable protection of the semiconductor body 2 located below the cover 3.
- the two lid halves 21 and 22 are made of plastic and can be produced by injection molding, similar to the lid base body 4 of the embodiment of FIGS. 12 to 14. Instead of the one through opening 24 shown in FIG. 17, three through openings can also be formed, for example.
- the cover of the eighth exemplary embodiment enables a semiconductor pressure sensor arrangement which only responds above a certain threshold value as soon as the spring medium 23 is compressed. Foam, a gas column or rubber can be used for this spring medium 23.
- the housing according to the invention is of course not exclusively limited to use in a semiconductor sensor arrangement in which a sensor and evaluation logic are integrated in a semiconductor body. It can also be used advantageously in a semiconductor sensor arrangement in which the sensor and the evaluation logic have different semiconductor bodies and are accommodated in a single common housing or in two separate housings. In the second case, the sensor alone is then provided with a housing according to the invention.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97951108A EP0951640A1 (de) | 1997-01-08 | 1997-12-05 | Gehäuse für halbleiter-sensoranordnung und verfahren zu dessen herstellung |
JP53044298A JP2001508539A (ja) | 1997-01-08 | 1997-12-05 | 半導体センサ素子 |
US09/349,551 US6186008B1 (en) | 1997-01-08 | 1999-07-08 | Semiconductor sensor component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19700393.1 | 1997-01-08 | ||
DE19700393A DE19700393C2 (de) | 1997-01-08 | 1997-01-08 | Gehäuse mit einer Halbleiter-Sensoranordnung und Verfahren zu deren Herstellung |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/349,551 Continuation US6186008B1 (en) | 1997-01-08 | 1999-07-08 | Semiconductor sensor component |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998030878A1 true WO1998030878A1 (de) | 1998-07-16 |
Family
ID=7816966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1997/002845 WO1998030878A1 (de) | 1997-01-08 | 1997-12-05 | Gehäuse für halbleiter-sensoranordnung und verfahren zu dessen herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6186008B1 (de) |
EP (1) | EP0951640A1 (de) |
JP (1) | JP2001508539A (de) |
CN (1) | CN1244918A (de) |
DE (1) | DE19700393C2 (de) |
WO (1) | WO1998030878A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8103025B2 (en) | 1999-09-07 | 2012-01-24 | Epcos Pte Ltd. | Surface mountable transducer system |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10333964A1 (de) * | 2003-07-25 | 2005-02-24 | Robert Bosch Gmbh | Deckel für das Gehäuse einer Sensorbaugruppe mit einem Drucksensor |
JP2005093494A (ja) * | 2003-09-12 | 2005-04-07 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
WO2006020744A2 (en) * | 2004-08-12 | 2006-02-23 | Tessera, Inc. | Structure and method of forming capped chips |
JP4882369B2 (ja) * | 2005-12-27 | 2012-02-22 | 横浜ゴム株式会社 | 空気圧検知システム |
DE102007057903B4 (de) * | 2007-11-29 | 2010-07-08 | Continental Automotive Gmbh | Sensormodul und Verfahren zur Herstellung des Sensormoduls |
US8130506B2 (en) * | 2008-06-19 | 2012-03-06 | Infineon Technologies Ag | Sensor module |
EP2224218B1 (de) * | 2009-02-25 | 2018-11-28 | Sensirion Automotive Solutions AG | Sensor in einer geformten Verpackung und Herstellungsverfahren dafür |
EP2801805A4 (de) * | 2012-02-27 | 2015-07-08 | Fujikura Ltd | Drucksensormodul und deckel dafür |
DE102013208534A1 (de) * | 2012-12-27 | 2014-07-03 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Sensorgehäuses sowie entsprechendes Sensorgehäuse |
FR3006593B1 (fr) * | 2013-06-06 | 2015-05-29 | Air Liquide Medical Systems | Systeme de mesure de pression de gaz pour appareil de ventilation de patient |
CN106525295A (zh) * | 2016-11-11 | 2017-03-22 | 中国电子科技集团公司第四十八研究所 | 一种硅压阻式芯体 |
DE102022205075A1 (de) | 2022-05-20 | 2023-11-23 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanisches Bauteil für eine Sensor-, Mikrofon- und/oder Mikrolautsprechervorrichtung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4914954A (en) * | 1987-09-24 | 1990-04-10 | Siemens Aktiengesellschaft | Control device |
DE4133061A1 (de) * | 1991-10-04 | 1993-04-15 | Bosch Gmbh Robert | Drucksensor |
US5436491A (en) * | 1992-10-19 | 1995-07-25 | Mitsubishi Denki Kabushiki Kaisha | Pressure sensor for high temperature vibration intense environment |
DE4413274A1 (de) * | 1994-04-16 | 1995-10-19 | Sel Alcatel Ag | Drucksensor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4732042A (en) * | 1986-04-22 | 1988-03-22 | Motorola Inc. | Cast membrane protected pressure sensor |
US4823605A (en) * | 1987-03-18 | 1989-04-25 | Siemens Aktiengesellschaft | Semiconductor pressure sensor with casing and method for its manufacture |
GB2282891B (en) * | 1993-10-13 | 1997-09-03 | Tokai Rika Co Ltd | Acceleration detecting apparatus |
-
1997
- 1997-01-08 DE DE19700393A patent/DE19700393C2/de not_active Expired - Fee Related
- 1997-12-05 CN CN97181313A patent/CN1244918A/zh active Pending
- 1997-12-05 WO PCT/DE1997/002845 patent/WO1998030878A1/de not_active Application Discontinuation
- 1997-12-05 JP JP53044298A patent/JP2001508539A/ja not_active Ceased
- 1997-12-05 EP EP97951108A patent/EP0951640A1/de not_active Withdrawn
-
1999
- 1999-07-08 US US09/349,551 patent/US6186008B1/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4914954A (en) * | 1987-09-24 | 1990-04-10 | Siemens Aktiengesellschaft | Control device |
DE4133061A1 (de) * | 1991-10-04 | 1993-04-15 | Bosch Gmbh Robert | Drucksensor |
US5436491A (en) * | 1992-10-19 | 1995-07-25 | Mitsubishi Denki Kabushiki Kaisha | Pressure sensor for high temperature vibration intense environment |
DE4413274A1 (de) * | 1994-04-16 | 1995-10-19 | Sel Alcatel Ag | Drucksensor |
Non-Patent Citations (2)
Title |
---|
KAYAL H A ET AL: "Intelligent sensors (ASIS) for specific applications. Silicon pressure sensor with integrated signal evaluation", ELEKTRONIK, 29 APRIL 1988, WEST GERMANY, vol. 37, no. 9, ISSN 0013-5658, pages 112 - 117, XP002057862 * |
TANIGAWA H ET AL: "MOS integrated silicon pressure sensor", IEEE TRANSACTIONS ON ELECTRON DEVICES, JULY 1985, USA, vol. ED-32, no. 7, ISSN 0018-9383, pages 1191 - 1195, XP000604685 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8103025B2 (en) | 1999-09-07 | 2012-01-24 | Epcos Pte Ltd. | Surface mountable transducer system |
Also Published As
Publication number | Publication date |
---|---|
DE19700393A1 (de) | 1998-07-16 |
EP0951640A1 (de) | 1999-10-27 |
US6186008B1 (en) | 2001-02-13 |
CN1244918A (zh) | 2000-02-16 |
DE19700393C2 (de) | 2002-03-14 |
JP2001508539A (ja) | 2001-06-26 |
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