WO1996025672A1 - Structure de contact d'un automate programmable pour installation d'essai de circuits integres - Google Patents

Structure de contact d'un automate programmable pour installation d'essai de circuits integres Download PDF

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Publication number
WO1996025672A1
WO1996025672A1 PCT/JP1996/000318 JP9600318W WO9625672A1 WO 1996025672 A1 WO1996025672 A1 WO 1996025672A1 JP 9600318 W JP9600318 W JP 9600318W WO 9625672 A1 WO9625672 A1 WO 9625672A1
Authority
WO
WIPO (PCT)
Prior art keywords
roof
carrier
contact
socket
opening
Prior art date
Application number
PCT/JP1996/000318
Other languages
English (en)
Japanese (ja)
Inventor
Hiroshi Okuda
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to KR1019960705678A priority Critical patent/KR970702497A/ko
Publication of WO1996025672A1 publication Critical patent/WO1996025672A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Definitions

  • the present invention relates to a structure of a contact portion of an IC device to be measured in a self-weight drop type handler for an IC test device.
  • FIG. 5 shows a relationship structure diagram of a carrier and a roof of a change kit portion according to the prior art.
  • FIG. 6 is a side sectional view of connecting an IC device in a carrier to an IC socket B in a test head portion.
  • Fig. 3 is a front view of the IC socket.
  • the TSOP type has connector terminals 23 arranged on both sides of the roof escape groove 21 and has IC leads in two directions. This is an example for 2 / S0P knockout.
  • the carrier 3 containing the IC chip 4 from the top of the change kit section 18 slides between the rail 5 and the roof by its own weight. Stop at the contact position of test head section 13 by the stove. Next, it is moved to the socket side together with the roof C17 while being guided by the guide post 19, and the lead terminal force of the IC device 4; the connector of the IC socket B15 Contact the contact bin 16 (electrical contact). This is followed by an electrical test of the device. After carrying out the test, it is moved to its original position and then transported downward. By sequentially performing this, a large number of devices under test are tested.
  • the structure of the roof C17 of the changeover kit section 18 is as shown in FIGS. 5 and 6.
  • the center part 20 of the roof was necessary to hold Carrier 3.
  • a depth from the socket bottom surface 12 of the IC socket B 15 to the contact bin 16 is required.
  • a situation has arisen in which a roof escape groove 21 cannot be provided as in the prior art.
  • lead terminals 22 are formed in four directions like QFF structure, and lead terminals 22 in the form of a lattice on the terminal surface of IC device 4 with PGA structure.
  • the problem is that the center part 20 of the roof is an obstacle and the contact pin 16 for measurement cannot be in contact with the lead terminal 22. I had it.
  • the problem to be solved by the present invention is that the configuration of the lead terminal of the IC device is in four directions or a grid like QFF or PG ⁇ , and the contact side is thin.
  • An object of the present invention is to realize a structure in which a contact for measurement can be obtained without any trouble by making it applicable to an IC socket. Disclosure of the invention
  • the gap to be slid and dropped in accordance with the dimensions of the carrier 3 is 9
  • the roof connection part 7, the roof A 1, the roof B 2, and the rail 5, which support the carrier 3, and the contact between the corresponding IC socket and the IC device 4 are provided.
  • the roof A1 and the roof B2 having the opening 8 structure that does not interfere with the roof A1 and the roof B2 are provided.
  • the carrier 3 containing the IC diode 4 and the contact IC socket on the test head section 13 side are provided.
  • the structure of the contact part that connects (3) to the IC socket is realized.
  • FIG. 8 shows a structure in which a buffer means according to the present invention is added. That is, in addition to the above solution, the lateral posture of the carrier 3 is guided, and a buffer is provided on the rear surface of the rail in order to buffer a collision when the carrier 3 is engaged with the connector side.
  • the contact structure for the IC test apparatus is as follows. And That is, (1) there is a roof having rails and predetermined portions that form a predetermined width, height, and gap for dropping a carrier containing an IC device in a dropping direction of the IC device. (2) The central part of the roof, which is necessary to hold the carrier holding the IC device in the falling position and to separate the carrier from the IC socket after the measurement is completed, is connected to the upper roof A.
  • the opening was provided by dividing the roof into two parts, the lower roof B.
  • the roof B is provided with a guide taper so that the carrier falls to a predetermined position.
  • the roof center is divided into two parts.
