GB9509866D0 - A heatsink and a method and an assembly for forming the same - Google Patents

A heatsink and a method and an assembly for forming the same

Info

Publication number
GB9509866D0
GB9509866D0 GBGB9509866.1A GB9509866A GB9509866D0 GB 9509866 D0 GB9509866 D0 GB 9509866D0 GB 9509866 A GB9509866 A GB 9509866A GB 9509866 D0 GB9509866 D0 GB 9509866D0
Authority
GB
United Kingdom
Prior art keywords
heatsink
assembly
forming
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GBGB9509866.1A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermalloy Inc
Original Assignee
Thermalloy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermalloy Inc filed Critical Thermalloy Inc
Priority to GBGB9509866.1A priority Critical patent/GB9509866D0/en
Publication of GB9509866D0 publication Critical patent/GB9509866D0/en
Priority to AU56994/96A priority patent/AU5699496A/en
Priority to KR1019970708163A priority patent/KR19990014819A/en
Priority to EP96915108A priority patent/EP0826240A1/en
Priority to GB9610170A priority patent/GB2300975A/en
Priority to PCT/GB1996/001160 priority patent/WO1996036995A1/en
Priority to JP8534631A priority patent/JPH11505373A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GBGB9509866.1A 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same Pending GB9509866D0 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GBGB9509866.1A GB9509866D0 (en) 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same
AU56994/96A AU5699496A (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same
KR1019970708163A KR19990014819A (en) 1995-05-16 1996-05-15 Heat sink and assembly method
EP96915108A EP0826240A1 (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same
GB9610170A GB2300975A (en) 1995-05-16 1996-05-15 Heatsinks having fin members joined to a base
PCT/GB1996/001160 WO1996036995A1 (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same
JP8534631A JPH11505373A (en) 1995-05-16 1996-05-15 Heat sink, method of forming the same, and assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9509866.1A GB9509866D0 (en) 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same

Publications (1)

Publication Number Publication Date
GB9509866D0 true GB9509866D0 (en) 1995-07-12

Family

ID=10774528

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9509866.1A Pending GB9509866D0 (en) 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same
GB9610170A Withdrawn GB2300975A (en) 1995-05-16 1996-05-15 Heatsinks having fin members joined to a base

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB9610170A Withdrawn GB2300975A (en) 1995-05-16 1996-05-15 Heatsinks having fin members joined to a base

Country Status (6)

Country Link
EP (1) EP0826240A1 (en)
JP (1) JPH11505373A (en)
KR (1) KR19990014819A (en)
AU (1) AU5699496A (en)
GB (2) GB9509866D0 (en)
WO (1) WO1996036995A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19700432A1 (en) * 1997-01-10 1998-07-16 Swg Metallverarbeitung Und Mon Heat sink for electric and-or electronic component
GB2347206A (en) * 1998-12-18 2000-08-30 Alstom Uk Ltd Heatsink assembly
EP1328019A1 (en) * 2002-01-10 2003-07-16 Wen-Chen Wei Leaf piece structure for heat dissipater
DE102005007041A1 (en) * 2005-02-15 2006-08-17 Alcan Technology & Management Ag Heat sink for semiconductor devices or the like. Facilities and method for its preparation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502472C2 (en) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Heat sink for thyristors
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
GB8700842D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
DE3703873A1 (en) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr HEAT SINK, ESPECIALLY FOR COOLING ELECTRONIC COMPONENTS
JP3122173B2 (en) * 1990-11-09 2001-01-09 株式会社東芝 Heatsink, heatsink, and method of manufacturing heatsink
US5311928A (en) * 1993-06-28 1994-05-17 Marton Louis L Heat dissipator

Also Published As

Publication number Publication date
GB9610170D0 (en) 1996-07-24
EP0826240A1 (en) 1998-03-04
JPH11505373A (en) 1999-05-18
KR19990014819A (en) 1999-02-25
WO1996036995A1 (en) 1996-11-21
GB2300975A (en) 1996-11-20
AU5699496A (en) 1996-11-29

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Legal Events

Date Code Title Description
730 Substitution of applicants allowed (sect. 30/1977)