WO1996036995A1 - Puits a chaleur, et procede et systeme pour realiser ce puits - Google Patents

Puits a chaleur, et procede et systeme pour realiser ce puits Download PDF

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Publication number
WO1996036995A1
WO1996036995A1 PCT/GB1996/001160 GB9601160W WO9636995A1 WO 1996036995 A1 WO1996036995 A1 WO 1996036995A1 GB 9601160 W GB9601160 W GB 9601160W WO 9636995 A1 WO9636995 A1 WO 9636995A1
Authority
WO
WIPO (PCT)
Prior art keywords
fin
heatsink
portions
members
base member
Prior art date
Application number
PCT/GB1996/001160
Other languages
English (en)
Inventor
Robin Douglas Johnson
Francis Edward Fisher
William Dawson Jordan
Original Assignee
Redpoint Thermalloy Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Redpoint Thermalloy Limited filed Critical Redpoint Thermalloy Limited
Priority to JP8534631A priority Critical patent/JPH11505373A/ja
Priority to AU56994/96A priority patent/AU5699496A/en
Priority to EP96915108A priority patent/EP0826240A1/fr
Publication of WO1996036995A1 publication Critical patent/WO1996036995A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Un puits à chaleur (1) est constitué d'un élément de base (10) se présentant sous la forme d'un bloc obtenu par extrusion ou par usinage et d'un certain nombre de nervures planes (12). Les nervures peuvent comporter des éléments en forme de U. Les nervures sont fixées dans des fentes (14) formées dans l'élément de base et elles sont de préférence constituées du même matériau que l'élément de base pour améliorer l'efficacité de l'échange thermique entre les nervures et l'élément de base. Les nervures sont formées chacune pour comporter un certain nombre de portions (12a) qui s'étendent vers le haut depuis l'élément de base du puits à chaleur assemblé.
PCT/GB1996/001160 1995-05-16 1996-05-15 Puits a chaleur, et procede et systeme pour realiser ce puits WO1996036995A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8534631A JPH11505373A (ja) 1995-05-16 1996-05-15 ヒートシンクならびにその形成方法及びアセンブリ
AU56994/96A AU5699496A (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same
EP96915108A EP0826240A1 (fr) 1995-05-16 1996-05-15 Puits a chaleur, et procede et systeme pour realiser ce puits

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9509866.1A GB9509866D0 (en) 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same
GB9509866.1 1995-05-16

Publications (1)

Publication Number Publication Date
WO1996036995A1 true WO1996036995A1 (fr) 1996-11-21

Family

ID=10774528

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1996/001160 WO1996036995A1 (fr) 1995-05-16 1996-05-15 Puits a chaleur, et procede et systeme pour realiser ce puits

Country Status (6)

Country Link
EP (1) EP0826240A1 (fr)
JP (1) JPH11505373A (fr)
KR (1) KR19990014819A (fr)
AU (1) AU5699496A (fr)
GB (2) GB9509866D0 (fr)
WO (1) WO1996036995A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19700432A1 (de) * 1997-01-10 1998-07-16 Swg Metallverarbeitung Und Mon Verfahren zum Herstellen von Kühlkörpern sowie nach dem Verfahren hergestellte Kühlkörper

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2347206A (en) * 1998-12-18 2000-08-30 Alstom Uk Ltd Heatsink assembly
EP1328019A1 (fr) * 2002-01-10 2003-07-16 Wen-Chen Wei Dissipateur de chaleur avec une structure à feuille
DE102005007041A1 (de) * 2005-02-15 2006-08-17 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente oder dgl. Einrichtungen sowie Verfahren zu dessen Herstellung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502472A1 (de) * 1975-01-22 1976-07-29 Siemens Ag Kuehlkoerper zur kuehlung von thyristoren
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
EP0278240A2 (fr) * 1987-02-07 1988-08-17 Behr GmbH & Co. Radiateur, en particulier pour le refroidissement de composants électroniques
US5311928A (en) * 1993-06-28 1994-05-17 Marton Louis L Heat dissipator

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8700842D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
JP3122173B2 (ja) * 1990-11-09 2001-01-09 株式会社東芝 放熱器、放熱装置および放熱器の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502472A1 (de) * 1975-01-22 1976-07-29 Siemens Ag Kuehlkoerper zur kuehlung von thyristoren
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
EP0278240A2 (fr) * 1987-02-07 1988-08-17 Behr GmbH & Co. Radiateur, en particulier pour le refroidissement de composants électroniques
US5311928A (en) * 1993-06-28 1994-05-17 Marton Louis L Heat dissipator

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"furnace brazed forged heatsink of stacked fins", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 32, no. 2, July 1989 (1989-07-01), NEW YORK, pages 180 - 181, XP000033391 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19700432A1 (de) * 1997-01-10 1998-07-16 Swg Metallverarbeitung Und Mon Verfahren zum Herstellen von Kühlkörpern sowie nach dem Verfahren hergestellte Kühlkörper

Also Published As

Publication number Publication date
JPH11505373A (ja) 1999-05-18
KR19990014819A (ko) 1999-02-25
GB9509866D0 (en) 1995-07-12
GB9610170D0 (en) 1996-07-24
GB2300975A (en) 1996-11-20
EP0826240A1 (fr) 1998-03-04
AU5699496A (en) 1996-11-29

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