  • the lower end of the carrier should be aligned with the carrier so that it overlaps the roof B, and can be used with thin IC devices, QFP or PGA, etc.
  • the structure allows contact. That is, the roof A 1 and the roof B 2 are H-type IC sockets and other IC sockets. By adopting a dimensional structure that does not hinder contact at the time of contact, and a length that supports the carrier 3, it can be used with devices of any package. Become.
  • the panel 3 is mounted on the back of the rail to guide the carrier 3 in the ⁇ direction and to prevent the carrier 3 from hitting when mated with the contact. 8 and carrier retainer 2 7 are added to provide contact buffering
  • FIG. 1 is a side sectional view of an embodiment according to the present invention.
  • FIG. 2 is a front view of an embodiment according to the present invention.
  • FIG. 3 is an example of a front view of a conventional IC socket.
  • FIG. 4 is a front view showing the concept that the present invention can be applied to a QFP type or the like by the opening of the roof according to the present invention.
  • FIG. 5 is a front view of a conventional change kit section.
  • Figure 6 shows the conventional technology! : It is a cross-sectional view of the connector and the IC socket.
  • FIG. 7 is a structural diagram of an H-type IC socket that can be used in the present invention and has an opening at the upper and lower centers.
  • Figure 8 (a) is a, co te click key Ya Li ⁇ retainer 2 7 side sectional view of a cushioning structure obtained by adding the Ri per during slot of the present invention c
  • FIG. 8B is an upper cross-sectional view of the carrier retainer 27 of the present invention to which a buffer structure at the time of contact is added.
  • FIG. 4 is a conceptual diagram showing that the measurement of the QFP or PGA structure is within the range of the opening.
  • the IC socket corresponding to the structure of this protruding example is a structure corresponding to a socket called an H-shaped socket, and has a structure in which the center is opened at the top and bottom as shown in FIG.
  • the carrier 3 is supported by the roof A1 and the roof B2 as shown in Fig. 2.
  • Carrier 3 falls through the gap between rail 5 and roof A1, and stops at the position of opening 8 where contact is made by stopper 1 ⁇ .
  • a guide is provided on the lower roof B 2.
  • Detaper 11 is provided. Also, since one side is open, there is a drawing inside the carrier 3 that supports and secures the upper and lower parts of the IC and the package to hold the IC device 4. In this way, it is moved to the contact side so that it does not easily fall out of the carrier container at the time of lifting.
  • the roof A1, roof B2, and rail 5 move quickly to the contact side while holding the carrier 3 at high speed, and the corresponding IC socket Contact with After the electrical test, after returning to the original position, the stones and 10 are removed and transported downward.
  • the parts that depend on the package shape of the device are structural parts.
  • it has a replacement kit (chip x kit) structure so that it can be easily replaced.
  • the carrier 3 containing the IC device 4 has a predetermined width and height for properly dropping in the IC device drop direction 6.
  • the roof was divided into an upper roof A 1 and a lower roof B 2.
  • the roof escape groove 21 in the IC socket B 15 it is not necessary to provide the roof escape groove 21 in the IC socket B 15 according to the prior art as shown in FIG. I did.
  • a contact structure that can easily handle a thin contact structure was realized.
  • the provision of the opening 8 in the roof eliminates the need for the roof escape groove 21 on the IC socket # 15 side.
  • FIG. 8 (b) shows. In this case, in order to provide the carrier retainer 27 on the back of the rail 26, guide the carrier 3 to the rail 26 as shown in FIG. 8 (b).
  • the carrier presser 27 top 27 a force; socket
  • the structure is such that a structure is added in which even if it comes into contact with the side vessel, it is buffered by the spring 28, and the carrier 3 is kept in a stable contact state.
  • the force corresponding to the length of the carrier 3 supported by the roof A1 and the roof B2 corresponding to the socket; and, if desired, the support of the roof A1 and the roof B2.
  • Length of the I-type IC socket other than the H-type IC socket. A length corresponding to the C socket and a length supporting the carrier 3 may be used.
  • the present invention is configured as described above, and has the following effects.
  • Carrier in which the IC device is housed retains its posture when dropped by its own weight, and is used for testing.
  • the roof has an opening at the roof that functions to separate it from the IC socket provided on the side of the device. This eliminates the need to form a roof escape groove in the IC socket. As a result, it has become possible to realize a contact structure that can be easily connected to a thin IC socket.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Chutes (AREA)

