Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
  • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
  • H01R13/6581—Shield structure
  • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
  • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
  • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
  • H01R13/6598—Shield material
  • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal

Definitions

• the present invention relates to connectors and
• terminals is complex, especially since the bending is different for each row.
• Each of the PCB assemblies comprises one insulated substrate, one spacer,
• substrate is provided with a predetermined pattern of conducting tracks, while
• ground tracks are provided between the conducting tracks.
• tracks are connected at one end to a female contact terminal and at the other
• Each of the cover plates is a conductive shield
• insulating substrates are rather thick to allow plated blind holes to be made
• each of the printed circuit boards has to have a predetermined thickness which reduces
• 4,571,014 is that the shield members, the insulating substrates and the
• spacers have to be aligned with small holes and are fixed to one another by
• substrates are plated through-holes, thus establishing an electrical contact
• the object of the present invention is to provide a connector which
• terminals are secured onto the surface of a PCB carrying a
• the PCB is accommodated by recesses formed in an associated cover or in a
• contact terminals either male or female, can be easily connected to the
• the recesses in the cover or the spacer provide enough space for accommodating formed contact terminals, such as a male or female terminal blanked from sheet stock.
• ground tracks may be provided between the conducting tracks on a first
• a ground layer may be provided on a second surface opposite the
• the cover plates are made of insulating material and may be provided
• cover plate conducting tracks and cover plate ground tracks in a
• the cover plate conducting tracks may have one end for connection
• the cover plates may have the second cover plate surface
• each of the first contact terminals may be connected to one second
• ground tracks on the cover plate, respectively, can be connected to the ground
• ground tracks may then be electrically
• the recesses in the spacer or cover plate can be designed for entirely
• the second contact terminals may comprise press-fit pins, surface
• the connector may also comprise an insulating connector body
• the connector body desirably includes structure for receiving
• each spacer and its adjacent cover plate are substituted by another cover plate, provided with suitable recesses for accommodating first contact terminals and /or second contact terminals.
• the PCB modules include
• planar insulating substrates having conductive traces on which terminals are
• the covers having recesses for accommodating the terminals.
• covers and associated recesses can comprise a means of applying a force to
• the contact terminals such as an insertion force necessary to press fit the
• the terminals include structure, engaged by the cover, for imparting force to
• the connector may be provided with suitable filter elements by
• Figure 1 schematically shows a connector in order to illustrate the
• Figures 2a-2c show a right angle connector manufactured in accordance
• Figures 3a through 3c show a right angle connector according to an
• Figure 4 is a side elevational view of a PCB assembly according to a
• FIGS 5, 6 and 7 are fragmentary views showing the mounting of
• Figures 8-8d show different views of an insulative cover to be used in
• Figures 9-9e illustrate an assembled terminal module formed of a PCB
• FIGS 10, 10a and 11 are enlarged views showing portions of the
• Figures 12- 12c shown views of a connector housing for receiving a
• Figures 13, 13a and 13b show various views of a lead-in plate for the
• Figures 14- 14c show views of a completed connector assembly.
• Figure 1 shows an integrated PCB assembly 1 having an insulating body
• the insulating body 13 may comprise two or more layers as explained
• shielding ground layers 9 may be provided with shielding ground layers 9 at either main outer surface. However, depending on the application one of the shielding ground
• the body 13 is provided with a first series of openings or recesses 2 in a
• the body 13 is provided with similar openings or recesses 3 for
• recesses 2 and 3 includes a conductive surface therein.
• Each of the contact terminals 4 is shown to have a female type contact
• body connect portions 5 is designed to be received by one of the recesses 2
• each of the female-type contact portions 14 may be any of the female-type contact portions 14. If desired, each of the female-type contact portions 14 may be any of the female-type contact portions 14.
• Each of the board contact terminals 7 is shown to have a board contact
• Each of the board contact portions 15 is
• contact portion 15 may be designed to be suitable for surface mount or through mount connection to a printed circuit board. It is observed that the
• printed circuit board is not used in a limiting sense, but is meant to
• Each of the recesses 2 are electrically connected to a corresponding
• conducting means may be conductive traces 1 1 as will be explained below by
• ground tracks 10 may be provided in-between.
• Ground tracks 10 may, e.g., be
• FIGS. 1a through 2c show subsequent manufacturing steps of
• Figure 2a shows an insulating substrate 16, formed for example of
• Conducting ground tracks 10 may be provided between adjacent
• the outer most conducting ground track 10 is provided
• Each of the conducting tracks 11 is connected to board contact
• An insulating spacer 17 is provided having a first series of openings 24
• Cover plate 18 may also be provided with ground tracks 10
• substrate 16 may be any material
• Figure 2b shows one integrated PCB assembly manufactured from the
• insulating spacer 17 is attached and an insulating cover plate 18 attached to
• spacer 17 form recesses 2, in which the female-type contact terminals 4 are
• male-type or hermaphrodite-type contact terminals may be replaced by male-type or hermaphrodite-type contact terminals.
• FIG. 1c shows several integrated PCB assemblies as shown in
• Figure 2b parallel to each other and to be inserted into a connector body 19.
• the connector body 19 may be made of any insulating material and may be
• the connector body 19 may be provided with suitable guiding
• a locating and securing post 21 receivable within a
