WO1996024158A1 - Composition pour le nettoyage de surfaces dures - Google Patents
Composition pour le nettoyage de surfaces dures Download PDFInfo
- Publication number
- WO1996024158A1 WO1996024158A1 PCT/RU1996/000030 RU9600030W WO9624158A1 WO 1996024158 A1 WO1996024158 A1 WO 1996024158A1 RU 9600030 W RU9600030 W RU 9600030W WO 9624158 A1 WO9624158 A1 WO 9624158A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- water
- compound
- differing
- anhydride
- calculation
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 title abstract description 6
- 238000004140 cleaning Methods 0.000 title abstract 3
- 239000007787 solid Substances 0.000 title abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003989 dielectric material Substances 0.000 claims abstract description 3
- 238000004364 calculation method Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 4
- VJLYUPQRMYUUNS-UHFFFAOYSA-N sulfamoyl sulfamate Chemical compound NS(=O)(=O)OS(N)(=O)=O VJLYUPQRMYUUNS-UHFFFAOYSA-N 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 235000019504 cigarettes Nutrition 0.000 claims 1
- 229910021653 sulphate ion Inorganic materials 0.000 claims 1
- 239000000356 contaminant Substances 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract description 2
- VTNBTUFKJGHHSM-UHFFFAOYSA-N 2,5-dioxofuran-3-sulfonic acid Chemical compound OS(=O)(=O)C1=CC(=O)OC1=O VTNBTUFKJGHHSM-UHFFFAOYSA-N 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 3
- 238000012993 chemical processing Methods 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 231100000086 high toxicity Toxicity 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 241001573881 Corolla Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000000645 desinfectant Substances 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000013505 freshwater Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010423 industrial mineral Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000968 medical method and process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229930192033 plastin Natural products 0.000 description 1
- 108010049148 plastin Proteins 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Inorganic materials O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C11D2111/22—
Definitions
- ⁇ ed ⁇ s ⁇ a ⁇ m is ⁇ lzuem ⁇ g ⁇ s ⁇ s ⁇ ava yavlyae ⁇ sya eg ⁇ vys ⁇ - ⁇ aya ⁇ sichn ⁇ s ⁇ , ⁇ me ⁇ g ⁇ s ⁇ s ⁇ av s ⁇ li m ⁇ zhe ⁇ by ⁇ is ⁇ ch- ni ⁇ m zag ⁇ yazneniya ⁇ lu ⁇ v ⁇ dni ⁇ v ⁇ y ⁇ ve ⁇ n ⁇ s ⁇ i i ⁇ nami Me- ⁇ all ⁇ v, ch ⁇ in sv ⁇ yu ⁇ che ⁇ ed ⁇ itsa ⁇ eln ⁇ vliyae ⁇ on ele ⁇ i- ches ⁇ ie ⁇ a ⁇ ame ⁇ y ⁇ ib ⁇ v / I I.
- Compounds containing circulatory compounds taken from the group texotoxysilane and dimethylsilane, as well as a mixture of 121, were also known. Its low cost
- the task posed is achieved by the proposed composition, including sulfamic anhydride in the amount of active ingredient in the amount of 0.1-70.0 wt. % and the manufacturer - the rest.
- the manufacturer uses either water or a fresh water source.
- C ⁇ Sulfuric anhydride (C ⁇ ), which is an organic compound, is produced by the interaction of maleic anhydride with sulfur dioxide.
- C ⁇ is a non-toxic compound.
- Source materials for the plant are water (G ⁇ S ⁇ ).
- the appliance provides a convenient, oily yellow liquid, non-toxic (4th class of safety), without safety.
- the appliance is supplied with the following: the ingredients are weighted and then connected to the appliance and the appliance is attached to the food After this is ready for use.
- the method of calculating solidity (General method) The finished product is poured into the bath and heated to a temperature of 60-80 ° C. The plates are placed in the cassette for chemical processing and with the help of the owner are released into the system for the payment of remittances.
- the processing time of the plate is 10-15 minutes. At the end of this time, the cassette with the plates is removed from the bathtub, washed in disinfected water and the temperature - 4 -
- a rinse-off wash 60-80 ° C for 5 minutes, and then in the bathtub, a rinse-off wash, a disinfectant water outlet, the output of water at the outlet of the bath reaches at least 10. For example, 1.
- aqueous solution containing 2% ⁇ is poured into the bath and heated to a temperature of 70 ° ⁇ .
- the plates are placed in the cassette for chemical processing and with the help of a distributor are released into the circuits for the payment of transfers.
- the processing time of the plates is 15 minutes.
- the plates are removed from the bathtub, washed out with deionized water at 70 ° C for 5 minutes with a subsequent cascade of cleaned waste water. The results are calculated in the table.
- the proposed structure makes it possible to efficiently clean up the contaminants. With this, a significant decrease in the yield of active components and discharges may be caused by a non-efficient medium.
