EP0826240A1 - Puits a chaleur, et procede et systeme pour realiser ce puits - Google Patents

Puits a chaleur, et procede et systeme pour realiser ce puits

Info

Publication number
EP0826240A1
EP0826240A1 EP96915108A EP96915108A EP0826240A1 EP 0826240 A1 EP0826240 A1 EP 0826240A1 EP 96915108 A EP96915108 A EP 96915108A EP 96915108 A EP96915108 A EP 96915108A EP 0826240 A1 EP0826240 A1 EP 0826240A1
Authority
EP
European Patent Office
Prior art keywords
fin
heatsink
portions
members
base member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96915108A
Other languages
German (de)
English (en)
Inventor
Robin Douglas Johnson
Francis Edward Fisher
William Dawson Jordan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy Ltd
Original Assignee
Redpoint Thermalloy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Redpoint Thermalloy Ltd filed Critical Redpoint Thermalloy Ltd
Publication of EP0826240A1 publication Critical patent/EP0826240A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heatsink and to a method and an assembly for forming the same.
  • the present invention particularly relates to a heatsink having a high fin member to spacing ratio, i.e. high fin members with small gaps therebetween.
  • a heatsink of this type is normally relatively large being designed to have optimum heat dissipating characteristics. It is generally formed from an extruded metal member having integrally formed fin members. The fin members can be machined thus enabling heatsinks with various arrangements of fins, etc. to be provided. However, the arrangement of fins is restricted by dimensional characteristics of the extruded member, for example fin member spacing, which are themselves limited by extrusion technology. The cost of the extruded member often accounts for a sizeable proportion of the total cost of a heatsink manufactured in this manner.
  • One object of the present invention is to provide a method of forming inexpensive heatsinks.
  • Another object of the invention is to provide heatsinks with excellent heat dissipating characteristics.
  • a heatsink assembled from a block-like base member and at least one generally planar fin member, said fin member comprising a plurality of fin portions, wherein said fin member is fixed to said base member such that at least the fin portions extend upwardly therefrom and the base member and the fin member are made of thermally conductive material.
  • the base member and the fin member are made of the same thermally conductive material.
  • the thermally conductive material is a metallic material.
  • the metallic material is aluminium.
  • the heatsink includes a plurality of spaced apart fin members.
  • pairs of adjacent fin members are preformed as "U"-shaped members which each comprise two generally coplanar fin members integrally joined by a base portion extending between lower edge portions thereof.
  • the fin members or "U"-shaped members are fixed to the base member by engaging the lower edge portions or base portions thereof in respective slots formed in a surface of the base member.
  • the ratio of the height of the fin members to the spacing therebetween is substantially greater than 1.
  • each fin member may be equally spaced.
  • the fin portions may be twisted to lie in respective planes angled with respect to a plane in which the fin member lies.
  • the fin portions may be twisted such that they extend outwardly from only one side of their respective fin member.
  • the fin portions may be formed to extend over a greater part of the height of their respective fin member.
  • the fin portions may be formed to extend to an upper edge of their respective fin member.
  • the fin members may each comprise portions displaced from the plane of the fin member which generally lie coplanar with the plane of the fin member.
  • the heatsink may be assembled such that corresponding fin portions of adjacent fin members are aligned in a transverse direction.
  • the corresponding fin portions of adjacent fin members may be staggered.
  • a method of assembling a heatsink comprising a block-like base member and at least one generally planar fin member, said fin member comprising a plurality of fin portions, wherein said fin member is fixed to said base member such that at least said fin portions extend upwardly therefrom and the base member and the fin member are made of thermally conductive material.
  • an assembly for forming a heatsink comprising a block-like base member and at least one generally planar fin member, said fin member comprising a plurality of fin portions, wherein said base member and said fin member are made of thermally conductive material.
  • Figure 1 is a plan view of a first embodiment of a heatsink in accordance with the invention.
  • Figure 2 is a section on line A-A of figure 1;
  • Figure 3 is a transverse sectional view of another embodiment of the invention.
  • Figure 4 is a partial end-on view of the embodiment of figure 3;
  • Figure 5 is a plan view of a further embodiment of the invention.
  • Figure 6 is a partial end-on view of the embodiment of figure 5;
  • Figure 7 is a plan view of yet another embodiment of the invention.
  • Figure 8 is a partial end-on view of the embodiment of figure 7;
  • Figure 9 is a partial end-on view of a still further embodiment of the invention:
  • Figure 10 is a plan view of a yet still further embodiment of the invention.
  • FIG 11 is a partial end-on view of the embodiment of figure 10.
  • a first embodiment of a heatsink 1 according to the present invention is illustrated in figures 1 and 2.
  • This comprises a block-like base member 10 made of a thermally conductive material to which are fixed a plurality of plate-like fin members 12 also made of a thermally conductive material.
  • Each fin member 12 comprises a plurality of fin portions 12a which, in this embodiment, are integral with a lower edge portion 12b of the fin member 12 which locates in a slot 14 (shown in broken outline in figure 2) in the base member 10.
  • the base member 10 and fin members 12 are preferably made of aluminium which exhibits good heat dissipating characteristics.