Abstract

Structure de contact d'un automate programmable du type à chute par gravité, facilitant la manipulation de dispositifs à circuits intégrés minces et des prises à mesurer. A cet effet, un intervalle (9) dont la largeur correspond aux dimensions d'un support (3) logeant un dispositif à circuits intégrés (4) est constitué entre une pièce (7) reliée à une partie supérieure et un rail. Ledit support (3) est guidé dans l'intervalle (9), de sorte que le dispositif (3) chute et glisse vers le bas jusqu'à une position de contact. Par ailleurs, une ouverture (8) est pratiquée dans la pièce (7) servant de liaison avec la partie supérieure au niveau de la position de contact, ouverture (8) dont les côtés supérieurs et inférieurs deviennent respectivement les parties supérieures A (1) et B (2), de manière à ce que le support (3) repose sur les parties supérieures A (1) et B (2) et que le contact de la prise du circuit intégré avec le dispositif à circuits intégrés s'établisse au niveau de la position de contact.
PCT/JP1996/000318 1995-02-14 1996-02-14 Structure de contact d'un automate programmable pour installation d'essai de circuits integres WO1996025672A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960705678A KR970702497A (ko) 1995-02-14 1996-02-14 Ic 시험장치용 핸들러의 콘택트구조(contact structure of handler for ic test device)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7/49049 1995-02-14
JP7049049A JPH08220189A (ja) 1995-02-14 1995-02-14 Ｉｃ試験装置用ハンドラのコンタクト構造

Publications (1)

Publication Number Publication Date
WO1996025672A1 true WO1996025672A1 (fr) 1996-08-22

Family

ID=12820235

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1996/000318 WO1996025672A1 (fr) 1995-02-14 1996-02-14 Structure de contact d'un automate programmable pour installation d'essai de circuits integres

Country Status (4)

Country Link
JP (1) JPH08220189A (fr)
KR (1) KR970702497A (fr)
CN (1) CN1141434A (fr)
WO (1) WO1996025672A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3668595B2 (ja) * 1997-07-25 2005-07-06 アルプス電気株式会社 接点構造
CN109648495B (zh) * 2018-12-29 2020-10-23 王和 一种二极管性能检测设备上的定位导轨结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622172A (ja) * 1985-06-28 1987-01-08 Kokusai Electric Co Ltd Ｉｃハンドラの測定部
JPH03200079A (ja) * 1989-12-28 1991-09-02 Hitachi Ltd 半導体装置用キャリア及びハンドラ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622172A (ja) * 1985-06-28 1987-01-08 Kokusai Electric Co Ltd Ｉｃハンドラの測定部
JPH03200079A (ja) * 1989-12-28 1991-09-02 Hitachi Ltd 半導体装置用キャリア及びハンドラ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CD-ROM OF THE SPECIFICATION AND DRAWINGS ANNEXED TO THE WRITTEN APPLICATION OF JAPANESE UTILITY MODEL, Application No. 94449/1991 (Laid-Open No. 12917/1993) (ADVANTEST CORP.), (18-06-93). *

Also Published As

Publication number Publication date
KR970702497A (ko) 1997-05-13
CN1141434A (zh) 1997-01-29
JPH08220189A (ja) 1996-08-30

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