- this product which is a matter of concern. For this reason, the devices themselves and the technology of their use are absolutely safe, the devices do not annoy the skin, slimy cases. Disposal from industrial equipment and the processing of metal, metal processing is neutral.
- Unive ⁇ saln ⁇ s ⁇ ⁇ as ⁇ v ⁇ a dae ⁇ v ⁇ z- m ⁇ zhn ⁇ s ⁇ is ⁇ l ⁇ z ⁇ va ⁇ i ⁇ in lyuby ⁇ ⁇ aslya ⁇ ⁇ myshlenn ⁇ s ⁇ i (mashin ⁇ s ⁇ enii, medicine, and ⁇ adi ⁇ e ⁇ ni ⁇ e ⁇ .d.), where ⁇ dg ⁇ v ⁇ i chis ⁇ ⁇ ve ⁇ n ⁇ s ⁇ ey is ⁇ lzuyu ⁇ sya b ⁇ lshie ⁇ bemy mine ⁇ alny ⁇ ⁇ isl ⁇ .
Abstract
Cette invention concerne une nouvelle composition pour le nettoyage des surfaces dures, notamment les surfaces de plaques et de matériaux diélectriques et semi-conducteurs ayant subis une contamination ionique, les surfaces de métaux utilisés dans la production de divers types de composants semi-conducteurs, ainsi que les circuits intégrés. Cette composition se présente sous la forme d'une solution aqueuse d'anhydride sulfo-maléique ou d'une composition aqueuse contenant de l'alcool et une proportion d'anhydride sulfo-maléique variant entre 0,1 et 70, 0 % en poids.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU95101393 | 1995-02-03 | ||
RU9595101393A RU2052868C1 (ru) | 1995-02-03 | 1995-02-03 | Состав раствора для очистки поверхности (типа "полифункционал") |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996024158A1 true WO1996024158A1 (fr) | 1996-08-08 |
Family
ID=20164422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/RU1996/000030 WO1996024158A1 (fr) | 1995-02-03 | 1996-02-02 | Composition pour le nettoyage de surfaces dures |
Country Status (2)
Country | Link |
---|---|
RU (1) | RU2052868C1 (fr) |
WO (1) | WO1996024158A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001031696A1 (fr) * | 1999-10-29 | 2001-05-03 | Tadeusz Bugalski | Composition destinee a l'elimination chimique des ions metalliques et atomes adsorbes des surfaces |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4339340A (en) * | 1975-11-26 | 1982-07-13 | Tokyo Shibaura Electric Co., Ltd. | Surface-treating agent adapted for intermediate products of a semiconductor device |
DE3822350A1 (de) * | 1988-07-01 | 1990-01-04 | Siemens Ag | Verfahren zum entfernen von metall-verunreinigungen auf halbleiterkristalloberflaechen |
EP0501492A2 (fr) * | 1991-02-27 | 1992-09-02 | OKMETIC Oyj | Méthode pour le nettoyage de produits semi-conducteurs |
EP0561236A1 (fr) * | 1992-03-06 | 1993-09-22 | Nissan Chemical Industries Ltd. | Composition aqueuse à base d'ammoniaque pour le nettoyage de substrats semi-conducteurs |
EP0690483A2 (fr) * | 1994-06-23 | 1996-01-03 | MALLINCKRODT BAKER, Inc. | Procédé de nettoyage de la contamination métallique de substrats conservant la planéité desdits substrats |
-
1995
- 1995-02-03 RU RU9595101393A patent/RU2052868C1/ru active
-
1996
- 1996-02-02 WO PCT/RU1996/000030 patent/WO1996024158A1/fr active Search and Examination
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4339340A (en) * | 1975-11-26 | 1982-07-13 | Tokyo Shibaura Electric Co., Ltd. | Surface-treating agent adapted for intermediate products of a semiconductor device |
DE3822350A1 (de) * | 1988-07-01 | 1990-01-04 | Siemens Ag | Verfahren zum entfernen von metall-verunreinigungen auf halbleiterkristalloberflaechen |
EP0501492A2 (fr) * | 1991-02-27 | 1992-09-02 | OKMETIC Oyj | Méthode pour le nettoyage de produits semi-conducteurs |
EP0561236A1 (fr) * | 1992-03-06 | 1993-09-22 | Nissan Chemical Industries Ltd. | Composition aqueuse à base d'ammoniaque pour le nettoyage de substrats semi-conducteurs |
EP0690483A2 (fr) * | 1994-06-23 | 1996-01-03 | MALLINCKRODT BAKER, Inc. | Procédé de nettoyage de la contamination métallique de substrats conservant la planéité desdits substrats |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001031696A1 (fr) * | 1999-10-29 | 2001-05-03 | Tadeusz Bugalski | Composition destinee a l'elimination chimique des ions metalliques et atomes adsorbes des surfaces |
Also Published As
Publication number | Publication date |
---|---|
RU95101393A (ru) | 1997-01-20 |
RU2052868C1 (ru) | 1996-01-20 |
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