• integrated PCB assemblies have at least one ground layer 9 on one of their
• the connector body 19 is provided with suitable lead-in holes 20 in
• lead-in holes 20 is suitable for receiving a mating male-type contact terminal
• the lead-in holes 20 are arranged in
• terminals 4 is stamped away as a final step during manufacturing.
• function of the carrier is to form a one stitch process.
• board contact terminals 7 are shown to be adjoined on a carrier as
• contact terminals is stamped away as final step during manufacturing.
• cover plate 18 may be provided with a plurality of suitable materials
• plates 18 may be provided with a suitable ground layer 9.
• cover plate 18 could be provided with suitable recesses
• shielding means may be provided within the connector body 19.
• spacer 17 and one cover plate 18 Other numbers of substrates, spacers and
• the substrate 16, spacer 17 and cover plate 18 may have
• filter elements like resistors, capacitors and inductors, can be easily.
• any of the insulating substrates 16 may, e.g., be provided with suitable
• connecting pins to be received by suitable holes in the insulating cover plates 18 to provide easier alignment of parallel integrated PCB assemblies and to
• the connector according to the invention can be manufactured by using
• connector according to the present invention can also be designed for
• the invention is provided with a set of contact terminals 4 at one side and a set
• terminals 7 are substituted by contact terminals suitable for connection to a
• the set of contact terminals 4 may be
• circuit board or the like.
• Figures 4- 14c illustrate a second embodiment of an integral terminal
• the PCB assembly 30 comprises an insulating
• substrate 31 of a material commonly commercially used for making PCBs.
• the substrate 31 can be a resin impregnated fiber assembly such as is sold
• a plurality of circuit traces 32 are formed by
• Each trace 32 extends from a first portion of
• the substrate for example adjacent the front edge as shown in Figure 4, to
• a second area or region of the substrate 31 such as the bottom edge as shown
• the traces 32 include contact pads at each end adapted to have
• a plurality of ground or shielding traces 33 may also
• the shielding traces 33 may be disposed
• each terminal such as a contact terminal 34 is mounted at the first end of each
• An additional shielding or ground layer 36 may be provided
• a ground terminal 37 is fixed
• a locating hole 39 may be appropriately placed in the substrate 31.
• locating hole 39 preferably comprises a plated through hole for establishing
• small vias forming plated through-holes may be disposed in each of
• ground tracks 33 so that the ground tracks 33, the shield layer 36 and the back shield layer 38 form a shielding structure for the signal traces 33 and
• 34 are formed as a one-piece stamping and can comprise a dual beam contact
• spring section 42 is cantilevered from each of the upstanding portions 41 to
• a mating terminal such as a pin from a pin
• the contact terminals also include a
• solder 46 is
• contact portions 43 define a contact mating or pin insertion axis that
• terminal 35 includes a press-fit section 48 and a board mounting section 49.
• the board mounting section 49 includes a generally planar base 50 with an
• upturned top tang 52 disposed along a top edge.
• solder fillets 54 again formed by conventional
• top tang 52 is spaced closely adjacent to or rests on the top surfaces of the side tangs 53 as shown
• Figures 8, 8a, 8b, 8c and 8d illustrate an insulative cover/ spacer
• the cover includes a plurality of contact recesses 57 formed along
• Each of the recesses 38 includes a contact preload rib 58.
• central recess 59 may also be formed in the cover.
• terminal recesses 60 is formed along a second edge of the cover. Further, a
• locating boss 62 is integrally formed with the cover and is sized and shaped to
• the cover further includes an upper rim 63 extending from the rear of the
• the cover 56 is formed on a portion of the bottom surface of the cover.
• an upper locating and mounting rib 65 preferably in the form of a
• dove tail rib as shown.
• a similar but shorter mounting and locating rib 66 is
• a terminal module 69 ( Figure 9) is formed by associating a PCB terminal
• Figure 9 is substantially an x-ray view through
• the PCB assembly 30 is located in the vertical
• terminals 34 are located in the contact recesses 57 and the connector
• mounting terminals 35 are located in the recesses 60. The previously
• Figure 9a is a sectional view taken along line AA of Figure 9 and shows
• the terminals 34 located in the contact recesses 57.
• Figure 9b is a sectional view taken along line BB. As shown in Figure
• the substrate 31 is essentially located in a vertical position by the rims 63
• the overall thickness of the module 69 generally approximates the
• thickness of cover 56 would be approximately 1.6 mm.
• each connector mounting 35 has its
• mounting terminal is of a type that is likely to have a relatively high axial force
• recess 60 is advantageously located so that it bears against the upturned tang
• Figure 9d is a fragmentary cross sectional view taken along line DD of
• Figure 9e is a view of the back end of the module 69 showing in
• Figures 10 and 10a illustrate enlarged views of the connector contacts
• Figure 10a is a cross sectional view
• Figure 1 1 illustrates the interaction of the cover 56 with the board
• circuit trace 32 is minimized. In this manner, loosening or detachment of the
• the cover is designed so that a
• structure disclosed is designed to withstand required press-fit pin insertion
• Figure 12 is a cross sectional view taken along line HH of Figure 12a
• FIG. 70 shows a connector housing 70 having a top wall 72, a bottom wall 76 and
• the top wall 72 includes a plurality of locating slots, for
• dove tail slots 73 For example the dove tail slots 73.
• One or more guiding ridges 74 may be formed
• the bottom 76 also includes a locating slot, for
• the front wall 78 includes a plurality of
• Figure 13a is a front elevational view of a lead-in face plate 80 having a
• the lead-in portions 84 extends to a pin insertion port 85.
• sleeves or hollow bosses 86 extend from the rear surface of the face plate 80
• Figure 14 is a sectional view showing the assembly of contact module
• modules 69 are assembled in the housing 70 by aligning the dove tail ribs 65
• mounting contacts 33 and ground contact 37 are positioned to be inserted into
• Additional shielding can be provided by metallizing appropriate surfaces