  • the present invention enables a heatsink 1 to be quickly assembled from a block of aluminium which is machined or extruded to have a plurality of longitudinally extending slots 14 into each of which a fin member 12 as described above is press-fitted.
  • the fin members 12 are formed by press-cutting from a sheet material and thus the form and size of the fin portions 12a is determined by the shape of the die used to cut the fin members 12.
  • the fin members 12 can, as in this embodiment, be identical to provide a heatsink 1 in which the fin portions 12a of adjacent fin members 12 are aligned across the width of the heatsink 1.
  • the fin members 12 are arranged to extend over a greater part of the height of their respective fin member 12 and can be formed to extend to adjacent a surface 16 of the block-like base member 10 when the fin members 12 are assembled with said base member 10.
  • the fin members 12 are arranged to be placed closely together to provide a heatsink 1 in which the ratio of the height of the fin portions 12a to gaps between the fin members 12 is substantially greater than 1.
  • the method of fixing the fin members 12 to the block-like base member 10 is by press- fitting without the use of soldering, brasing, etc. to ensure good thermal contact between the base member 10 and the fin members 12.
  • the fin members 12 can be fixed to the base member 10 by any suitable retaining method or means.
  • the base member 10 and the fin members 12 are made of the same thermally conductive material in order to avoid bi-metallic bending which can occur when the fin members and the base member are made of different metals.
  • the heatsink 1 formed with fin members 12 and a base member 10 of the same thermally conductive metallic material will have greater corrosion resistance over a heatsink 1 utilising different metals.
  • FIGS 3 and 4 show a second embodiment of the present invention in which the fin portions 12a comprise pressed- out portions of the fin member 12. These portions 12a extend coplanarly with the plane of their respective fin member 12 but spaced outwardly therefrom. Thus the airflow through the fin members 12 of the heatsink is disturbed by the pressed-out fin portions 12a but the total surface area available for heat dissipation is at a maximum since the fin portions 12a have not been formed, by removal of portions from the fin members 12 as in the first embodiment.
  • the fin portions 12a can be arranged in many different ways and further embodiments are illustrated by figures 5 and 6 and figures 7 and 8, respectively.
  • the fin portions 12a are twisted to extend outwardly from one side of their respective fin member 12.
  • the fin portions 12a are twisted so as to extend outwardly from both sides of their respective fin member 12.
  • FIG 9 and figures 10 and 11 Yet further embodiments of the invention are illustrated by figure 9 and figures 10 and 11, respectively.
  • adjacent fin members 12 are preformed as "U"-shaped members 13.
  • Each "U"-shaped member 13 comprises two fin members 12 arranged to be coplanar and integrally joined at their lower edges 12b by a base portion 13a extending therebetween.
  • the "U"-shaped members 13 can be press- fitted into respective slots 14 formed in the base member 10 or by any other suitable means. In the embodiment illustrated in figure 9, the "TJ"-shaped members 13 are secured in their respective slots 14 by means of wire-like wedge 15.
  • Each of the fin members 12 comprises a number of fin portions (not shown) in a like manner to the first embodiment of the invention.
  • Figures 10 and 11 show yet another embodiment of figure 9, employing "U"-shaped members 13.
  • the fin portions 12a of the fin members 12 are of a form similar to those of the embodiment of figures 7 and 8.
  • the "U"- shaped members 13 of the embodiments of figure 9 and figures 10 and 11, respectively can be formed with fin portions in accordance with any other embodiment of the invention.
  • One advantage of employing "U"-shaped members 13 rather than separate fin members 12 is that it is easier to automate the handling of the "U"-shaped members 13.
  • a further advantage is that said members have a larger area of contact with the base member when compared to the equivalent number of separate fin members. Thus the thermal contacts between the base member and the "U"-shaped members is more efficient.
  • a heatsink according to the present invention may be formed with fin members of an identical form or a combination of fin members having variously configured fin portions. This provides a very wide design freedom in arranging the pattern of fin portions across the width of the heatsink.
  • heatsinks can be designed with a fin portion formation which optimises the heat dissipating characteristics of a heatsink for a given application. This design freedom is achieved at little extra cost contrary to the situation encountered with known heatsink designs.
  • the present invention thus provides a heatsink having a structure and performance similar to that of the large sized expensive heatsinks machined from extruded members but at a substantially smaller cost.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un puits à chaleur (1) est constitué d'un élément de base (10) se présentant sous la forme d'un bloc obtenu par extrusion ou par usinage et d'un certain nombre de nervures planes (12). Les nervures peuvent comporter des éléments en forme de U. Les nervures sont fixées dans des fentes (14) formées dans l'élément de base et elles sont de préférence constituées du même matériau que l'élément de base pour améliorer l'efficacité de l'échange thermique entre les nervures et l'élément de base. Les nervures sont formées chacune pour comporter un certain nombre de portions (12a) qui s'étendent vers le haut depuis l'élément de base du puits à chaleur assemblé.
EP96915108A 1995-05-16 1996-05-15 Puits a chaleur, et procede et systeme pour realiser ce puits Withdrawn EP0826240A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB9509866.1A GB9509866D0 (en) 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same
GB9509866 1995-05-16
PCT/GB1996/001160 WO1996036995A1 (fr) 1995-05-16 1996-05-15 Puits a chaleur, et procede et systeme pour realiser ce puits

