WO1997016874A1 - Prise femelle permettant de mesurer un semi-conducteur a reseau de grille a boules - Google Patents

Prise femelle permettant de mesurer un semi-conducteur a reseau de grille a boules Download PDF

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Publication number
WO1997016874A1
WO1997016874A1 PCT/JP1995/002224 JP9502224W WO9716874A1 WO 1997016874 A1 WO1997016874 A1 WO 1997016874A1 JP 9502224 W JP9502224 W JP 9502224W WO 9716874 A1 WO9716874 A1 WO 9716874A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
bga package
socket
branch
housing
Prior art date
Application number
PCT/JP1995/002224
Other languages
English (en)
Japanese (ja)
Inventor
Shigeru Matsumura
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP6215810A priority Critical patent/JPH0883656A/ja
Priority claimed from JP6215810A external-priority patent/JPH0883656A/ja
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to KR1019970704516A priority patent/KR987001149A/ko
Priority to US08/875,205 priority patent/US6069481A/en
Priority to PCT/JP1995/002224 priority patent/WO1997016874A1/fr
Publication of WO1997016874A1 publication Critical patent/WO1997016874A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Definitions

  • the BGA package measurement socket 30 shown in FIG. 7 uses the probe pin 35 as described above.
  • this socket 30 the pressure contact force between the solder ball 12 on the lower surface of the BGA package 10 and the contact pin tip of the upper contactor 35 3 of the probe pin 35, and the printed circuit board on the IC test side 2 contact force between the contact pin tip predetermined purine Bok wiring and the lower contact 3 5 3 0, since those caused by Koirupane 3 5 4 of the probe pins 35, pressing force required to obtain it can not be shortened below a certain limit in the length of Koi Rubane 3 5 4. Therefore, in order to ensure a contact force that is needed is the total length of Koirupane 3 5 4 sounds relatively long You.
  • the semiconductor device is mounted on the surface of the insulating substrate 13 of the BGA package 10, and the solder poles 12 are two-dimensionally arranged in a matrix on the rear surface.
  • the internal circuit (semiconductor device, typically IC) of the BGA package 10 is sealed with a mold 11, and the leads of the internal circuit are electrically connected to solder poles 12 via printed wiring formed on the substrate 13. It is connected to the.
  • the assembly of the BGA package measuring socket 30 is completed by accommodating the branch contact bin 36 in the accommodating hole 33 of the housing 31 from above and integrally fixing it to the housing 31. Completed the terminal 3 6 3 tip of the branch co Ntakutobin 3 6 of the BGA package measuring socket 3 0, as shown in FIG. 3, IC testing evening side of the through of the printed circuit board 2 0 constituting part bore 2
  • the BGA package 10 is inserted into the engagement recess of the connector 2 1 which is inserted and fixed in 2 and engaged.
  • the BGA package 10 is mounted on the upper surface 32 of the BGA package measurement socket 30.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

Cette invention concerne une prise femelle permettant de mesurer un semi-conducteur à réseau de grille à boules, prise grâce à laquelle les pressions de contact de broches de contact fourchues sur des boules de soudure, sont générées presque perpendiculairement par rapport au sens longitudinal desdites broches de contact. Ces broches de contact possèdent une longueur utile minimale, indépendamment de la pression de contact. Les broches de contact fourchues (36) sont obtenues par poinçonnage d'une plaque métallique élastique de manière à obtenir une forme de diapason, puis insérées dans des trous (33) pratiqués dans un logement isolant. Les extrémités de deux sections élastiques (362) d'une fourche représentent des sections de contact (361) entrant en contact par deux points avec les boules de soudage (12) dans un boîtier BGA (10). Les surfaces opposées aux trous (33) sont orientées obliquement par rapport au sens de la disposition desdits trous, ceci de manière à améliorer la densité de montage des broches de contact (36).
PCT/JP1995/002224 1994-09-09 1995-10-31 Prise femelle permettant de mesurer un semi-conducteur a reseau de grille a boules WO1997016874A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP6215810A JPH0883656A (ja) 1994-09-09 1994-09-09 ボール・グリッド・アレイ半導体測定用ソケット
KR1019970704516A KR987001149A (ko) 1995-10-31 1995-10-31 볼.그리드.어레이 반도체 측정용 소켓
US08/875,205 US6069481A (en) 1995-10-31 1995-10-31 Socket for measuring a ball grid array semiconductor
PCT/JP1995/002224 WO1997016874A1 (fr) 1994-09-09 1995-10-31 Prise femelle permettant de mesurer un semi-conducteur a reseau de grille a boules

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6215810A JPH0883656A (ja) 1994-09-09 1994-09-09 ボール・グリッド・アレイ半導体測定用ソケット
PCT/JP1995/002224 WO1997016874A1 (fr) 1994-09-09 1995-10-31 Prise femelle permettant de mesurer un semi-conducteur a reseau de grille a boules

Publications (1)

Publication Number Publication Date
WO1997016874A1 true WO1997016874A1 (fr) 1997-05-09

Family

ID=26436308

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1995/002224 WO1997016874A1 (fr) 1994-09-09 1995-10-31 Prise femelle permettant de mesurer un semi-conducteur a reseau de grille a boules

Country Status (1)

Country Link
WO (1) WO1997016874A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2376353A (en) * 2000-04-10 2002-12-11 Wayne Kay Pfaff Mounting for high frequency device packages for test and/or burn-in

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56162482A (en) * 1980-05-21 1981-12-14 Fujitsu Ltd Method of carrying dual in-line package type semiconductor integrated circuit at testing time
JPH02309579A (ja) * 1989-05-22 1990-12-25 Enplas Corp 検査用ｉｃソケット
JPH06203926A (ja) * 1992-12-25 1994-07-22 Yamaichi Electron Co Ltd Ｉｃソケット
JPH0686293U (ja) * 1993-05-24 1994-12-13 株式会社エンプラス Ｂｇａ型ｉｃパッケージ用のｉｃソケット

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56162482A (en) * 1980-05-21 1981-12-14 Fujitsu Ltd Method of carrying dual in-line package type semiconductor integrated circuit at testing time
JPH02309579A (ja) * 1989-05-22 1990-12-25 Enplas Corp 検査用ｉｃソケット
JPH06203926A (ja) * 1992-12-25 1994-07-22 Yamaichi Electron Co Ltd Ｉｃソケット
JPH0686293U (ja) * 1993-05-24 1994-12-13 株式会社エンプラス Ｂｇａ型ｉｃパッケージ用のｉｃソケット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2376353A (en) * 2000-04-10 2002-12-11 Wayne Kay Pfaff Mounting for high frequency device packages for test and/or burn-in

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