Priority Applications (4)

Applications Claiming Priority (2)

Publications (1)

Family

ID=8220449

Family Applications (1)

Country Status (8)

Cited By (10)

Families Citing this family (40)

Citations (4)

Family Cites Families (7)

• 1995
  • 1995-07-03 EP EP95201811A patent/EP0752739B1/en not_active Expired - Lifetime
  • 1995-07-03 DE DE69519226T patent/DE69519226T2/de not_active Expired - Lifetime
• 1996
  • 1996-07-02 DE DE69634005T patent/DE69634005T2/de not_active Expired - Lifetime
  • 1996-07-02 WO PCT/US1996/011214 patent/WO1997002627A1/en active Search and Examination
  • 1996-07-02 JP JP50528397A patent/JP3784836B2/ja not_active Expired - Lifetime
  • 1996-07-02 CN CN96195255A patent/CN1244959A/zh active Pending
  • 1996-07-02 EP EP96922643A patent/EP0836756B1/en not_active Expired - Lifetime
  • 1996-07-03 IN IN1222CA1996 patent/IN190516B/en unknown
  • 1996-07-05 TW TW085108154A patent/TW369740B/zh not_active IP Right Cessation
• 1997
  • 1997-12-30 KR KR10-1997-0709959A patent/KR100394531B1/ko not_active IP Right Cessation
• 2005
  • 2005-11-24 JP JP2005339404A patent/JP4486028B2/ja not_active Expired - Lifetime

Patent Citations (4)

Non-Patent Citations (1)

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