Publications (1)

Publication Number Publication Date
EP0826240A1 true EP0826240A1 (fr) 1998-03-04

Family

ID=10774528

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96915108A Withdrawn EP0826240A1 (fr) 1995-05-16 1996-05-15 Puits a chaleur, et procede et systeme pour realiser ce puits

Country Status (6)

Country Link
EP (1) EP0826240A1 (fr)
JP (1) JPH11505373A (fr)
KR (1) KR19990014819A (fr)
AU (1) AU5699496A (fr)
GB (2) GB9509866D0 (fr)
WO (1) WO1996036995A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19700432A1 (de) * 1997-01-10 1998-07-16 Swg Metallverarbeitung Und Mon Verfahren zum Herstellen von Kühlkörpern sowie nach dem Verfahren hergestellte Kühlkörper
GB2347206A (en) * 1998-12-18 2000-08-30 Alstom Uk Ltd Heatsink assembly
EP1328019A1 (fr) * 2002-01-10 2003-07-16 Wen-Chen Wei Dissipateur de chaleur avec une structure à feuille
DE102005007041A1 (de) * 2005-02-15 2006-08-17 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente oder dgl. Einrichtungen sowie Verfahren zu dessen Herstellung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502472C2 (de) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Kühlkörper für Thyristoren
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
GB8700842D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
DE3703873A1 (de) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr Kuehlkoerper, insbesondere zum kuehlen elektronischer bauelemente
JP3122173B2 (ja) * 1990-11-09 2001-01-09 株式会社東芝 放熱器、放熱装置および放熱器の製造方法
US5311928A (en) * 1993-06-28 1994-05-17 Marton Louis L Heat dissipator

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9636995A1 *

Also Published As

Publication number Publication date
KR19990014819A (ko) 1999-02-25
JPH11505373A (ja) 1999-05-18
GB2300975A (en) 1996-11-20
AU5699496A (en) 1996-11-29
WO1996036995A1 (fr) 1996-11-21
GB9610170D0 (en) 1996-07-24
GB9509866D0 (en) 1995-07-12

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